Mechanisms of enhanced thermal stability of polarization in lead-free 
(Bi1/2Na1/2)0.94Ba0.06TiO3
/ZnO ceramic composites

Multi-scale thermal stability of (K,Na)NbO3-based perovskites with a high d33 of 430 pC N−1 is investigated, revealing the origin of its large piezoelectricity.

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Thermal stability of lead-free CH 3 NH 3 Sn x I 3 systems (0.9 ≤ x ≤ 1.1) for photovoltaics

Materials Science in Semiconductor Processing ◽

10.1016/j.mssp.2017.06.012 ◽

2017 ◽

Vol 68 ◽

pp. 152-158 ◽

Cited By ~ 6

Author(s):

L. Dimesso ◽

C. Fasel ◽

K. Lakus-Wollny ◽

T. Mayer ◽

W. Jaegermann

Keyword(s):

Thermal Stability ◽

Lead Free ◽

Thermal Stability Of

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Enhanced thermal stability of piezoelectricity in lead-free (Ba,Ca)(Ti,Zr)O3 systems through tailoring phase transition behavior

Ceramics International ◽

10.1016/j.ceramint.2019.02.085 ◽

2019 ◽

Vol 45 (8) ◽

pp. 10304-10309 ◽

Cited By ~ 4

Author(s):

Mengye Yin ◽

Chao Zhou ◽

Shuai Ren ◽

Yanshuang Hao ◽

Minxia Fang ◽

...

Keyword(s):

Phase Transition ◽

Thermal Stability ◽

Lead Free ◽

Phase Transition Behavior ◽

Transition Behavior ◽

Thermal Stability Of

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Thermal Stability of TiN Coated Cubic Boron Nitride Powder

Materials ◽

10.3390/ma14071642 ◽

2021 ◽

Vol 14 (7) ◽

pp. 1642

Author(s):

Benjamin Hering ◽

Anne-Kathrin Wolfrum ◽

Tim Gestrich ◽

Mathias Herrmann

Keyword(s):

Thermal Stability ◽

Boron Nitride ◽

Cubic Boron Nitride ◽

Atomic Layer ◽

Normal Pressure ◽

Ceramic Composites ◽

Recrystallization Process ◽

Layer Deposition ◽

Boron Nitride Powder ◽

Thermal Stability Of

Wear-resistant, super hard ceramic composites based on cubic boron nitride (cBN) are of great interest to industry. However, cBN is metastable under sintering conditions at normal pressure and converts into the soft hexagonal BN (hBN). Therefore, efforts are being made to avoid this process. Besides short sintering times, the use of coated cBN-particles is a way to minimize this process. Therefore, the thermal stability of TiN coated cBN powders in high purity argon and nitrogen atmospheres up to temperatures of 1600 °C was investigated by thermogravimetry, X-ray phase analysis, scanning electron microscopy and Raman spectroscopy. The TiN coating was prepared by the atomic layer deposition (ALD)-method. The investigations showed that the TiN layer reacts in Ar at T ≥ 1200 °C with the cBN and forms a porous TiB2 layer. No reaction takes place in nitrogen up to temperatures of 1600 °C. Nevertheless, the 20 and 50 nm thin coatings also undergo a recrystallization process during heat treatment up to temperatures of 1600 °C.

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Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt

Soldering & Surface Mount Technology ◽

10.1108/ssmt-10-2016-0027 ◽

2017 ◽

Vol 29 (1) ◽

pp. 49-53 ◽

Cited By ~ 4

Author(s):

Martin Durisin ◽

Alena Pietrikova ◽

Juraj Durisin ◽

Karel Saksl

Keyword(s):

Thermal Stability ◽

Rapid Solidification ◽

Melt Spinning ◽

Lead Free ◽

Content Type ◽

Intermetallic Particles ◽

Lead Free Solders ◽

Practical Implications ◽

Thermal Stability Of ◽

Melt Spinning Technique

Purpose The paper aims to investigate the structure and thermal stability of newly developed lead-free Sn-based alloys which can be used as novel materials in the soldering of electronic components. Design/methodology/approach Rapid solidification was used to prepare the alloys. Findings The results showed that the microstructure of these solders exhibited uniform distribution and small-sized intermetallic compounds. Also, smaller crystalline size can be expected compared to commercially available counterparts. The analyses revealed a uniform and homogenous distribution of the small intermetallic particles of Cu6Sn5 and Ag4Sn in the microstructure of solders. The practical implications mean an improvement in mechanical properties and thermal stability of such solder joints, which is a precondition of low mechanical, thermo-mechanical stresses in their structure. Originality/value The originality lies in the production of these alloys by the melt spinning technique which was not previously used in the electronics industry.

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Effect of ZnO on (ferroelectric) fatigue retention and thermal stability of ferroelectric properties in lead free (K0.5Na0.5)(Nb0.7Ta0.3)O3 ceramics

RSC Advances ◽

10.1039/c9ra06526a ◽

2019 ◽

Vol 9 (60) ◽

pp. 34888-34895

Author(s):

Vineetha P ◽

Roshan Jose ◽

K. Venkata Saravanan

Keyword(s):

Thermal Stability ◽

Solid State ◽

Solid State Reaction ◽

Ferroelectric Properties ◽

Solid State Reaction Method ◽

Lead Free ◽

Reaction Method ◽

Thermal Stability Of

This work investigates and reports the effect of ZnO addition on the ferroelectric properties of (K0.5Na0.5)(Nb0.7Ta0.3)O3 (KNNT) ceramics prepared by a solid state reaction method.

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