Polyimide complexes with high dielectric performance: toward polymer film capacitor applications

2016 ◽  
Vol 4 (27) ◽  
pp. 6452-6456 ◽  
Author(s):  
Xinwen Peng ◽  
Wenhui Xu ◽  
Linlin Chen ◽  
Yichun Ding ◽  
Shuiliang Chen ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Polymer Film ◽  
Copper Complexes ◽  
Mechanical And Thermal Properties ◽  
Film Capacitor ◽  
Dielectric Performance ◽  
High Dielectric ◽  
Diamine Monomer

Novel polyimide–copper complexes (PICuCs) were prepared by polymerization, complexation and imidization of a newly synthesized bipyridine-containing diamine monomer. They showed high dielectric performance, and excellent mechanical and thermal properties.

Development of high dielectric polyimides containing bipyridine units for polymer film capacitor

2016 ◽  
Vol 106 ◽  
pp. 93-98 ◽  
Author(s):  
Xinwen Peng ◽  
Wenhui Xu ◽  
Linlin Chen ◽  
Yichun Ding ◽  
Tianrou Xiong ◽  
...  
Keyword(s):  
Polymer Film ◽  
Film Capacitor ◽  
High Dielectric

scholarly journals Dielectric, mechanical and thermal properties of all-organic PI/PSF composite films by in situ polymerization

e-Polymers ◽  
2020 ◽  
Vol 20 (1) ◽  
pp. 226-232 ◽  
Author(s):  
Peng Li ◽  
Jiajun Yu ◽  
Shaohua Jiang ◽  
Hong Fang ◽  
Kunming Liu ◽  
...  
Keyword(s):  
Thermal Properties ◽  
In Situ Polymerization ◽  
Composite Films ◽  
Dielectric Materials ◽  
Mechanical Analysis ◽  
Dielectric Measurement ◽  
Mechanical And Thermal Properties ◽  
High Dielectric Materials ◽  
High Dielectric

AbstractAll-organic high dielectric materials are highly required in the field of modern electronic industry and energy storage. In this work, all-organic polyimide/polysulfone composite films with different amounts of PSF (PI/PSF-X) were prepared by in situ polymerization followed by film casting and thermal treatment. The dielectric, mechanical and thermal properties of these PI/PSF-X composite films are characterized by dielectric measurement, tensile test, thermogravimetric analysis and dynamic mechanical analysis. The results suggest that the PI/PSF-X composite films have good dielectric properties, good mechanical properties and excellent thermal properties, which are suitable for applications in electronic devices in harsh environments, especially in high-temperature environments.

Electron microscopy studies of PZT ferroelectric film capacitor structures

1992 ◽  
Vol 50 (2) ◽  
pp. 1364-1365
Author(s):  
V. Kaushik ◽  
P. Maniar ◽  
J. Olowolafe ◽  
R. Jones ◽  
A. Campbell ◽  
...  
Keyword(s):  
Electric Fields ◽  
Sol Gel ◽  
Ferroelectric Material ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Lead Zirconium Titanate ◽  
Si Substrate ◽  
Film Capacitor ◽  
Pzt Films ◽  
High Dielectric

Lead zirconium titanate films (Pb (Zr,Ti) O3 or PZT) are being considered for potential application as dielectric films in memory technology due to their high dielectric constants. PZT is a ferroelectric material which shows spontaneous polarizability, reversible under applied electric fields. We report herein some results of TEM studies on thin film capacitor structures containing PZT films with platinum-titanium electrodes.The wafers had a stacked structure consisting of PZT/Pt/Ti/SiO2/Si substrate as shown in Figure 1. Platinum acts as electrode material and titanium is used to overcome the problem of platinum adhesion to the oxide layer. The PZT (0/20/80) films were deposited using a sol-gel method and the structure was annealed at 650°C and 800°C for 30 min in an oxygen ambient. XTEM imaging was done at 200KV with the electron beam parallel to <110> zone axis of silicon.Figure 2 shows the PZT and Pt layers only, since the structure had a tendency to peel off at the Ti-Pt interface during TEM sample preparation.

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