scholarly journals Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

RSC Advances ◽  
2017 ◽  
Vol 7 (67) ◽  
pp. 42047-42055 ◽  
Author(s):  
QiHong Fang ◽  
Qiong Wang ◽  
Jia Li ◽  
Xin Zeng ◽  
YouWen Liu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Material Removal ◽  
High Speed ◽  
Subsurface Damage ◽  
Dynamics Simulation ◽  
Grinding Process ◽  
Grinding Processes ◽  
High Speed Grinding

Molecular dynamics simulation of Ni/Cu multilayers under grinding process with a diamond tip is performed, with the aim of investigating the subsurface damage and material removal in Ni/Cu multilayers.

scholarly journals Molecular dynamics simulation of high-speed loading of 2D boron nitride

2021 ◽  
Vol 11 (1) ◽  
pp. 79-83
Author(s):  
Igor Shepelev ◽  
Sergey Dmitriev ◽  
Elena Korznikova
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Boron Nitride ◽  
High Speed ◽  
Dynamics Simulation
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