Subsurface damage and material removal of Al–Si bilayers under high-speed grinding using molecular dynamics (MD) simulation

2019 ◽  
Vol 125 (8) ◽  
Author(s):  
Qiong Wang ◽  
Qihong Fang ◽  
Jia Li ◽  
Yuanyuan Tian ◽  
Youwen Liu
Keyword(s):  
Molecular Dynamics ◽  
Material Removal ◽  
High Speed ◽  
Md Simulation ◽  
Subsurface Damage ◽  
High Speed Grinding

scholarly journals Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

RSC Advances ◽  
2017 ◽  
Vol 7 (67) ◽  
pp. 42047-42055 ◽  
Author(s):  
QiHong Fang ◽  
Qiong Wang ◽  
Jia Li ◽  
Xin Zeng ◽  
YouWen Liu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Material Removal ◽  
High Speed ◽  
Subsurface Damage ◽  
Dynamics Simulation ◽  
Grinding Process ◽  
Grinding Processes ◽  
High Speed Grinding

Molecular dynamics simulation of Ni/Cu multilayers under grinding process with a diamond tip is performed, with the aim of investigating the subsurface damage and material removal in Ni/Cu multilayers.

Temperatures in High Speed Grinding of TC4 with a Vitrified CBN Wheel

2011 ◽  
Vol 188 ◽  
pp. 134-138
Author(s):  
X.H. Yu ◽  
Guo Qin Huang ◽  
Cong Fu Fang ◽  
Hui Huang ◽  
H. Guo ◽  
...  
Keyword(s):  
Titanium Alloy ◽  
Material Removal ◽  
High Speed ◽  
Cbn Wheel ◽  
Grinding Speed ◽  
Grinding Parameters ◽  
High Speed Grinding ◽  
Speed Up ◽  
Vitrified Cbn Wheel ◽  
Vitrified Cbn

An investigation is reported on the temperature in grinding of titanium alloy (TC4) by using a vitrified CBN wheel at grinding speed up to 120m/s. The temperatures under different grinding parameters were measured by using a sandwiched foil thermocouple. Coupled with the SEM observations on the ground workpiece surfaces, characteristics of temperature in high speed grinding were analyzed and compared with the temperatures in grinding at normal speeds. It is found that grind speed is the most significant factor to determine temperatures, which might be associated with the increase of material removal in the plastic way at higher grinding speed.

Numerical Prediction of Influence of Diamond Burs on Subsurface Damage in Intraoral Adjustments of Porcelain Prostheses

2008 ◽  
Vol 32 ◽  
pp. 203-206
Author(s):  
Xiao Fei Song ◽  
Ling Yin
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Numerical Modeling ◽  
Material Removal ◽  
High Speed ◽  
Surface Damage ◽  
Subsurface Damage ◽  
Element Analysis ◽  
Made In

Failure rate is noticeably high in dental bioceramics for restorations even though progress has been made in reinforcement of the materials. One of the major causes of failures is due to surface and subsurface damage induced in intraoral adjustments. This process is a routine clinical procedure for marginal and occlusal fit using high-speed dental handpieces and diamond burs. Material removal using the diamond burs easily produce surface and subsurface damage in ceramic prostheses. Therefore, it is essential to minimize the surface damage in clinical dentistry. In this paper, we investigated the effect of diamond burs with coarse, medium and fine grit sizes on the degrees of subsurface damage in in vitro dental adjustments via numerical modeling. Finite element analysis was applied to model the dental adjusting processes and to predict the degrees of subsurface damage using different grit sizes of diamond burs.

scholarly journals Molecular Dynamics Simulation Study of Liquid-Assisted Laser Beam Micromachining Process

2018 ◽  
Vol 2 (3) ◽  
pp. 51 ◽  
Author(s):  
Vivek Menon ◽  
Sagil James
Keyword(s):  
Molecular Dynamics ◽  
Laser Beam ◽  
Material Removal ◽  
Md Simulation ◽  
Bubble Formation ◽  
Machining Process ◽  
Dynamics Simulation ◽  
Dynamic Mode ◽  
Machining Processes ◽  
Static Mode

Liquid Assisted Laser Beam Micromachining (LA-LBMM) process is an advanced machining process that can overcome the limitations of traditional laser beam machining processes. This research involves the use of a Molecular Dynamics (MD) simulation technique to investigate the complex and dynamic mechanisms involved in the LA-LBMM process both in static and dynamic mode. The results of the MD simulation are compared with those of Laser Beam Micromachining (LBMM) performed in air. The study revealed that machining during LA-LBMM process showed higher removal compared with LBMM process. The LA-LBMM process in dynamic mode showed lesser material removal compared with the static mode as the flowing water carrying the heat away from the machining zone. Investigation of the material removal mechanism revealed the presence of a thermal blanket and a bubble formation in the LA-LBMM process, aiding in higher material removal. The findings of this study provide further insights to strengthen the knowledge base of laser beam micromachining technology.

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