The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoparticles and These Bonding Mechanisms

Author(s):  
Shinji Kobayashi ◽  
Eiichi Ide ◽  
Shinji Angata ◽  
Akio Hirose ◽  
Kojiro F. Kobayashi

A novel bonding process using Ag metallo-organic nanoparticles has been proposed. This process is applicable to the alternative to the current high temperature solders, such as Pb-10Sn or Pb-20Sn. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag metallo-organic nanoparticles in order to investigate the bondability of the various metals. These joints were evaluated based on the measurement of the shear strength, and the observation of the fracture surfaces and the cross-sectional microstructures. The shear strength of various metal joints increased in the following order: Al, Ti, Ni, Cu, Ag and Au joints. This corresponds to the order of the standard free energy value of the oxide formation for each metal. This result suggests that the carbon atoms generated by the decomposition of the organic shell of the Ag metallo-organic nanoparticles may play a role in deoxidizing the oxide film on the metal surface.

2006 ◽  
Vol 512 ◽  
pp. 383-388 ◽  
Author(s):  
E. Ide ◽  
S. Angata ◽  
Akio Hirose ◽  
Kojiro F. Kobayashi

We propose a novel bonding process using Ag metallo-organic nanoparticles, of which the average particle size is around 11 nm. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag metallo-organic nanoparticles in order to investigate the bondability of the various metals. These joints are evaluated based on measurement of the shear strength, and the observation of the fracture surfaces and the cross-sectional microstructures. The shear strength of the various metal joints increased in the following order: Al, Ti, Ni, Cu, Ag and Au. This corresponds to the order of the standard-free energy value of the oxide formation for each metal. In particular, while the strengths of the Cu, Ag and Au joints, in which the oxides can be reduced by carbon, were the same level, those of the Al and Ti joints, of which the oxides were more stable than carbon oxides, were extremely low. This result suggests that the carbon atoms or organic elements generated by the decomposition of the organic shell of the Ag metallo-organic nanoparticles may play a role in deoxidizing the oxide film on the metal surface. This can promote chemical bonding between the Ag nanoparticles and metals at low temperatures.


1981 ◽  
Vol 6 ◽  
Author(s):  
Makoto Osaki ◽  
Shinji Yokoi ◽  
Minoru Miyagawa

ABSTRACTThe melting process of noncombustible solid wastes seems to be one of the most promising processes for volume reduction and immobilization. This melting process needs a high temperature of around 1500° C, but the behavior of radionuclides in such a process and at such a temperature has not been fully examined. We melted small contaminated samples to examine the behavior of radionuclides. Melted products were subjected to leaching tests.Many assorted samples were melted, and we found that the vapour pressure of the radionuclide determined the distribution between melted products and dusts. The standard free energy of oxide formation and the quantity of stable nuclide of the radionuclide determined the distribution between metal and slag products. The leaching rate of melted products was sufficiently low.


1990 ◽  
Vol 5 (9) ◽  
pp. 1918-1928 ◽  
Author(s):  
Sadao Nakashima ◽  
Katsutoshi Izumi

The surface morphology of SIMOX wafers implanted at 180 keV with doses of 0.4–2.2 ⊠ 101816O+ cm−2 in a temperature range of 400–700 °C has been investigated using transmission electron microscopy (TEM) replica and cross-sectional TEM (XTEM) techniques. Wafer temperature during oxygen implantation strongly affects the morphology. A number of dents are formed on the surface of wafers implanted at temperatures higher than 510 °C with a dose of 1.8 ⊠ 1018 cm−2. Increasing the wafer temperature causes the dents to grow. The dents disappear by a high-temperature anneal of 1260 °C after the implantation. It is found that oxygen implantation through a 50-nm-thick screen oxide film prevents dent formation. A model explaining the dent formation and dent growth is also proposed.


Author(s):  
M. Larsen ◽  
R.G. Rowe ◽  
D.W. Skelly

Microlaminate composites consisting of alternating layers of a high temperature intermetallic compound for elevated temperature strength and a ductile refractory metal for toughening may have uses in aircraft engine turbines. Microstructural stability at elevated temperatures is a crucial requirement for these composites. A microlaminate composite consisting of alternating layers of Cr2Nb and Nb(Cr) was produced by vapor phase deposition. The stability of the layers at elevated temperatures was investigated by cross-sectional TEM.The as-deposited composite consists of layers of a Nb(Cr) solid solution with a composition in atomic percent of 91% Nb and 9% Cr. It has a bcc structure with highly elongated grains. Alternating with this Nb(Cr) layer is the Cr2Nb layer. However, this layer has deposited as a fine grain Cr(Nb) solid solution with a metastable bcc structure and a lattice parameter about half way between that of pure Nb and pure Cr. The atomic composition of this layer is 60% Cr and 40% Nb. The interface between the layers in the as-deposited condition appears very flat (figure 1). After a two hour, 1200 °C heat treatment, the metastable Cr(Nb) layer transforms to the Cr2Nb phase with the C15 cubic structure. Grain coarsening occurs in the Nb(Cr) layer and the interface between the layers roughen. The roughening of the interface is a prelude to an instability of the interface at higher heat treatment temperatures with perturbations of the Cr2Nb grains penetrating into the Nb(Cr) layer.


Author(s):  
H. Kung ◽  
T. R. Jervis ◽  
J.-P. Hirvonen ◽  
M. Nastasi ◽  
T. E. Mitchell ◽  
...  

MoSi2 is a potential matrix material for high temperature structural composites due to its high melting temperature and good oxidation resistance at elevated temperatures. The two major drawbacksfor structural applications are inadequate high temperature strength and poor low temperature ductility. The search for appropriate composite additions has been the focus of extensive investigations in recent years. The addition of SiC in a nanolayered configuration was shown to exhibit superior oxidation resistance and significant hardness increase through annealing at 500°C. One potential application of MoSi2- SiC multilayers is for high temperature coatings, where structural stability ofthe layering is of major concern. In this study, we have systematically investigated both the evolution of phases and the stability of layers by varying the heat treating conditions.Alternating layers of MoSi2 and SiC were synthesized by DC-magnetron and rf-diode sputtering respectively. Cross-sectional transmission electron microscopy (XTEM) was used to examine three distinct reactions in the specimens when exposed to different annealing conditions: crystallization and phase transformation of MoSi2, crystallization of SiC, and spheroidization of the layer structures.


Author(s):  
N. Rozhanski ◽  
A. Barg

Amorphous Ni-Nb alloys are of potential interest as diffusion barriers for high temperature metallization for VLSI. In the present work amorphous Ni-Nb films were sputter deposited on Si(100) and their interaction with a substrate was studied in the temperature range (200-700)°C. The crystallization of films was observed on the plan-view specimens heated in-situ in Philips-400ST microscope. Cross-sectional objects were prepared to study the structure of interfaces.The crystallization temperature of Ni5 0 Ni5 0 and Ni8 0 Nb2 0 films was found to be equal to 675°C and 525°C correspondingly. The crystallization of Ni5 0 Ni5 0 films is followed by the formation of Ni6Nb7 and Ni3Nb nucleus. Ni8 0Nb2 0 films crystallise with the formation of Ni and Ni3Nb crystals. No interaction of both films with Si substrate was observed on plan-view specimens up to 700°C, that is due to the barrier action of the native SiO2 layer.


2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.


Alloy Digest ◽  
1962 ◽  
Vol 11 (3) ◽  

Abstract ALUMINUM 220 is a 10% magnesium-aluminum casting alloy having the highest combination of mechanical properties, corrosion resistance and machinability. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and compressive and shear strength as well as fatigue. It also includes information on high temperature performance and corrosion resistance as well as casting, heat treating, machining, and joining. Filing Code: Al-112. Producer or source: Aluminum Company of America.


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