Pelvic Canal Narrowing Caused by Triple Pelvic Osteotomy in the Dog

1994 ◽  
Vol 07 (03) ◽  
pp. 114-117 ◽  
Author(s):  
D. L. Holmberg ◽  
A. G. Binnington ◽  
C. W. Miller ◽  
H. R. Sukhiani
Keyword(s):  
Postoperative Complications ◽  
Pelvic Osteotomy ◽  
Wire Saw ◽  
The Wire

SummaryTo reduce postoperative complications due to pelvic canal narrowing following triple pelvic osteotomy, it is important to minimize the length of the pubic remnant on the acetabular segment. Three different techniques for performing the pubic osteotomy were compared: a lateral wire saw technique, a lateral osteotome technique and a ventral osteotome ostectomy technique. The lateral wire saw and ventral ostectomy techniques resulted in significantly shorter pubic remnants than the lateral osteotome technique. The osteotomies performed with the wire saw were more accurate and precise than those performed with the osteotome. The lateral wire saw technique is a practical alternative to the ventral ostectomy technique for performing the pubic osteotomy.A comparison of three different pubic osteotomy techniques for the triple pelvic osteotomy showed that minimal pubic remnants can be achieved with either the lateral wire saw or ventral ostectomy technique. Osteotomies made by the wire saw were more accurate and precise than those made by the osteotome.

Use of the AO Wire Passer to Aid Placement of Obstetrical Saw Wire for Osteotomy

1994 ◽  
Vol 07 (04) ◽  
pp. 180-182
Author(s):  
N. Gofton ◽  
Joanne Cockshutt
Keyword(s):  
Soft Tissue ◽  
Close Contact ◽  
Soft Tissue Trauma ◽  
Wire Saw ◽  
Tissue Dissection ◽  
The Wire ◽  
Tissue Trauma

The AO wire passer can be used as an effective guide for passage of obstetrical saw wire for osteotomy. Use of the wire saw and passer reduces soft tissue trauma by minimizing tissue dissection, and promoting positioning of the saw in close contact with the bone.

Pelvic Canal Narrowing Caused by Triple Pelvic Osteotomy in the Dog

1994 ◽  
Vol 07 (03) ◽  
pp. 110-113 ◽  
Author(s):  
D. L. Holmberg ◽  
M. B. Hurtig ◽  
H. R. Sukhiani
Keyword(s):  
Postoperative Complications ◽  
Pelvic Osteotomy ◽  
Cross Sectional Area ◽  
Sectional Area ◽  
Cross Sectional ◽  
Canal Width ◽  
Operative Complications ◽  
Post Operative Complications

SummaryDuring a triple pelvic osteotomy, rotation of the free acetabular segment causes the pubic remnant on the acetabulum to rotate into the pelvic canal. The resulting narrowing may cause complications by impingement on the organs within the pelvic canal. Triple pelvic osteotomies were performed on ten cadaver pelves with pubic remnants equal to 0, 25, and 50% of the hemi-pubic length and angles of acetabular rotation of 20, 30, and 40 degrees. All combinations of pubic remnant lengths and angles of acetabular rotation caused a significant reduction in pelvic canal-width and cross-sectional area, when compared to the inact pelvis. Zero, 25, and 50% pubic remnants result in 15, 35, and 50% reductions in pelvic canal width respectively. Overrotation of the acetabulum should be avoided and the pubic remnant on the acetabular segment should be minimized to reduce postoperative complications due to pelvic canal narrowing.When performing triple pelvic osteotomies, the length of the pubic remnant on the acetabular segment and the angle of acetabular rotation both significantly narrow the pelvic canal. To reduce post-operative complications, due to narrowing of the pelvic canal, overrotation of the acetabulum should be avoided and the length of the pubic remnant should be minimized.

scholarly journals A Method For Cutting And Preparing Thin-Sections Of Frozen Soil

1977 ◽  
Vol 18 (78) ◽  
pp. 143-144 ◽  
Author(s):  
T.E. Osterkamp
Keyword(s):  
Cutting Forces ◽  
Frozen Soil ◽  
Operating Conditions ◽  
Operating Parameters ◽  
Thin Sections ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

Abstract A diamond wire saw was modified for cutting thin sections of frozen soil and suitable operating conditions were determined experimentally. It was found that a lubricated wire, 0.34 mm in diameter, operaied at cutting velocities of 100-300 mm s-1 and cutting forces 0.02-0.1 kg produced smooth cut surfaces un thin sections 0.4-0.5 mm in thickness. The; temperature and wire size were not critical operating parameters and the wire tensions recommended by the manufacturer were satisfactory. A method of mounting the thin sections is also described.

Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

2007 ◽  
Vol 359-360 ◽  
pp. 450-454 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge ◽  
Zhi Jian Hou
Keyword(s):  
Monocrystalline Silicon ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Surface Formation ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Abrasive

The physical model of fixed-abrasive diamond wire-sawing monocrystalline silicon was founded to analyze the elastic deformation of the wire, supposing that every grit was connected to the surface of the wire by a spring. Ignoring lateral vibration of the wire, the geometrical model of wire-sawing was founded; the average cut depth of single grit was calculated theoretically. Based the indentation fracture mechanics and investigations on brittle-ductile transition of machining monocrystalline silicon, the removal mechanism and surface formation was studied theoretically. It shows that in the case of wire-sawing velocity of 10m/s or higher, infeed velocity of 0.20mm/s and diamond grain size of 64μm or smaller, the chip formation and material removal is in a brittle regime mainly, but the silicon wafer surface formation is sawed in a ductile regime. The size of the abrasives, the wire-saw velocity and infeed velocity can influence the sawing process obviously.

Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis

2009 ◽  
Vol 416 ◽  
pp. 311-315 ◽  
Author(s):  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Shao Jie Li ◽  
Zhi Jian Hou
Keyword(s):  
Current Density ◽  
High Performance ◽  
Experimental Studies ◽  
Cathode Current Density ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cathode Current ◽  
The Wire ◽  
Electroplating Process

Development of high performance diamond impregnated wire is the key of application for fixed-abrasive wire sawing technology. In this paper, some experimental studies were done for development of electroplated diamond wire saw by employing the bright nickel bath. The wire saw electroplating process was developed, the effects of cathode current density and time at tack-on stage on diamond grits density and adhesion between saw matrix and plating coating were discussed. The wire saw cutting experiments were carried out for analysis the used wire wear using the scanning electron microscope (SEM). The experimental results show the optimum tack-on current density to obtain the wire saw with good abrasive distribution and adhesion is 1.5~2.0A/dm2, and the time of pre-plating, tack-on and buildup is 6, 8~10 and 18min in turn. Diamond wire saw wear includes coating wear and grain-abrasion, and the primary wear form is grits pulled-out.

Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw

2012 ◽  
Vol 588-589 ◽  
pp. 1694-1697 ◽  
Author(s):  
Wen Bo Bi ◽  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Zhen Jie Zhu
Keyword(s):  
Kdp Crystal ◽  
Wire Saw ◽  
The Wire ◽  
Diamond Abrasive

This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of the wire saw production, including uncoiling wire, cleaning wire, binder coating, Pre-curving and coiling wire. Wire saw are manufactured successfully by this equipment in the manufacture experiment. The quality of the wire saw was examined by SEM. The average slicing ability of the wire saw is 205 mm2 per meter in the experiment of KDP crystal slicing.

Wire Vibration Modeling and Experimental Analysis for Wire Saw Machining

2019 ◽  
Vol 141 (12) ◽  
Author(s):  
Aofei Tang ◽  
Shujuan Li ◽  
Guigeng Yang ◽  
Lun Li ◽  
Robert G. Landers
Keyword(s):  
Surface Quality ◽  
Process Parameters ◽  
Feed Rate ◽  
Processing Time ◽  
Experimental Studies ◽  
Wire Tension ◽  
Wire Saw ◽  
Part Surface ◽  
Wire Vibration ◽  
The Wire

Abstract Surface roughness is the key index point of wire saw processing silicon carbide (SiC). Many factors influence wafer surface quality, which is determined by the motion of the wire relative to the part. The vibration characteristic of wire saw and the process parameters are concerned factors in this paper, which presents a wire vibration model to study the wire saw vibration law. Experimental studies of a stationary wire are conducted to calibrate the damping coefficient and experimental studies of a moving wire are used to validate the developed model. Simulation, theoretical, and experimental data for wire vibrations during a variety of machining processes are found to compare very well, and the effects of various wire saw process parameters are investigated to analyze the influences of process parameters on wire vibration. It was shown that increasing the wire tension and feed rate, or decreeing the wire length, decreases the wire's first dominant frequency, and that changes in the wire velocity had a negligible effect. Finally, the measurement of the surface morphology and wire saw vibrations for different processing parameters was conducted, and it was seen that increases in the wire velocity and wire tension increases part surface quality and decreases processing time, while an increase in the feed rate decreases both part surface quality and processing time. The results show a clear correlation between the amplitude of the wire vibration outside of the processing zone and the part surface quality.

Experimental Study on Temperature during Wire Saw Slicing

2013 ◽  
Vol 481 ◽  
pp. 153-157
Author(s):  
Chun Yan Yao ◽  
Zong Hua Xu ◽  
Wei Zhang ◽  
Qiao Fang Zhang ◽  
Wei Peng
Keyword(s):  
Experimental Study ◽  
Silicon Wafer ◽  
Silicon Wafers ◽  
Silicon Ingot ◽  
Maximum Value ◽  
Wire Saw ◽  
The Wire ◽  
Fixed Abrasive Wire Saw ◽  
Fixed Abrasive

Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

1998 ◽  
Vol 120 (2) ◽  
pp. 123-128 ◽  
Author(s):  
J. Li ◽  
I. Kao ◽  
V. Prasad
Keyword(s):  
Maximum Shear Stress ◽  
Silicon Crystal ◽  
Silicon Wafers ◽  
Cutting Process ◽  
Abrasive Particles ◽  
Silicon Ingot ◽  
Wire Saw ◽  
Dimensionless Stress ◽  
Tangential Forces ◽  
The Wire

Wire saw slicing is a cost effective technology with high surface quality for slicing large diameter silicon wafers. Though wire saws have been deployed to cut polycrystalline and single crystal silicon ingot since the early 1990s, very little is known about the fundamental cutting process. We investigate this manufacturing process and propose a contact stress model of wire saw slicing that illustrates the interactions among the wire, ingot, and abrasives (e.g., SiC) carried by the slurry. Stresses created by wire saw slicing silicon wafers are analyzed in this paper. During the cutting process, the wire moves at high speed (5–15 m/s) with respect to the silicon ingot. The abrasives in the slurry are lose third-body particles caught between the wire and ingot at the contact surface. The forces applied by the wire carry the abrasive particles and cause them to roll on the surface and at the same time to be constrained to indent the surface. Such rolling-indenting interactions result in the formation of isolated chips and surface cracks. The cracks and discontinuity on the surface also cause high stress concentration. As a result, the material is cut and removed. The stress fields of a single circular cone of the abrasive particle indenting on silicon crystal with normal and tangential forces can be calculated and analyzed from the modeling equations and boundary conditions. The stresses are expressed with dimensionless stress measures, as functions of normalized geometric parameters. The results show that the maximum normal stress occurs at the indentation point, while the maximum shear stress (σzx) occurs below the surface of contact, as expected. Such subsurface shear facilitates the peeling effects of the silicon cracks. Both the normal and tangential forces applied at the contacts are incorporated in the model. The model is very effective in explaining and predicting the behaviors and distributions of stresses during the cutting process, and can be used to determine the optimal geometry of the abrasive particles in the rolling-indenting process.

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