Effect of an AlN buffer layer on the epitaxial growth of InN by molecular-beam epitaxy

2001 ◽  
Vol 79 (10) ◽  
pp. 1489-1491 ◽  
Author(s):  
Hai Lu ◽  
William J. Schaff ◽  
Jeonghyun Hwang ◽  
Hong Wu ◽  
Goutam Koley ◽  
...  
Author(s):  
B. Riah ◽  
Julien Camus ◽  
Abdelhak Ayad ◽  
Mohammad Rammal ◽  
Raouia Zernadji ◽  
...  

This paper reports the effect of silicon substrate orientation and aluminum nitride buffer layer deposited by molecular beam epitaxy on the growth of aluminum nitride thin films deposited by DC magnetron sputtering technique at low temperature. The structural analysis has revealed a strong (0001) fiber texture for both substrates Si (100) and (111) and a hetero-epitaxial growth on few nanometers AlN buffer layer grown by MBE on Si (111) substrate. SEM images and XRD characterization have shown an enhancement in AlN crystallinity thanks to AlN (MBE) buffer layer. Raman spectroscopy indicated that the AlN film was relaxed when it deposited on Si (111), in compression on Si (100) and under tension on AlN buffer layer grown by MBE/Si (111) substrates, respectively. The interface between Si (111) and AlN grown by MBE is abrupt and well defined; contrary to the interface between AlN deposited using PVD and AlN grown by MBE. Nevertheless, AlN hetero-epitaxial growth was obtained at low temperature (<250°C).


Coatings ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1063
Author(s):  
Badis Riah ◽  
Julien Camus ◽  
Abdelhak Ayad ◽  
Mohammad Rammal ◽  
Raouia Zernadji ◽  
...  

This paper reports the effect of Silicon substrate orientation and Aluminum nitride buffer layer deposited by molecular beam epitaxy on the growth of aluminum nitride thin films deposited by a DC magnetron sputtering technique at low temperatures. The structural analysis has revealed a strong (0001) fiber texture for both Si(100) and (111) substrates, and a hetero-epitaxial growth on a AlN buffer layer, which is only a few nanometers in size, grown by MBE onthe Si(111) substrate. SEM images and XRD characterization have shown an enhancement in AlN crystallinity. Raman spectroscopy indicated that the AlN film was relaxed when it deposited on Si(111), in compression on Si(100) and under tension on a AlN buffer layer grown by MBE/Si(111) substrates, respectively. The interface between Si(111) and AlN grown by MBE is abrupt and well defined, contrary to the interface between AlN deposited using PVD and AlN grown by MBE. Nevertheless, AlN hetero-epitaxial growth was obtained at a low temperature (<250 °C).


2020 ◽  
Vol 127 (21) ◽  
pp. 214104
Author(s):  
E. N. Jin ◽  
A. C. Lang ◽  
M. T. Hardy ◽  
N. Nepal ◽  
D. S. Katzer ◽  
...  

2001 ◽  
Vol 693 ◽  
Author(s):  
Hai Lu ◽  
William J. Schaff ◽  
Lester F. Eastman ◽  
Colin Wood

AbstractIn this work, we prepared epitaxial InN on (0001) sapphire with an AlN or GaN buffer layer by molecular beam epitaxy (MBE). A series of samples were grown with different thickness under the optimized growth conditions. Films were characterized by x-ray diffraction (XRD), reflective high-energy electron diffraction (RHEED), atomic-force microscopy (AFM), transmission electron microscopy (TEM) and Hall measurements. By extrapolating the fitted curve of sheet carrier density vs. film thickness to zero film thickness, a strong residual sheet charge was derived, which may be located at the interface between the buffer layer and the InN film, or at the near-surface. It was found that for InN film on AlN buffer, the residual sheet charge is about 4.3×1013 cm-2, while for InN films on GaN buffer, the residual sheet charge is about 2.5×1013 cm-2. At present, we tentatively believe that the residual charge is surface charge accumulation similar to what is observed at the InAs surface. InN samples with Hall mobility beyond 1300 cm2/Vs and carrier concentration below 2×1018 cm-3 were routinely achieved in this study.The first study on InN-based FET structures was performed. Amorphous AlN was used as the barrier material, which was prepared by migration enhanced epitaxy (MEE) at low growth temperature. It was found that the surface morphology is improved after an AlN barrier layer is added to InN. Hg was used as a back-to-back Schottky metallization. Very low leakage current and weak rectifying behavior were observed.


2020 ◽  
Vol 43 (1) ◽  
Author(s):  
Shashidhara Acharya ◽  
Abhijit Chatterjee ◽  
Seema ◽  
Mukul Gupta ◽  
Bivas Saha

2011 ◽  
Vol 110 (5) ◽  
pp. 053506 ◽  
Author(s):  
Matt D. Brubaker ◽  
Igor Levin ◽  
Albert V. Davydov ◽  
Devin M. Rourke ◽  
Norman A. Sanford ◽  
...  

2007 ◽  
Vol 24 (1) ◽  
pp. 240-243 ◽  
Author(s):  
Zhong Fei ◽  
Qiu Kai ◽  
Li Xin-Hua ◽  
Yin Zhi-Jun ◽  
Xie Xin-Jian ◽  
...  

2011 ◽  
Vol 519 (7) ◽  
pp. 2067-2070 ◽  
Author(s):  
Z. Yang ◽  
C. Ke ◽  
L.L. Sun ◽  
W. Zhu ◽  
H.B. Lu ◽  
...  

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