scholarly journals Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Wei Guo ◽  
Zhi Zeng ◽  
Xiaoying Zhang ◽  
Peng Peng ◽  
Shanping Tang
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Chemical Reduction ◽  
Thermal Characteristics ◽  
Electronics Packaging ◽  
Low Temperature Sintering ◽  
Ag Nps ◽  
Scanning Calorimetry ◽  
Joint Shear Strength ◽  
Average Shear Strength

Ag nanoparticles (NPs) with about 40 nm diameter covered with 5–8 nm organic shell were prepared by chemical reduction reaction. The thermal characteristics of Ag nanoparticle (NP) paste were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The low-temperature sintering bonding processes using Ag NP paste were carried out at the temperature range of 150–350°C for 5 min under the pressure of 3 MPa. The microstructures of the sintered joint and the fracture morphology were evaluated by scanning electron microscopy (SEM). The shear strength was used to evaluate the mechanical property of the sintered joint. TGA-DSC test showed that the Ag content is approximately 95.5 mass% in Ag NP paste. The average shear strength of the joint fabricated at 250°C for 5 min under the pressure of 3 MPa was about 28 MPa, which could meet the requirements of electronics packaging working at high temperature. The joint shear strength increased with the increase of the sintering temperature due to much denser sintered Ag NPs and more comprehensive metallurgical bonds formed in the joint.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

2012 ◽  
Vol 706-709 ◽  
pp. 2962-2967 ◽  
Author(s):  
Akio Hirose ◽  
Naoya Takeda ◽  
Yosuke Konaka ◽  
Hiroaki Tatsumi ◽  
Yusuke Akada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Bonding Process ◽  
Low Temperature Sintering ◽  
High Melting Point ◽  
Organic Nanoparticles ◽  
High Temperature Electronics ◽  
Low Temperature Bonding

A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000842-000847
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging

2013 ◽  
Vol 42 (6) ◽  
pp. 1209-1218 ◽  
Author(s):  
Yunhui Mei ◽  
Gang Chen ◽  
Yunjiao Cao ◽  
Xin Li ◽  
Dan Han ◽  
...  
Keyword(s):  
Low Temperature ◽  
Power Electronics ◽  
Electronics Packaging ◽  
Low Temperature Sintering

Low temperature sintering of Ag nanoparticles for flexible electronics packaging

2010 ◽  
Vol 97 (15) ◽  
pp. 153117 ◽  
Author(s):  
A. Hu ◽  
J. Y. Guo ◽  
H. Alarifi ◽  
G. Patane ◽  
Y. Zhou ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Low Temperature Sintering

scholarly journals Silver nanoparticles sintering at low temperature on a copper substrate: In situ characterization under inert atmosphere and air

2012 ◽  
Vol 48 (1) ◽  
pp. 63-71 ◽  
Author(s):  
J. Sopousek ◽  
J. Bursik ◽  
J. Zalesak ◽  
Z. Pesina
Keyword(s):  
Silver Nanoparticles ◽  
Low Temperature ◽  
Copper Substrate ◽  
Simultaneous Thermal Analysis ◽  
Inert Atmosphere ◽  
Ag Nps ◽  
Scanning Calorimetry ◽  
External Conditions ◽  
Wet Synthesis

Silver nanoparticles (Ag-NPs) were prepared by wet synthesis. The Ag-NPs suspension and the copper substrate plate were used for a preparation of substrate-nanoparticle-substrate samples. The sandwich like samples Cu/Ag/Cu were prepared and investigated in-situ at the isothermal external conditions (IEC) and inside apparatus for simultaneous thermal analysis STA409 (DSC). The in-situ results of the electrical resistance were recorded during the Cu/Ag/Cu (IEC) sample preparation and heat treatment. Thermal effects of the Ag-NPs sintering between copper substrates were measured by differential scanning calorimetry (DSC) under different atmospheres. The prepared Cu/Ag/Cu sandwich samples were characterised by means of both optical and electron microscopy. The process of the low temperature sintering inside calorimeter of the Ag-NPs was monitored using both thermogravimetry (TG) and DSC technique under inert gas and under synthetic air. The exothermic heat effect of nanosilver sintering was evaluated.

scholarly journals Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

2021 ◽  
Vol 5 (1) ◽  
pp. 15
Author(s):  
Anna Pajor-Świerzy ◽  
Franciszek Szendera ◽  
Radosław Pawłowski ◽  
Krzysztof Szczepanowicz
Keyword(s):  
Silver Nanoparticles ◽  
Low Temperature ◽  
Low Cost ◽  
Future Application ◽  
Core Shell ◽  
Low Temperature Sintering ◽  
Ag Nps ◽  
Conductive Coatings ◽  
Nickel Silver ◽  
Silver Core

Nanocomposite inks composed of nickel–silver core–shell and silver nanoparticles (NPs) can combine the advantages of lower cost, high conductivity, and low-temperature sintering processes, which have attracted much attention in the development of materials for printed flexible electronics. In this context, in the present paper, we report the process of preparation of nanocomposite ink containing nickel–silver core–shell nanoparticles, as the main filler, and silver nanoparticles, as doping material, and their application for the fabrication of conductive coatings. It was found that the addition of a low concentration of Ag NPs to ink formulation based mainly on low-cost Ni-Ag NPs improves the conductive properties of coatings fabricated by ink deposition on a glass substrate. Two types of prepared nanocomposite ink coatings showed promising properties for future application: (1) doped with 0.5% of Ag NPs sintered at 200 °C as low cost for larger industrial application and, (2) containing 1% of Ag NPs sintered at 150 °C for the fabrication of conductive printed patterns on flexible substrates. The conductivity of such nanocomposite films was similar, about of 6 × 106 S/m, which corresponds to 35% of that for a bulk nickel.

scholarly journals Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles

2014 ◽  
Vol 10 (1) ◽  
pp. 293-298 ◽  
Author(s):  
Zbyněk Pešina ◽  
Vít Vykoukal ◽  
Marián Palcut ◽  
Jiří Sopoušek
Keyword(s):  
Silver Nanoparticles ◽  
Shear Strength ◽  
Low Temperature ◽  
Low Temperature Sintering

AMPCOLOY 495

Alloy Digest ◽  
1966 ◽  
Vol 15 (11) ◽  
Keyword(s):  
Fracture Toughness ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
Low Temperature ◽  
Physical Properties ◽  
High Strength ◽  
Heat Treating ◽  
Aluminum Bronze ◽  
High Manganese ◽  
Temperature Performance

Abstract AMPCOLOY 495 is a high manganese type of aluminum bronze recommended where high strength and corrosion resistance are required along with good weldability. It is recommended for marine equipment and ship propellers. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and compressive and shear strength as well as fracture toughness, creep, and fatigue. It also includes information on low temperature performance and corrosion resistance as well as casting, forming, heat treating, machining, and joining. Filing Code: Cu-171. Producer or source: Ampco Metal Inc..

AWHF STEEL

Alloy Digest ◽  
1972 ◽  
Vol 21 (6) ◽  
Keyword(s):  
Fracture Toughness ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
Low Temperature ◽  
Physical Properties ◽  
Heat Treating ◽  
Steel Company ◽  
Cold Forming ◽  
Temperature Performance ◽  
Minimum Yield

Abstract AWHF STEEL is a high-formability steel produced regularly at minimum yield strengths of 45,000 and 50,000 psi and for special applications at 55,000 and 60,000 psi. It is recommended for difficult cold-forming applications that involve bending or drawing and it has good weldability. This datasheet provides information on composition, physical properties, elasticity, tensile properties, and compressive and shear strength as well as fracture toughness and fatigue. It also includes information on low temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: SA-275. Producer or source: Alan Wood Steel Company.

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