Low loss superconducting titanium nitride coplanar waveguide resonators

Abstract The wireless telecommunication systems have an undeniable role in today's society. The rapid progress of wireless services and applications accelerates demands for high data-rate reliable systems. The 60 GHz band with its 5 GHz globally unlicensed available spectrum, provides a great opportunity for the next generation of high data-rate wireless communication. Despite this attractive bandwidth surrounding 60 GHz, there are still many challenges to be addressed such as the loss performance and the integration with other systems. Low Temperature Cofired Ceramic (LTCC) technology, with its unique and mature multilayer fabrication process, has excellent capability of realizing miniaturized 3D low loss structures to overcome these challenges. Since, one of the key components in any communication system for both interconnecting and designing components is Low loss transmission lines, in this article we overview the performances and challenges for four different most practical transmission lines at 60 GHz in LTCC: Microstrip, Stripline, Coplanar Waveguide (CPW), and LTCC Integrated Waveguide (LIW).

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A Low Loss Fully Embedded Stripline Parallel Coupled BPF for Applications using the 60 GHz Band

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/cicmt-2011-ta22 ◽

2011 ◽

Vol 2011 (CICMT) ◽

pp. 000050-000053

Author(s):

Alexander Schulz ◽

Sven Rentsch ◽

Lei Xia ◽

Robert Mueller ◽

Jens Mueller

Keyword(s):

Return Loss ◽

Bandpass Filter ◽

Coplanar Waveguide ◽

Center Frequency ◽

60 Ghz ◽

Low Loss ◽

Wireless Applications ◽

High Data ◽

V Band ◽

Waveguide Transmission

This paper presents a low loss fully embedded bandpass filter (BPF) using low temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications for the unlicensed 60 GHz band. The measured insertion loss was 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB was achieved, including two grounded coplanar waveguide transmission line (CPWg) to stripline transitions. The four layers BPF has a 3 dB bandwidth of about 11 GHz which supplies e.g. broadband and high data rate applications. The whole BPF requires a substrate area of 5.6 × 2.1 × 0.42 mm3 with transitions and a shielding via fence. This BPF suits well for V-band applications in a LTCC package because of the compact dimensions and the good performance.

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Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Journal of Microelectronics and Electronic Packaging ◽

10.4071/imaps.660476 ◽

2018 ◽

Vol 15 (3) ◽

pp. 101-106

Author(s):

Bijan K. Tehrani ◽

Ryan A. Bahr ◽

Manos M. Tentzeris

Keyword(s):

3D Printing ◽

Millimeter Wave ◽

Integrated Circuit ◽

Coplanar Waveguide ◽

Frequency Selective Surface ◽

60 Ghz ◽

Low Loss ◽

Printing Technology ◽

3D Printing Technology ◽

Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

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