scholarly journals Optical bandgap of ultra-thin amorphous silicon films deposited on crystalline silicon by PECVD

AIP Advances ◽  
2014 ◽  
Vol 4 (5) ◽  
pp. 057122 ◽  
Author(s):  
Yaser Abdulraheem ◽  
Ivan Gordon ◽  
Twan Bearda ◽  
Hosny Meddeb ◽  
Jozef Poortmans
2002 ◽  
Vol 715 ◽  
Author(s):  
D. J. Lockwood ◽  
J.-M. Baribeau ◽  
M. Noël ◽  
J. C. Zwinkels ◽  
B. J. Fogal ◽  
...  

AbstractWe produce a novel form of amorphous silicon through ultra-high-vacuum molecular beam epitaxy. By depositing silicon atoms onto a fused quartz substrate at temperatures between 98 and 335°C, we obtain a silicon-based material that lacks the characteristic periodicity of crystalline silicon but nevertheless has 98% of its density. The impurity content of this material is studied through infrared and secondary ion mass spectroscopies. The primary impurity found is oxygen, with hydrogen and carbon atoms also being found at trace levels. The Raman spectra of the amorphous silicon films are measured and the results, as they relate to the presence of disorder, are interpreted. We also use this molecular beam epitaxy method to fabricate a number of amorphous silicon superlattices, comprised of thin layers of amorphous silicon separated with even thinner layers of SiO2. The optical properties of the films and superlattices are contrasted.


1998 ◽  
Vol 507 ◽  
Author(s):  
I. Ferreira ◽  
H. Águas ◽  
L. Mendes ◽  
F. Fernandes ◽  
E. Fortunato ◽  
...  

ABSTRACTThis work reports on the performances of undoped and n doped amorphous/nano-crystalline silicon films grown by hot wire plasma assisted technique. The film's structure (including the presence of several nanoparticles with sizes ranging from 5 nm to 50 nm), the composition (oxygen and hydrogen content) and the transport properties are highly dependent on the filament temperature and on the hydrogen dilution. The undoped films grown under low r.f. power (≍ 4 mWcm−2) and with filament temperatures around 1850 °K have dark conductivities below 10−1Scm−1, optical gaps of about 1.5 eV and photo-sensitivities above 105, (under AM3.5), with almost no traces of oxygen content. N- doped silicon films were also fabricated under the same conditions which attained conductivities of about 10−2Scm−1.


1987 ◽  
Vol 95 ◽  
Author(s):  
K. M. H. Maessen ◽  
M. J. M. Pruppers ◽  
J. Bezemer ◽  
F. H. P. M. Habraken ◽  
W. F. van der Weg

AbstractThe dependence of the optical bandgap on the hydrogen concentration is measured for amorphous silicon films prepared under different glow-discharge conditions. A deviation from the usually accepted linear dependence is found for hydrogen concentrations above 12 at.‰ We find that in this concentration region an increase of hydrogen incorporated as SiH2 is responsible for this behaviour.


1999 ◽  
Vol 587 ◽  
Author(s):  
Rosaria A. Puglisi ◽  
Hiroshi Tanabe ◽  
Claudine M. Chen ◽  
Harry A. Atwater ◽  
Emanuele Rimini

AbstractWe investigated the formation of large-grain polycrystalline silicon films on glass substrates for application in low-cost thin film crystalline silicon solar cells. Since use of glass substrates constrains process temperatures, our approach to form large-grain polycrystalline silicon templates is selective nucleation and solid phase epitaxy (SNSPE). In this process, selective crystallization of an initially amorphous silicon film, at lithographically predetermined sites, enables grain sizes larger than those observed via random crystallization. Selective heterogeneous nucleation centers were created on undoped, 75 nm thick, amorphous silicon films, by masked implantation of Ni islands, followed by annealing at temperatures below 600 °. At this temperature, the Ni precipitates into NiSi2 particles that catalyze the transition from the amorphous to the crystalline Si phase. Seeded crystallization begins at the metal islands and continues via lateral solid phase epitaxy (SPE), thus obtaining crystallized regions of several tens of square microns in one hour. We have studied the dependence of the crystallization rate on the Ni-implanted dose in the seed, in the 5×1015/cm3 - 1016/cm3range. The large grained polycrystalline Si films were then used as a substrate for molecular beam epitaxy (MBE) depositions of 1 [.proportional]m thick Si layers. Transmission electron microscopy (TEM) analysis showed a strong correlation between the substrate morphology and the deposited layer. The layer presented a large grain morphology, with sizes of about 4 [.proportional]m.


2012 ◽  
Vol 1426 ◽  
pp. 341-346 ◽  
Author(s):  
W. Beyer ◽  
W. Hilgers ◽  
D. Lennartz ◽  
F. Pennartz ◽  
P. Prunici

ABSTRACTEffusion measurements of hydrogen and implanted helium are reported for (undoped) amorphous and crystalline Si:H and related materials. Effusion of helium observed at temperatures > 600°C is attributed to isolated voids present in the material from the preparation process. While rather high void densities are detected for amorphous silicon films prepared by such deposition techniques like vacuum evaporation or sputtering, much smaller densities are found for plasma grown hydrogenated amorphous silicon (a-Si:H). For device-grade a-Si:H, the density of cavities which can trap helium is estimated to be about 2x1018/cm3at most, suggesting that crystalline silicon type divacancies are not the major hydrogen incorporation site.


2006 ◽  
Vol 910 ◽  
Author(s):  
Mark Smith ◽  
Richard A. McMahon ◽  
Keith A. Seffen ◽  
Dieter Panknin ◽  
Matthias Voelskow ◽  
...  

AbstractThin poly-crystalline silicon films are attractive for the fabrication of active matrix liquid crystal displays. We investigate the use of flash lamp annealing to crystallize amorphous silicon layers on glass substrates as a low cost manufacturing route. In this process amorphous silicon (a-Si) can be crystallized by solid phase crystallization (SPC) or in the super lateral growth (SLG) regime. We present a thermal model incorporating the phase transitions during annealing; providing a valuable tool for optimizing the process conditions. Another consideration is the evolution of stress resulting from the transient thermal loading of the substrate material. Results are presented for various substrate geometries and important scalability issues are addressed.


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