Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

2015 ◽  
Vol 69 (3) ◽  
pp. 295-310
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor ◽  
A. Jalar ◽  
F. Che Ani ◽  
...  
Keyword(s):  
Finite Volume ◽  
Capillary Flow ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

scholarly journals Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

2014 ◽  
Vol 6 ◽  
pp. 275735 ◽  
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor ◽  
Z. M. Fairuz ◽  
A. M. Iqbal ◽  
...  
Keyword(s):  
Capillary Flow ◽  
Flow Behavior ◽  
Fluid Structure Interaction ◽  
Molten Solder ◽  
Circuit Board ◽  
Fluid Structure ◽  
Structure Interaction ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < d/ D < 0.97) were studied through a simulation modeling. The use of ratio d/ D = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to d/ D. Stress of pin varied quadratically with the d/ D. The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

APPLICATIONS OF SOLDER PREFORMS TO IMPROVE RELIABILITY

2011 ◽  
Vol 2011 (1) ◽  
pp. 000258-000263 ◽  
Author(s):  
Carol Gowans ◽  
Seth Homer ◽  
Ronald Lasky
Keyword(s):  
Solder Joint ◽  
Process Design ◽  
Solder Paste ◽  
Passive Components ◽  
Process Step ◽  
Soldering Process ◽  
Wave Soldering ◽  
Placement Machine ◽  
Through Hole ◽  
Improve Reliability

As early as the 1990s people were predicting the end of through-hole components, but they are alive and well with the numbers of dual in-line packages (DIPs) and connectors still measured in the 10s of billions per year. Many of these components are assembled by wave soldering, however in mixed technology (SMT and through-hole on the same board) where the through-hole count is low, it is often advantageous to consider selective soldering or the pin-in-paste process (PIP). PIP is a process in which solder paste is printed over or near the PWB through-holes. The through-hole components are then placed and the solder joint is formed during the reflow process. PIP has the advantage of eliminating the wave soldering process step. In many cases it is difficult to print enough solder paste to make an acceptable through-hole solder joint. Solder preforms were developed to meet this need. These solder preforms are typically shaped in the form of 0402, 0603, or 0805 passive components. The preforms are placed on the appropriate printed solder paste deposit by a component placement machine. Preforms come in tape & reel packaging. Today solder preforms are also used in other “solder starved” applications such as radio frequency (RF) shields, connectors, and under QFN thermal pads. In all cases, the extra solder delivered by the preform is vital to the reliability of the assembled product. In this paper, process, design, and assembly methods for solder fortification using preforms will be discussed. Four successful solder fortification examples will be presented along with the associated defect reductions.

scholarly journals Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

2014 ◽  
Vol 2014 ◽  
pp. 1-13 ◽  
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor
Keyword(s):  
Capillary Flow ◽  
Fluid Structure Interaction ◽  
Von Mises Stress ◽  
Fluid Structure ◽  
Structure Interaction ◽  
Wave Soldering ◽  
Filling Time ◽  
Von Mises ◽  
Solder Temperature ◽  
Through Hole

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) <T< 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. TheΔTobtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.

scholarly journals Yield Improvement in Wave Soldering Process by Using Customised Pallets

2021 ◽  
Vol 23 (06) ◽  
pp. 1001-1010
Author(s):  
Dr.Salil Dey ◽  
◽  
Mr. Prince Kumar ◽  
Keyword(s):  
Production Rate ◽  
Yield Improvement ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

Presently there are two types of components available in the Electronic Industries; they are 1. Surface-mounted Devices 2. Leaded components (through-hole components). Surface-mounted components can be assembled at first speed due to automation in the mounting and reflow soldering process. But the speed at which leaded components are mounted and soldered is not that fast. Hence there is always a challenge to match the production rate of PCB having led and surface mounted devices.

Key Parameter Optimization in Wave Soldering

2011 ◽  
Vol 323 ◽  
pp. 84-88 ◽  
Author(s):  
Wan Gang Wang ◽  
Yong Peng ◽  
Xiao Ping Wang
Keyword(s):  
Printed Circuit Board ◽  
High Reliability ◽  
Peak Height ◽  
Productive Efficiency ◽  
Circuit Board ◽  
Soldering Temperature ◽  
Soldering Process ◽  
Wave Soldering ◽  
Productive Process ◽  
Through Hole

Wave soldering is mainly used in electronic assembling process of traditional through-hole cartridge printed-circuit board and hybrid packaged process combining surface mounting with through-hole cartridge components. Compared with manual welding, wave soldering has advantages of high productive efficiency, good welding quality and high reliability. Wave soldering process is a complex and systematic project. During the practical productive process, flux coating quantity, preheat temperature of printed board, soldering temperature and time, uphill height of printed board and peak height should be strictly controlled and its process parameter should be comprehensively regulated in order to achieve better soldering quality.

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

1991 ◽  
Vol 113 (2) ◽  
pp. 149-155 ◽  
Author(s):  
D. Barker ◽  
M. Pecht ◽  
A. Dasgupta ◽  
S. Naqvi
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Three Dimensional ◽  
Strain History ◽  
Thermal Stress Analysis ◽  
Soldering Process ◽  
Wave Soldering ◽  
Plated Through Hole ◽  
The Impact ◽  
Through Hole

During a typical wave soldering operation a plated through hole (PTH) is exposed to temperatures which are higher than any rated operating temperatures. Understanding the heat transfer and the potential PTH damage mechanisms, which arise during the wave soldering process, is critical to PTH quality control and reliability. In particular, cracks may be initiated during the wave soldering transient and become manifest only after operational cycling. This paper presents a transient nonlinear thermal stress analysis of a nonsolder filled PTH that is subjected to a typical wave soldering process. A full three-dimensional orthotropic analysis and an axisymmetric analysis with cylindrically anisotropic properties are used and the results compared. Temperature and stress/strain history curves are examined to determine the impact of the wave soldering operation on the PTH fatigue life. The effect of PWB innerplanes on the PTH maximum stress and strain is also investigated.

Investigation of Delamination Between Leadframe and Mold Compound on a LED Package

2004 ◽  
Vol 1 (4) ◽  
pp. 269-281
Author(s):  
Fu-Mauh Wong ◽  
K.N Seetharamu
Keyword(s):  
Shear Strength ◽  
Thermal Stress ◽  
Room Temperature ◽  
Maximum Shear Stress ◽  
Adhesion Test ◽  
Element Analysis ◽  
Moisture Condition ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

Delamination between mold compound and leadframe is found in a customized LED through-hole package. The delamination was initiated near the die paddle location under moisture condition. Subsequently, the delamination propagates throughout the package during the wave soldering process. An adhesion test has been performed to identify the mechanism of the delamination and to determine the adhesion shear strength between leadframe and mold compound. Finite Element Analysis (FEA) is conducted to analyze the thermal stress distribution at room temperature and the temperature distribution of package during wave soldering process. The delamination between leadframe and mold compound is initiated under moisture condition if the maximum-shear-stress for the package exceeds the measured adhesion shear strength. It is found that the package is at high risk of delamination if the temperature near the die paddle is higher than the glass transition temperature (Tg) of the mold compound. Parametric study has been performed to identify the controlling leadframe parameters that contribute to the thermal stress at room temperature and the temperature of the package during wave soldering process. The leadframe has been optimized based on the findings and the delamination has been minimized.

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