Key Parameter Optimization in Wave Soldering
2011 ◽
Vol 323
◽
pp. 84-88
◽
Keyword(s):
Wave soldering is mainly used in electronic assembling process of traditional through-hole cartridge printed-circuit board and hybrid packaged process combining surface mounting with through-hole cartridge components. Compared with manual welding, wave soldering has advantages of high productive efficiency, good welding quality and high reliability. Wave soldering process is a complex and systematic project. During the practical productive process, flux coating quantity, preheat temperature of printed board, soldering temperature and time, uphill height of printed board and peak height should be strictly controlled and its process parameter should be comprehensively regulated in order to achieve better soldering quality.
2014 ◽
Vol 874
◽
pp. 139-143
◽
2014 ◽
Vol 26
(4)
◽
pp. 194-202
◽
Keyword(s):
2014 ◽
Vol 6
◽
pp. 275735
◽
2021 ◽
Vol 26
(5)
◽
pp. 426-431
Keyword(s):
2019 ◽
Vol 31
(3)
◽
pp. 169-175
◽
Keyword(s):
2018 ◽
Vol 395
◽
pp. 012016
Keyword(s):
2015 ◽
Vol 69
(3)
◽
pp. 295-310
2015 ◽
Vol 57
◽
pp. 45-57
◽