Gold Pre-tinning through Single Dynamic Wave Soldering for Pin Through-Hole and Surface Mount Components

2015 ◽  
Keyword(s):  
Surface Mount ◽  
Wave Soldering ◽  
Through Hole ◽  
Dynamic Wave

Critical Soldering Interconnect Technology in SMT

2015 ◽  
Vol 713-715 ◽  
pp. 3001-3006
Author(s):  
Xiao Ming Hu
Keyword(s):  
Contact Angle ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Surface Mount ◽  
Printed Circuit ◽  
Wave Soldering ◽  
Product Manufacturing ◽  
Interconnect Technology ◽  
Through Hole

this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must place components in through-hole ways , then we use wave soldering. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. As technology changing very soon, the through-hole components have been largely replaced by surface mount components, this time ,Reflow soldering is the most common method of attaching surface mount components to a circuit board,but not wave soldering also reflowing, we must focus on wetting , It quantifies the wettability of a solid surface by a liquid .wetting angle is a the important quantity (also called contact angle).it can judge the quality of solder joints.

Experimental measurements of the shear force on surface mount components simulating the wave soldering process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Violeta Carvalho ◽  
Bruno Arcipreste ◽  
Delfim Soares ◽  
Luís Ribas ◽  
Nelson Rodrigues ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Deep Understanding ◽  
Critical Issue ◽  
Circuit Boards ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Wave Soldering ◽  
Pull Out ◽  
Minimum Force

Purpose This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

2015 ◽  
Vol 69 (3) ◽  
pp. 295-310
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor ◽  
A. Jalar ◽  
F. Che Ani ◽  
...  
Keyword(s):  
Finite Volume ◽  
Capillary Flow ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

Manufacturability of Large SMT Connectors

2002 ◽  
Author(s):  
Stacey N. Serafin ◽  
Terrance Dishongh
Keyword(s):  
Phase Transition ◽  
Electronic Industry ◽  
Surface Mount ◽  
Through Hole

With the advent of higher signaling frequencies on today’s motherboard, evolution suggests that the electronic industry is near a phase transition of going from through hole mount to surface mount connectors. Current computer infrastructure supports assembly of motherboards using through hole mount connectors from a historical standpoint. This legacy has led placement equipment manufacturers to develop fabrication machines that do not consider long, thin devices such as a PCI or DIMM connector. The reassessment of the world’s method of motherboard manufacturing presents a challenge. Hence the question arises, what is the realistic lifetime of a through hole mount connector and what are the assembly and reliability issues associated with a proposed replacement such as a surface mount connector. This paper addresses the basic reliability concerns of a long, thin, surface mount PCI connector both with, and without retention features.

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