Characterization of the reliability and uniformity of an anodization-free fabrication process for high-quality Nb/Al–AlOx/Nb Josephson junctions

2013 ◽  
Vol 26 (6) ◽  
pp. 065012 ◽  
Author(s):  
S Kempf ◽  
A Ferring ◽  
A Fleischmann ◽  
L Gastaldo ◽  
C Enss
2016 ◽  
Vol 2016 (1) ◽  
pp. 000288-000292
Author(s):  
Timothy Clingenpeel ◽  
Arian Rahimi ◽  
Seahee Hwangbo ◽  
Yong-Kyu Yoon ◽  
Aric Shorey

Abstract This work presents the fabrication process, electrical characteristics, and circuit model of through glass via (TGV) structures consisting of TGV holes with each diameter of 100 μm and different conductors including copper and composite in the frequency range of 300 kHz to 20 GHz. The Cu/NiFe superlattice metaconductors in combination with high-quality glass (Corning SGW3) are intended to reduce radio-frequency losses especially in 10 GHz and above for next generation communication applications such as 5G communications. The measured results of the copper structure are compared to simulated results. Superlattice metaconductor results will be presented. Based on the simulation and measurement results, a circuit model is demonstrated.


Minerals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 237
Author(s):  
Carolina Cardell ◽  
Jose Santiago Pozo-Antonio

The physical–chemical characterization of natural and synthetic historical inorganic and mineral pigments, which may be found embedded in paintings (real or mock-ups), glass, enamel, ceramics, beads, tesserae, etc., as well as their alteration under different decay scenarios, is a demanding line of investigation. This field of research is now both well established and dynamic, as revealed by the numerous publications in high-quality journals of varied scientific disciplines. [...]


1998 ◽  
Vol 264-268 ◽  
pp. 1201-1204
Author(s):  
F. Hamdani ◽  
M. Yeadon ◽  
David John Smith ◽  
H. Tang ◽  
W. Kim ◽  
...  
Keyword(s):  

2010 ◽  
Vol 470 (20) ◽  
pp. 1515-1519 ◽  
Author(s):  
S. Adachi ◽  
Y. Oshikubo ◽  
A. Tsukamoto ◽  
Y. Ishimaru ◽  
T. Hato ◽  
...  

2000 ◽  
Vol 209 (1) ◽  
pp. 8-14 ◽  
Author(s):  
Q.K Yang ◽  
J.X Chen ◽  
A.Z Li
Keyword(s):  

1984 ◽  
Vol 68 (1) ◽  
pp. 398-405 ◽  
Author(s):  
R.D. Dupuis ◽  
R.C. Miller ◽  
P.M. Petroff

2011 ◽  
Vol 21 (3) ◽  
pp. 306-310 ◽  
Author(s):  
Oleg Y. Volkov ◽  
Yuri Y. Divin ◽  
Vladimir N. Gubankov ◽  
Irina I. Gundareva ◽  
Valery V. Pavlovskiy

Author(s):  
Mary Gopanchuk ◽  
Mohamed Arabi ◽  
N. Nelson-Fitzpatrick ◽  
Majed S. Al-Ghamdi ◽  
Eihab Abdel-Rahman ◽  
...  

This paper reports on the design, fabrication, and characterization of non-interdigitated comb drive actuators in Silicon-on-Insulator (SOI) wafers, using a single mask surface microma-chining process. The response of the actuator is analyzed numerically and experimentally. The results show at the fundamental frequency; it behaves as a longitudinal comb drive actuator. At a higher frequency, it exhibits a high-quality factor which is appropriate for sensor applications.


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