Study of the crosslinking process in fluorinated poly(imide-amide)s containing pendant cyano groups

1994 ◽  
Vol 6 (3) ◽  
pp. 183-191 ◽  
Author(s):  
M Bruma ◽  
F Mercer ◽  
B Schulz ◽  
R Dietel ◽  
J Fitch ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Aromatic Diamines ◽  
Crosslinking Process ◽  
Thermal Crosslinking ◽  
Cyano Groups ◽  
Poly Imide ◽  
Solution Polycondensation

Fluorinated poly(imide-amide)s containing pendant cyano groups have been synthesized by solution polycondensation of aromatic diamines which contain cyano groups with diacid chlorides which have both hexafluoroisopropylidene and imnide groups. Thermal crosslinking of these polymers has been attempted in NMP, or by heating the polymer films up to 370-400 'C. The solubility, thermal stability, glass transition temperature and dielectric constant of both linear and crosslinked polymers have been studied.

Design of low dielectric constant polybenzoxazine nanocomposite using mesoporous mullite

2016 ◽  
Vol 29 (2) ◽  
pp. 141-150 ◽  
Author(s):  
K Ilango ◽  
P Prabunathan ◽  
E Satheeshkumar ◽  
P Manohar
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Thermal Studies ◽  
Microscopic Analysis ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Porous Morphology

In this present work, porous mullites (PM0–5) were synthesized through a template-assisted method using various weight percentages of pluronic (P-123). PM5 obtained using 10 wt% of P-123 was found to show maximum porosity (3.8 Å) and low dielectric constant value (2.4). PM5 was functionalized using glycidyl-terminated silane and denoted as FPM and various weight percentages of FPM were reinforced with polybenzoxazine (PBZ) matrix in order to develop FPM/PBZ nanocomposites. The thermal studies indicate that 1.5 wt% of FPM/PBZ nanocomposite showed improved thermal stability with 34% char yield at 800°C and 162°C as glass transition temperature. It also exhibits low dielectric constant (2.6) than that of the neat PBZ matrix and other FPM/PBZ nanocomposites. The microscopic analysis confirms the homogenous dispersion of FPM into the PBZ polymer that has a porous morphology. The results suggest that the as-synthesized mesoporous mullite with low dielectric constant ( k), synthesized via template-assisted method can be used as a reinforcement to decrease the dielectric constant of polymeric material, which is of industrial significance.

Synthesis and Characterization of New Fluorinated Poly(Imide Benzoxazole)S

1996 ◽  
Vol 8 (3) ◽  
pp. 395-406 ◽  
Author(s):  
Frank W Mercer ◽  
Martin T McKenzie ◽  
Maria Bruma ◽  
Burkhard Schulz
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Synthesis And Characterization ◽  
Aromatic Diamines ◽  
Film Forming ◽  
Poly Imide

We have prepared a series of fluorinated aromatic poly(ether imide benzoxazole)s (PEIBs) and fluorinated aromatic poly(imide benzoxazole)s (PIBs). New PEIBs were prepared by polycondensation of aromatic diamines containing both benzoxazole and hexafluoroisopropylidene groups. New PIBs were prepared by polycondensation of bis( o-aminophenol)s, such as 3,3′-dihydroxybenzidine or 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, with diacid chlorides containing both imide and hexafluoroisopropylidene groups. We have characterized the solubility, film forming ability, thermal stability and dielectric constant of these fluorinated poly(imide benzoxazole)s.

Aromatic Poly(ether imide oxadiazole)s

1992 ◽  
Vol 4 (2) ◽  
pp. 73-80 ◽  
Author(s):  
F. W. Mercer
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Aprotic Solvent ◽  
Dielectric Constants ◽  
Aromatic Diamines ◽  
Glass Transition Temperatures ◽  
Good Thermal Stability ◽  
Polar Aprotic Solvent ◽  
Carbonate Reaction ◽  
Poly Imide

Two oxadiazole containing aromatic diamines were synthesized. The diamines were prepared by reaction of aminophenols with 2,5-bis(4-fluorophenyl)-4l3,4-oxadiazole in a polar aprotic solvent in the presence of potassium carbonate. Reaction of the resulting 2,5-bis(4-(aminophenoxy)phenyl)-1,3,4-oxadiazoles with dianhydrides gave a series of polymeric amic acids. Thermal treatment yielded poly(imide ether oxadazole) films which displayed good thermal stability, flexibility, and glass transition temperatures ranging from 241 to 344C. The dielectric constants of the films were characterized as a function of relative humidity.

Polyimides Containing 1,3,4-Oxadiazole Rings

2008 ◽  
Vol 73 (12) ◽  
pp. 1631-1644 ◽  
Author(s):  
Maria Bruma ◽  
Mariana-Dana Damaceanu
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Main Chain ◽  
The Other ◽  
Carbonyl Groups ◽  
Aromatic Diamines ◽  
Film Forming ◽  
As Solubility

Two series of polyimides containing 1,3,4-oxadiazole rings in the main chain, one of them having flexible hexafluoropropane-2,2-diyl groups and the other with carbonyl groups, were prepared by polycondensation of aromatic diamines containing 1,3,4-oxadiazole rings with hexafluoropropane-2,2-diyl-bis(phthalic anhydride) or benzophenonetetracarboxylic dianhydride. Their properties, such as solubility in organic solvents, thermal stability, glass transition temperature, photoluminescence and film-forming properties of the two groups of polymers have been studied and compared.

Poly(1, 3, 4-Oxadiazole-Amide)s Containing Pendent Phenoxy Groups

1996 ◽  
Vol 8 (4) ◽  
pp. 507-514 ◽  
Author(s):  
Corneliu Hamciuc ◽  
Elena Hamciuc ◽  
Maria Bruma
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Aromatic Diamines ◽  
Diacid Chloride ◽  
Solution Polycondensation

A series of new poly(1, 3, 4-oxadiazole-amide)s have been synthesized by solution polycondensation of aromatic diamines containing preformed 1, 3, 4-oxadiazole rings with phenoxyterephthalic diacid chloride or by the reaction of the same diacid chloride with p-aminobenzhydrazide resulting in a polyhydrazide-amide which was cyclodehydrated to the corresponding oxadiazolic structure. The new polymers were soluble or partially soluble in polar amidic solvents, were stable up to 375–400 °C in air and had a glass transition temperature in the range of 225–272 °C.

Investigating the role of GeO2 in enhancing the thermal stability and proton mobility of proton-conducting phosphate glasses

2021 ◽  
Author(s):  
Takahisa Omata ◽  
Aman Sharma ◽  
Takuya Kinoshita ◽  
Issei Suzuki ◽  
Tomohiro Ishiyama ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Phosphate Glasses ◽  
Proton Mobility ◽  
Proton Conducting

In this study, the effect of GeO2 on the thermal stability and proton mobility (μH) of proton-conducting phosphate glasses was experimentally investigated using 22HO1/2−3NaO1/2−(12−x)LaO3/2−xGeO2−63PO5/2 glasses. Increasing glass transition temperature (Tg)...

Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

1997 ◽  
Vol 476 ◽  
Author(s):  
P. H. Townsend ◽  
S. J. Martin ◽  
J. Godschalx ◽  
D. R. Romer ◽  
D. W. Smith ◽  
...  
Keyword(s):  
Thin Film ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Integrated Circuits ◽  
Room Temperature ◽  
Polymer Network ◽  
Flow Characteristics ◽  
Interlayer Dielectric

AbstractA novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipment and produces highly uniform films after curing at 400 °C to 450 °C. The oligomeric solution, with a viscosity of ca. 30 cPs, is readily handled on standard thin film coating equipment. Polymerization does not require a catalyst. There is no water evolved during the polymerization. The resulting polymer network is an aromatic hydrocarbon with an isotropie structure and contains no fluorine.The properties of the cured films are designed to permit integration with current ILD processes. In particular, the rate of weight-loss during isothermal exposures at 450 °C is ca. 0.7 wt.%/hour. The dielectric constant of cured SiLK has been measured at 2.65. The refractive index in both the in-plane and out-of-plane directions is 1.63. The flow characteristics of SiLK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm. The glass transition temperature for the fully cured film is greater than 490 °C. The coefficient of thermal expansivity is 66 ppm/°C below the glass transition temperature. The stress in fully cured films on Si wafers is ca. 60 MPa at room temperature. The fracture toughness measured on thin films is 0.62 MPa m ½. Thin coatings absorb less than 0.25 wt.% water when exposed to 80% relative humidity at room temperature.

Contribution of Electrostriction in Polyurethane/Polyaniline Blends

2014 ◽  
Vol 1025-1026 ◽  
pp. 697-702
Author(s):  
Darika Jaaoh ◽  
Chatchai Putson ◽  
Nantakan Muensit
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Polymer Blend ◽  
Hard Segment ◽  
Filler Content ◽  
Domain Formation ◽  
Space Charges ◽  
Electrostrictive Polymer

In this work, we present a series of electrostrictive polymer blend that can potentially be used as actuators for a variety of applications. This polymer blend combines an electrostrictive polyurethane with a conductivity polyaniline polymer. The effect of filler content has been investigated. The structures of the blends, the electrical and mechanical properties which affect electrostrictive behavior were studied. The results showed that both dielectric constant and glass transition temperature of the blends increase with increasing polyaniline contents. Moreover, it was noted that space charges distribution and hard-segment domain formation significantly related with electrostrictive coefficient of polymer blend. Therefore, electrostriction behavior in the polymer blends has been demonstrated, and optimal microstructure for electrostriction enhancement has been identified.

Nanocomposite Epoxy Resin for SiC Module

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000196-000200 ◽  
Author(s):  
Kenji Okamoto ◽  
Yuji Takematsu ◽  
Miyako Hitomi ◽  
Yoshinari Ikeda ◽  
Yoshikazu Takahashi
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Epoxy Resin ◽  
Molecular Motion ◽  
Experimental Results ◽  
Power Module ◽  
Operation Temperature ◽  
Thermal Stability Of

There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.

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