Flexible graphene composites with high thermal conductivity as efficient heat sinks in high-power LEDs

2018 ◽  
Vol 52 (2) ◽  
pp. 025103 ◽  
Author(s):  
J Oliva ◽  
A I Mtz-Enriquez ◽  
A I Oliva ◽  
R Ochoa-Valiente ◽  
C R Garcia ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Heat Sinks ◽  
High Thermal Conductivity

Efficient Heat Dissipation Design of High-Power Multi-Chip Cob Package Led Modules

2012 ◽  
Vol 463-464 ◽  
pp. 1332-1340 ◽  
Author(s):  
Lei Wu ◽  
Xiao Yun Xiong ◽  
De Xing Wang
Keyword(s):  
Thermal Conductivity ◽  
Forced Convection ◽  
High Power ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Ir Camera ◽  
Chip Size ◽  
Computational Fluid Dynamics Cfd ◽  
Convection Cooling

In this study, the junction temperature (Tj) and thermal resistance (Rth) of five high-power multi-chip COB (chip-on-board) LED packages with different chip spacings were compared. The actual Tjwas measured by an IR camera and compared with the simulation results from a computational fluid dynamics (CFD) software. In addition, the effects of heat slugs with different thermal conductivity, heat sinks of various thicknesses, chip size, and forced convection cooling on the Tjand Rthof high-powered LED components were investigated. The experimental results show that smaller chip spacing resulted in higher Tjand Rth. The heat dissipation performance can be improved by using a heat slug with a high thermal conductivity; and increasing the thickness of the heat sink, or employing forced convection cooling.

Achieving high thermal conductivity from AlN films deposited by high-power impulse magnetron sputtering

2014 ◽  
Vol 47 (35) ◽  
pp. 355303 ◽  
Author(s):  
K Ait Aissa ◽  
N Semmar ◽  
A Achour ◽  
Q Simon ◽  
A Petit ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Magnetron Sputtering ◽  
High Power ◽  
High Thermal Conductivity

A Study on Polymer Pin Fin Based Heat Sinks

2007 ◽  
Author(s):  
Ajmal Ansari
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Heat Sink ◽  
Heat Sinks ◽  
Polymer Additives ◽  
Pin Fin ◽  
Recent Developments ◽  
Engineering Polymers

Recent developments in polymer additives and formulations have made available resins that have thermal conductivity that is one to two orders of magnitude higher than that of typical engineering polymers. Such polymers can be potentially used for designing heat sinks. There are two primary advantages of polymer heat sinks: ability to form shapes that may not be feasible with metal and flexibility that allows the heat sink to be bent in various shapes. This paper presents results from a study that was conducted to determine the suitability of commercially available Flexible Heat Sink Material for use in cooling high power LED’s.

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