Electroplated Cr, Ni and Cu were used as interlayer for chemical vapor deposition (CVD)
diamond coating on WC–Co cemented carbide cutting tools. The electroplated interlayers were
studied by Scanning Electron Microscope (SEM), Electron Probe Micro Analyzer (EPMA) and
X-ray diffraction (XRD). The CVD diamond coatings were studied by SEM and Raman Scattering
Spectroscopy (Raman). The experimental results show that there is diffusion bonded interface
between electroplated layer and WC-Co substrate after H plasma treatment, the bond between
electroplated layers and WC-Co substrate changes from mechanical bond to metallurgical bond and
the adhesion becomes stronger. Electroplated Cr interlayer forms new phases of Cr3C2 and Cr7C3
under CVD conditions, while electroplated Ni and Cu interlayers do not form carbides under CVD
conditions. Cr carbides have good chemical compatibility to diamond, and they are propitious to
diamond nucleation and growth during the deposition period. The diamond crystal microstructure,
diamond quality and adhesion on Cr interlayer are better than those on electroplated Ni and Cu
interlayers.