Doubled Jc of Bi2Sr2CaCu2Ox wires by partial melting and recrystallization heat treatment under 10 bar after vacuum degassing of precursor powder and pre-densifying of the wires

Author(s):  
Qingbin Hao ◽  
Chengshan Li ◽  
Xiaoyan Xu ◽  
Gaofeng Jiao ◽  
Guoqing Liu ◽  
...  
2019 ◽  
Vol 28 (4) ◽  
pp. 047401
Author(s):  
Li-Jun Cui ◽  
Ping-Xiang Zhang ◽  
Jin-Shan Li ◽  
Guo Yan ◽  
Yong Feng ◽  
...  

1990 ◽  
Vol 5 (12) ◽  
pp. 2771-2779 ◽  
Author(s):  
Paul C. McIntyre ◽  
Michael J. Cima ◽  
Man Fai Ng ◽  
Raymond C. Chiu ◽  
Wendell E. Rhine

The effect of heat treatment on microstructure development in Ba2YCu3O7−x films prepared from metal trifluoroacetate precursors is investigated. The growth of textured Ba2YCu3O7−x on BaZrO3 substrates is shown to be strongly influenced by the furnace atmosphere used during calcination. Differential thermal analysis was used to show that conditions that promote c-axis texture are also those which cause partial melting of Ba–Y–Cu–O compositions that are depleted in barium relative to Ba2YCu3O7−x.


1999 ◽  
Vol 14 (7) ◽  
pp. 3102-3110 ◽  
Author(s):  
Yumi H. Ikuhara ◽  
Yuji Iwamoto ◽  
Koichi Kikuta ◽  
Shin-ichi Hirano

Stable and homogeneous alkoxide precursor solutions of lithium ethoxyethoxide and manganese ethoxyethoxide in 2-ethoxyethanol were synthesized by ligand exchange reaction of lithium isopropoxide and manganese 2-ethoxide, respectively, with 2-ethoxyethanol. [Li–Mn–O] precursor solution was prepared by mixing these modified alkoxide precursor solutions. LiMn2O4 powders were successfully synthesized by pyrolysis of the [Li–Mn–O] precursor powder in O2 temperature as low as 200 °C. The nanocrystalline LiMn2O4 powders 20–50 mm in diameter after heat treatment up to 700 °C consisted of the ordered (111) plane and performed with good cyclability as the cathode materials for Li secondary batteries.


Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


Author(s):  
E. Bischoff ◽  
O. Sbaizero

Fiber or whisker reinforced ceramics show improved toughness and strength. Bridging by intact fibers in the crack wake and fiber pull-out after failure contribute to the additional toughness. These processes are strongly influenced by the sliding and debonding resistance of the interfacial region. The present study examines the interface in a laminated 0/90 composite consisting of SiC (Nicalon) fibers in a lithium-aluminum-silicate (LAS) glass-ceramic matrix. The material shows systematic changes in sliding resistance upon heat treatment.As-processed samples were annealed in air at 800 °C for 2, 4, 8, 16 and 100 h, and for comparison, in helium at 800 °C for 4 h. TEM specimen preparation of as processed and annealed material was performed with special care by cutting along directions having the fibers normal and parallel to the section plane, ultrasonic drilling, dimpling to 100 pm and final ionthinning. The specimen were lightly coated with Carbon and examined in an analytical TEM operated at 200 kV.


Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.


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