scholarly journals Computer simulation of thermal expansion of the charge of liquid nitrogen in the process of heat load

2020 ◽  
Vol 1661 ◽  
pp. 012091
Author(s):  
D Yerezhep ◽  
A Aldiyarov ◽  
D Sokolov ◽  
A Nurmukan
1993 ◽  
Vol 323 ◽  
Author(s):  
David A. Lilienfeld ◽  
Peter Børgesen ◽  
Che-Yu Li

AbstractMicroelectronic packages undergo substantial thermal excursions during processing and often in service. Differences in the thermal expansion of the various components may therefore lead to fatigue of the interconnects. A computer simulation has been developed which is based on a damage integral approach for the modeling of damage and failure in the various bonding layers found throughout such a package. This code should apply equally well to solder die bonds and polymeric or epoxy adhesive layers, assuming that the corresponding crack growth parameters and constitutive relations are known. Using literature values for these properties, predictions have been compared to experimental thermal cycling data for solder die bonds. Consequences for the extrapolation of accelerated test results to service conditions are discussed.


Cryogenics ◽  
2012 ◽  
Vol 52 (12) ◽  
pp. 674-678
Author(s):  
H.H. Tsai ◽  
C.P. Liu ◽  
F.Z. Hsiao ◽  
T.Y. Huang ◽  
H.C. Li ◽  
...  

2013 ◽  
Vol 20 (4) ◽  
pp. 567-580 ◽  
Author(s):  
Lin Zhang ◽  
Manuel Sánchez del Río ◽  
Giulio Monaco ◽  
Carsten Detlefs ◽  
Thomas Roth ◽  
...  

X-ray crystal monochromators exposed to white-beam X-rays in third-generation synchrotron light sources are subject to thermal deformations that must be minimized using an adequate cooling system. A new approach was used to measure the crystal shape profile and slope of several cryogenically cooled (liquid nitrogen) silicon monochromators as a function of beam powerin situand under heat load. The method utilizes multiple angular scans across the Bragg peak (rocking curve) at various vertical positions of a narrow-gap slit downstream from the monochromator. When increasing the beam power, the surface of the liquid-nitrogen-cooled silicon crystal deforms from a concave shape at low heat load to a convex shape at high heat load, passing through an approximately flat shape at intermediate heat load. Finite-element analysis is used to calculate the crystal thermal deformations. The simulated crystal profiles and slopes are in excellent agreement with experiments. The parameters used in simulations, such as material properties, absorbed power distribution on the crystal and cooling boundary conditions, are described in detail as they are fundamental for obtaining accurate results.


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