scholarly journals Influence of the Agitation Pipe on the Flow Field of Electroplating Tank in the Electroplated Diamond Wire Saw

2021 ◽  
Vol 2125 (1) ◽  
pp. 012063
Author(s):  
Derong Duan ◽  
Peiqi Ge ◽  
Zhigang Gong ◽  
Fuli Huang ◽  
Guangzhou Cao
Keyword(s):  
Fluid Flow ◽  
Flow Field ◽  
Dead Zone ◽  
Uneven Distribution ◽  
Sand Blasting ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
The Difference

Abstract In order to solve the problem of diamonds sedimentation in electroplating tank and uneven distribution of diamonds in coatings, the fluid flow in the electroplating tank formed by three structure kinds of agitation pipe was compared and analysed. Results showed that the middle inlet type agitation pipe can significantly improve the fluid uniformity in the electroplating tank, and setting sand blasting ports at both ends of the agitation pipe can avoid the formation of fluid “dead zone”. Along the direction of the agitation pipe, the middle inlet type agitation pipe improves the overall flow of the fluid. In the position of the wire saw passing through, the difference of the speed in the electroplating tank of the middle inlet type is 47.17% and 15.25%, which is significantly lower than that of the water inlet structure of one end by 134.48%. As a result, it can significantly improve the plating effect of the wire saw.

scholarly journals A Method For Cutting And Preparing Thin-Sections Of Frozen Soil

1977 ◽  
Vol 18 (78) ◽  
pp. 143-144 ◽  
Author(s):  
T.E. Osterkamp
Keyword(s):  
Cutting Forces ◽  
Frozen Soil ◽  
Operating Conditions ◽  
Operating Parameters ◽  
Thin Sections ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

Abstract A diamond wire saw was modified for cutting thin sections of frozen soil and suitable operating conditions were determined experimentally. It was found that a lubricated wire, 0.34 mm in diameter, operaied at cutting velocities of 100-300 mm s-1 and cutting forces 0.02-0.1 kg produced smooth cut surfaces un thin sections 0.4-0.5 mm in thickness. The; temperature and wire size were not critical operating parameters and the wire tensions recommended by the manufacturer were satisfactory. A method of mounting the thin sections is also described.

Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

2007 ◽  
Vol 359-360 ◽  
pp. 450-454 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge ◽  
Zhi Jian Hou
Keyword(s):  
Monocrystalline Silicon ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Surface Formation ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Abrasive

The physical model of fixed-abrasive diamond wire-sawing monocrystalline silicon was founded to analyze the elastic deformation of the wire, supposing that every grit was connected to the surface of the wire by a spring. Ignoring lateral vibration of the wire, the geometrical model of wire-sawing was founded; the average cut depth of single grit was calculated theoretically. Based the indentation fracture mechanics and investigations on brittle-ductile transition of machining monocrystalline silicon, the removal mechanism and surface formation was studied theoretically. It shows that in the case of wire-sawing velocity of 10m/s or higher, infeed velocity of 0.20mm/s and diamond grain size of 64μm or smaller, the chip formation and material removal is in a brittle regime mainly, but the silicon wafer surface formation is sawed in a ductile regime. The size of the abrasives, the wire-saw velocity and infeed velocity can influence the sawing process obviously.

Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis

2009 ◽  
Vol 416 ◽  
pp. 311-315 ◽  
Author(s):  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Shao Jie Li ◽  
Zhi Jian Hou
Keyword(s):  
Current Density ◽  
High Performance ◽  
Experimental Studies ◽  
Cathode Current Density ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cathode Current ◽  
The Wire ◽  
Electroplating Process

Development of high performance diamond impregnated wire is the key of application for fixed-abrasive wire sawing technology. In this paper, some experimental studies were done for development of electroplated diamond wire saw by employing the bright nickel bath. The wire saw electroplating process was developed, the effects of cathode current density and time at tack-on stage on diamond grits density and adhesion between saw matrix and plating coating were discussed. The wire saw cutting experiments were carried out for analysis the used wire wear using the scanning electron microscope (SEM). The experimental results show the optimum tack-on current density to obtain the wire saw with good abrasive distribution and adhesion is 1.5~2.0A/dm2, and the time of pre-plating, tack-on and buildup is 6, 8~10 and 18min in turn. Diamond wire saw wear includes coating wear and grain-abrasion, and the primary wear form is grits pulled-out.

Die fühlende Seilschleifmaschine/The feeling diamond wire saw – Development of a force-controlled all-electric mobile diamond wire saw

2020 ◽  
Vol 110 (09) ◽  
pp. 602-607
Author(s):  
Berend Denkena ◽  
Benjamin Bergmann ◽  
Björn-Holger Rahner
Keyword(s):  
Force Control ◽  
Force Measurement ◽  
Low Cost ◽  
Strain Gauges ◽  
Electric Force ◽  
Diamond Wire ◽  
Electric System ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

Das mobile Seilschleifen ist ein hochflexibles und produktives Trennschleifverfahren. Nachteilig ist jedoch der Einsatz von unterschiedlichen Energieformen. Für einen rein elektrischen Betrieb fehlt das Wissen über die wirkende Seilspannung, sodass eine elektrische Kraftregelung der Seilspannung unzureichend möglich ist (Seilriss). In diesem Beitrag werden ein Ansatz zur kostengünstigen Seilkraftmessung (Dehnungsmessstreifen) und Einflüsse auf die Seilkraftmessung vorgestellt.   Mobile wire sawing is a highly flexible and productive cut-off grinding process. However, a disadvantage is the use of different forms of energy. As there is no knowledge on the wire force applied in a fully electric system, an electric force control of the wire tension can only be performed insufficently (wire break). This paper presents an approach to low-cost wire force measurement (strain gauges) and influences on wire force measurement.

Abrasive Distribution of the Fixed Diamond Wire in Wire Sawing Process

2012 ◽  
Vol 579 ◽  
pp. 145-152 ◽  
Author(s):  
Chun Hui Chung
Keyword(s):  
Material Removal ◽  
Wafer Surface ◽  
Operating Environment ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cutting Rate ◽  
The Wire ◽  
Fixed Diamond Wire ◽  
Sawing Process

Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.

Experimental Investigation on Cutting Aluminum Alloy Thick Plate with Brazed Diamond Wire Saw

2012 ◽  
Vol 426 ◽  
pp. 218-222 ◽  
Author(s):  
Bing Xiao ◽  
Shu Sheng Li ◽  
F.L. Zhang ◽  
B. Wang ◽  
S. Li
Keyword(s):  
Aluminum Alloy ◽  
High Frequency ◽  
Thick Plate ◽  
Wire Surface ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Experimental Cutting ◽  
The Wire ◽  
High Frequency Induction

A new high frequency induction brazed monolayer diamond wire saw for cutting aluminum alloy thick plate is developed with the helical continuous cutting edge distance on the wire surface. In order to solve the problems of forming cutting aluminum alloy plates,the brazed diamond wire saw is used to conduct the preliminary cutting tests on the 50 mm aluminum alloy plates on the modified grinder experimental platform.The results indicate that the cutting efficiency of the brazed diamond wire saw is increased with the increasing of the feed tension, the wire saw line speed and the diamond grits size. Furthermore, some cutting chips shape of the aluminum alloy is presented based on experimental cutting.

scholarly journals A Method For Cutting And Preparing Thin-Sections Of Frozen Soil

1977 ◽  
Vol 18 (78) ◽  
pp. 143-144 ◽  
Author(s):  
T.E. Osterkamp
Keyword(s):  
Cutting Forces ◽  
Frozen Soil ◽  
Operating Conditions ◽  
Operating Parameters ◽  
Thin Sections ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

AbstractA diamond wire saw was modified for cutting thin sections of frozen soil and suitable operating conditions were determined experimentally. It was found that a lubricated wire, 0.34 mm in diameter, operaied at cutting velocities of 100-300 mm s-1 and cutting forces 0.02-0.1 kg produced smooth cut surfaces un thin sections 0.4-0.5 mm in thickness. The; temperature and wire size were not critical operating parameters and the wire tensions recommended by the manufacturer were satisfactory. A method of mounting the thin sections is also described.

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

2016 ◽  
Vol 139 (4) ◽  
Author(s):  
Shujuan Li ◽  
Aofei Tang ◽  
Yong Liu ◽  
Jiabin Wang ◽  
Dan Cui ◽  
...  
Keyword(s):  
Cutting Forces ◽  
Machining Process ◽  
Force Model ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
The Relationship ◽  
Fixed Abrasive ◽  
Analytical Force Model

Free abrasive diamond wire saw machining is often used to cut hard and brittle materials, especially for wafers in the semiconductor and optoelectronics industries. Wire saws, both free and fixed abrasive, have excellent flexibility, as compared to inner circular saws, outer saws, and ribbon saws, as they produce a narrower kerf, lower cutting forces, and less material waste. However, fixed abrasive wire saw machining is being considered more and more due to its potential for increased productivity and the fact that it is more environmentally friendly as it does not use special coolants that must be carefully disposed. The cutting forces generated during the wire saw process strongly affect the quality of the produced parts. However, the relationship between these forces and the process parameters has only been explored qualitatively. Based on analyzing the forces generated from the chip formation and friction of a single abrasive, this study derives an analytical cutting force model for the wire saw machining process. The analytical model explains qualitative observations seen in the literature describing the relationship between the cutting forces and the wafer feed rate, wire velocity, and contact length between the wire and wafer. Extensive experimental work is conducted to validate the analytical force model. Silicon carbide (SiC) monocrystal, which is employed extensively in the fields of microelectronics and optoelectronics and is known to be particularly challenging to process due to its extremely high hardness and brittleness, is used as the material in these experimental studies. The results show that the analytical force model can predict the cutting forces when wire saw machining SiC monocrystal wafers with average errors between the experimental and predicted normal and tangential forces of 9.98% and 12.1%, respectively.

Analysis of the Breakage of Diamond Wire Saws in Sawing of Stone

2006 ◽  
Vol 304-305 ◽  
pp. 123-126 ◽  
Author(s):  
Guo Qin Huang ◽  
Xi Peng Xu
Keyword(s):  
Fatigue Failure ◽  
Process Parameters ◽  
Processing Parameters ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

An investigation is reported on the breakage of the diamond wire saw during stone processing. A Lot of breaken wire samples were collected from factories and observed macroscopically and microscopically. The results indicate that the breakages were mainly fatigue failure. And statistic of results show that all the breakage sites centralize on two sections. Reasons for the two break sections are also discussed in detail. Furthermore, sawing experiment was conducted to study the effect of the process parameters and the results reveal that the breakage of the wire saw is sensitive to the processing parameters. Finally, some proposals for manufacture and application were presented.

Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

2010 ◽  
Vol 431-432 ◽  
pp. 25-28 ◽  
Author(s):  
Li Gang Zhao ◽  
Dun Wen Zuo ◽  
Yu Li Sun ◽  
Min Wang
Keyword(s):  
Surface Roughness ◽  
Experimental Research ◽  
Linear Velocity ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Diamond Wire

The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed.

Sign in / Sign up

Export Citation Format

Share Document