scholarly journals Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

2008 ◽  
Vol 72 (3) ◽  
pp. 244-248 ◽  
Author(s):  
Tomotake Tohei ◽  
Ikuo Shohji ◽  
Keisuke Yoshizawa ◽  
Masaharu Nishimoto ◽  
Takayuki Kawano ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Life Evaluation ◽  
Chip Size ◽  
Fatigue Life Evaluation ◽  
Free Solder

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

2008 ◽  
Vol 385-387 ◽  
pp. 433-436 ◽  
Author(s):  
Ikuo Shohji ◽  
Tomotake Tohei ◽  
Keisuke Yoshizawa ◽  
Masaharu Nishimoto ◽  
Yasushi Ogawa ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Thermal Cycle ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Chip Size ◽  
Free Solder ◽  
Temperature Amplitude

Accelerated thermal cycling (ATC) tests were conducted to investigate an effect of thermal cycle conditions on thermal fatigue life of a chip size package (CSP) lead-free solder joint. A ternary Sn-Ag-Cu alloy was used as a lead-free solder material. For frequency of thermal cycle (1~3 cycles/h) and maximum (388~423 K) and minimum (223~273 K) temperatures investigated, the effects of them on thermal fatigue life of the solder joint were slight. On the contrary, correlation was recognized between temperature amplitude and thermal fatigue life of the solder joint. The thermal fatigue life increased with decreasing temperature amplitude. The relationship obeyed the Coffin-Manson’s type equation.

Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 283-284
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Mineo KOBAYASHI ◽  
Nobutada OHNO ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Thermal Fatigue Life ◽  
Fatigue Life Estimation ◽  
Free Solder

scholarly journals Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints

2004 ◽  
Vol 7 (4) ◽  
pp. 308-313 ◽  
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Nobutada OHNO
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Free Solder

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)

2003 ◽  
Author(s):  
John Lau ◽  
Walter Dauksher
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Boards ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Thermal Fatigue Life ◽  
Free Solder

In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The CCGA (ceramic column grid array) package developed by IBM is one of the best candidates for housing these kinds of chips [1–7]. There are two parts in this study. One is to show that the 2-parameter Weibull life distribution is adequate for modeling the thermal-fatigue life of lead-free solder joints. This is demonstrated by comparing the 2-parameter and 3-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5wt%Sn3.9wt%Ag0.6wt%Cu lead-free solder paste on lead-free PCBs (printed circuit boards) under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density of the 1657-pin CCGA solder column with two different solder paste materials, namely, 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb and under three different thermal cycling profiles, namely, 25 ↔ 75°C, 0 ↔ 100°C, and −25 ↔ 125°C. The effects of these solder pastes and temperature conditions on the thermal-fatigue life of the high-lead (10wt%Sn90wt%Pb) solder columns of the CCGA package are provided and discussed.

Application of Finite Element Method in Optimal Design of Flip-Chip Package

2011 ◽  
Vol 264-265 ◽  
pp. 1660-1665
Author(s):  
Yong Cheng Lin ◽  
Yu Chi Xia
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

More and more solder joints in circuit boards and electronic products are changing to lead free solder, placing an emphasis on lead free solder joint reliability. Solder joint fatigue failure is a serious reliability concern in area array technologies. In this study, the effects of substrate materials on the solder joint thermal fatigue life were investigated by finite element model. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints. The thermal strain/stress in solder joints of flip chip assemblies with different substrates was compared, and the fatigue life of solder joints were evaluated by Darveaux’s crack initiation and growth model. The results show the mechanisms of substrate flexibility on improving solder joint thermal fatigue.

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

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