scholarly journals Non-stationary temperature field of the heating device in the conditions of unsteady thermal field of the space

2021 ◽  
Vol 1030 ◽  
pp. 012087
Author(s):  
Robert Akhverdashvili ◽  
Aleksandr Gulkanov ◽  
Konstantin Modestov
Keyword(s):  
Temperature Field ◽  
Thermal Field ◽  
Stationary Temperature Field ◽  
Heating Device

scholarly journals Analytical study of the non-stationary temperature field of a thermally thin plate

2021 ◽  
Vol 1155 (1) ◽  
pp. 012007
Author(s):  
I I Latypov ◽  
L A Bigaeva ◽  
G S Mukhametshina ◽  
N A Shaikhutdinova ◽  
A Y Gilev
Keyword(s):  
Temperature Field ◽  
Thin Plate ◽  
Analytical Study ◽  
Stationary Temperature Field

scholarly journals NUMERICAL MODELING OF GAS TURBINE COOLED BLADES

Aviation ◽  
2005 ◽  
Vol 9 (3) ◽  
pp. 9-18
Author(s):  
Arif Pashayev ◽  
Djakhangir Askerov ◽  
Ramiz Ali Cabar oqlu Sadiqov
Keyword(s):  
Numerical Modeling ◽  
Temperature Field ◽  
Numerical Methods ◽  
Mathematical Models ◽  
Gas Turbine ◽  
Point Of View ◽  
Theoretical Substantiation ◽  
Stationary Temperature Field ◽  
Methods Of Calculation ◽  
Effective Combination

In contrast to methods that do not take into account multiconnectivity in a broad sense of this term, we develop mathematical models and highly effective combination (BIEM and FDM) numerical methods of calculation of stationary and quasi‐stationary temperature field of a profile part of a blade with convective cooling (from the point of view of realization on PC). The theoretical substantiation of these methods is proved by appropriate theorems. For it, converging quadrature processes have been developed and the estimations of errors in the terms of A. Ziqmound continuity modules have been received.

Placement Optimization for Thermal Performance of Embedded Power Chip Microwave Modules Using BP-GA

2011 ◽  
Vol 189-193 ◽  
pp. 639-642
Author(s):  
Sheng Zhang ◽  
Zhao Hua Wu ◽  
Hong Yan Huang ◽  
Pin Chen ◽  
Tang Wen Bi
Keyword(s):  
Finite Element Analysis ◽  
Temperature Field ◽  
Thermal Field ◽  
Thermal Design ◽  
Internal Temperature ◽  
Element Analysis ◽  
Thermal Distribution ◽  
Placement Optimization ◽  
Field Distributions ◽  
Embedded Power

In the thermal design of Embedded Power Chip Microwave Modules, the placement of chips on substrate has a significant effect on internal temperature field, thus, influence the reliability of the modules. In this paper, Based on BP-GA, the optimization for chips placement of EPCM is achieved by corresponding optimization program. To demonstrate the effectiveness of the results, ANSYS, finite element analysis (FEA) is carried out to assess the thermal field distribution of the optimization for chips placement. The result shows that the thermal field distributions of the optimization are consistent with the FEA results. The internal highest temperature of the initial placements is 90.369°C. After optimization, the internal highest temperature is 86.128°C, the highest temperature be reduced more than 5°C. It can effectively deal with the problem about optimize the thermal placement of EPCM chips, and improves the internal thermal distribution.

scholarly journals Analysis of spatial thermal field in a magnetic bearing

Open Physics ◽  
2018 ◽  
Vol 16 (1) ◽  
pp. 52-56
Author(s):  
Dawid Wajnert ◽  
Bronisław Tomczuk
Keyword(s):  
Temperature Field ◽  
Mathematical Models ◽  
Computer Simulations ◽  
Thermal Field ◽  
Three Dimensional ◽  
Magnetic Bearing ◽  
Field Analysis ◽  
Two Dimensional ◽  
Temperature Distributions ◽  
Dimensional Simulation

AbstractThis paper presents two mathematical models for temperature field analysis in a new hybrid magnetic bearing. Temperature distributions have been calculated using a three dimensional simulation and a two dimensional one. A physical model for temperature testing in the magnetic bearing has been developed. Some results obtained from computer simulations were compared with measurements.

HEAT TRANSFER INVESTIGATION FOR A MULTILAYER INSULATION SYSTEM VIA RADIATIVE-CONDUCTIVE APPROACH UNDER LOW TEMPERATURE CONDITIONS IN SPACE

2020 ◽  
Vol 19 (2) ◽  
pp. 70
Author(s):  
G. N. Lacerda ◽  
M. F. Curi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Temperature Field ◽  
Insulation System ◽  
Final Temperature ◽  
Space Applications ◽  
Conduction Heat Transfer ◽  
Stationary Temperature Field ◽  
Layer Density ◽  
Multilayer Insulation

Thermal insulation is an important area, not restricted to mechanical engineering, but widely studied in environmentalissues, such as global warming and, above all, energy-saving, since controlling the heat flux on microprocessorsthrough temperature control on components in space applications. This work focuses on controlling the temperature incomponents that could not lose or gain so much heat in space, especiallywhen the overall safety of sending satellites onspecific missions is required. To ensure that, Multilayer Insulation (MLI) is used. With fluid mechanics and radiation-conductionheat transfer theory, it was possible to calculate the transient and stationary temperature field and heat flux inMLI. The boundary temperatures are specified at 300K and 4K. The results, from solving the resulting discretized ODE,simulated with fsolve and odeintScipy subroutines in Python, able to solve the equations numerically, were shown. Thedata given by the simulation was able to indicate the impacts of varying the layer density, emissivity of screen, the distancebetween screens and the perforation coefficient in stationary and transient approaches. A way to simulate the performanceof MLI numerically was presented. Modifying emissivity (e) showed variations higher than in the perforation coefficient(ξ). Layer density controls the distance between layers (d ), changing the conduction heat transfer. In the transient casesimulation, it was possible to notice that varying parameters impact in time to reach steady-state and final temperature.

Study on Thermal Placement Optimization of Embedded MCM

2011 ◽  
Vol 189-193 ◽  
pp. 2269-2273
Author(s):  
Chun Yue Huang ◽  
Tian Ming Li ◽  
Ying Liang ◽  
He Geng Wei
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Temperature Field ◽  
Field Distribution ◽  
Temperature Difference ◽  
Optimization Algorithm ◽  
Thermal Field ◽  
Maximum Temperature ◽  
Element Analysis ◽  
Placement Optimization

In the thermal design of embedded multi-chip module (MCM), the placement of chips has a significant effect on temperature field distributing, thus influences the reliability of the embedded MCM. The thermal placement optimization of chips in embedded MCM was studied in this paper, the goal of this work is to decrease temperature and achieve uniform thermal field distribution within embedded MCM. By using ANSYS the finite element analysis model of embedded MCM was developed, the temperature field distributing was calculated. Based on genetic algorithms, chips placement optimization algorithm of embedded MCM was proposed and the optimization chips placement of embedded MCM was achieved by corresponding optimization program. To demonstrate the effectiveness of the obtained optimization chips placement, finite element analysis (FEA) was carried out to assess the thermal field distribution of the optimization chips placement in embedded MCM by using ANSYS. The result shows that without chips placement optimizing the maximum temperature and temperature difference in embedded MCM model are 87.963°C and 2.189°C respectively, by using chips placement optimization algorithm the maximum temperature drop than the original 0.583°C and the temperature difference is only 0.694°C . It turns out that the chip placement optimization approach proposed in this work can be effective in providing thermal optimal design of chip placement in embedded MCM.

Sign in / Sign up

Export Citation Format

Share Document