Benefits of two-dimensional detectors for synchrotron X-ray diffraction studies of thin film mechanical behavior

Performing a completein situmechanical property analysis of polycrystalline thin films using X-ray diffraction is time consuming with most standard diffraction beamlines at synchrotron facilities and not realistic with laboratory diffractometers. Two-dimensional detection is shown to enable relatively fast and reliable X-ray strain measurements duringin situtensile testing of gold films deposited on polyimide substrates. Advantages and drawbacks in the use of two-dimensional detectors for this type of analysis are discussed for two commonly used geometries: reflection and transmission.

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In situ structural analysis of BPDA-PPD polyimide thin film using two-dimensional grazing incidence X-ray diffraction

Powder Diffraction ◽

10.1154/1.2912446 ◽

2008 ◽

Vol 23 (2) ◽

pp. 109-112 ◽

Cited By ~ 1

Author(s):

J. Kikuma ◽

T. Nayuki ◽

T. Ishikawa ◽

S. Matsuno ◽

G. Asano

Keyword(s):

Thin Film ◽

Grazing Incidence ◽

Molecular Chain ◽

Curing Temperature ◽

Two Dimensional ◽

X Ray Diffraction ◽

Cooling Process ◽

X Ray ◽

Plane Direction

Structural development of BPDA-PPD polyimide thin film has been investigated by in situ grazing incidence X-ray diffraction at the BL24XU beamline of the SPring-8. Optimizing the sample shape, two-dimensional images were measured successfully without sacrificing angle resolution. It has been clearly shown that the crystallization first begins in the in-plane direction, at the curing temperature of 180 °C, in which the periodic structure of the molecular chain axis (c axis) is developed. The crystallization in the surface normal (out-of-plane) direction is observed later, at the curing temperature above 300 °C. A slight increase of the d spacing of the c axis during heating process has been observed, suggesting the stretching of the contracted molecular chain in accordance with the curing process. In the cooling process, the decrease of the d spacings for a and b axes was considerable, which indicates thermal expansion of the crystals at high temperatures. The increases in the peak intensities during the cooling process have been observed, which indicate the d spacing of each axis becomes close to the equilibrium value to produce higher periodicity.

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Measuring thin film and multilayer elastic constants by coupling in situ tensile testing with x-ray diffraction

Applied Physics Letters ◽

10.1063/1.1488701 ◽

2002 ◽

Vol 80 (25) ◽

pp. 4705-4707 ◽

Cited By ~ 61

Author(s):

K. F. Badawi ◽

P. Villain ◽

Ph. Goudeau ◽

P.-O. Renault

Keyword(s):

Thin Film ◽

Elastic Constants ◽

Tensile Testing ◽

X Ray Diffraction ◽

X Ray ◽

In Situ Tensile Testing

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In-situ investigation by X-ray diffraction and wafer curvature of phase formation and stress evolution during metal thin film – silicon reactions

Zeitschrift für Kristallographie Supplements ◽

10.1524/zksu.2007.2007.suppl_26.81 ◽

2007 ◽

Vol 2007 (suppl_26) ◽

pp. 81-89

Author(s):

O. Thomas

Keyword(s):

Thin Film ◽

Phase Formation ◽

Stress Evolution ◽

X Ray Diffraction ◽

X Ray ◽

Wafer Curvature ◽

Thin Film Silicon ◽

Metal Thin Film ◽

In Situ Investigation

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A Novel Technique to Determine Elastic Constants of Thin Films

MRS Proceedings ◽

10.1557/proc-1139-gg03-31 ◽

2008 ◽

Vol 1139 ◽

Author(s):

Klaus Martinschitz ◽

Rostislav Daniel ◽

Christian Mitterer ◽

Keckes Jozef

Keyword(s):

Thin Film ◽

Thin Films ◽

Elastic Moduli ◽

Elastic Anisotropy ◽

Interaction Model ◽

X Ray Diffraction ◽

X Ray ◽

Anisotropic Factor ◽

Polycrystalline Thin Films ◽

Cu Thin Film

AbstractA new X-ray diffraction technique to determine elastic moduli of polycrystalline thin films deposited on monocrystalline substrates is demonstrated. The technique is based on the combination of sin2ψ and X-ray diffraction wafer curvature techniques which are used to characterize X-ray elastic strains and macroscopic stress in thin film. The strain measurements must be performed for various hkl reflections. The stresses are determined from the substrate curvature applying the Stoney's equation. The stress and strain values are used to calculate hkl reflection dependent X-ray elastic moduli. The mechanical elastic moduli can be then extrapolated from X-ray elastic moduli considering film macroscopic elastic anisotropy. The derived approach shows for which reflection and corresponding value of the X-ray anisotropic factor Γ the X-ray elastic moduli are equal to their mechanical counterparts in the case of fibre textured cubic polycrystalline aggregates. The approach is independent of the crystal elastic anisotropy and depends on the fibre texture type, the texture sharpness, the amount of randomly oriented crystallites and on the supposed grain interaction model. The new method is demonstrated on a fiber textured Cu thin film deposited on monocrystalline Si(100) substrate. The advantage of the new technique remains in the fact that moduli are determined non-destructively, using a static diffraction experiment and represent volume averaged quantities.

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