scholarly journals A survey of thermal expansion coefficients for organic molecular crystals in the Cambridge Structural Database

Author(s):  
Andrew D. Bond

Typical ranges of thermal expansion coefficients are established for organic molecular crystals in the Cambridge Structural Database. The CSD Python API is used to extract 6201 crystal structures determined close to room temperature and at least one lower temperature down to 90 K. The data set is dominated by structure families with only two temperature points and is subject to various sources of error, including incorrect temperature reporting and missing flags for variable-pressure studies. For structure families comprising four or more temperature points in the range 90–300 K, a linear relationship between unit-cell volume and temperature is shown to be a reasonable approximation. For a selected subset of 210 structures showing an optimal linear fit, the volumetric expansion coefficient at 298 K has mean 173 p.p.m. K−1 and standard deviation 47 p.p.m.  K−1. The full set of 6201 structures shows a similar distribution, which is fitted by a normal distribution with mean 161 p.p.m. K−1 and standard deviation 51 p.p.m. K−1, with excess population in the tails mainly comprising unreliable entries. The distribution of principal expansion coefficients, extracted under the assumption of a linear relationship between length and temperature, shows a positive skew and can be approximated by two half normal distributions centred on 33 p.p.m. K−1 with standard deviations 40 p.p.m. K−1 (lower side) and 56 p.p.m. K−1 (upper side). The distribution for the full structure set is comparable to that of the test subset, and the overall frequency of biaxial and uniaxial negative thermal expansion is estimated to be < 5% and ∼30%, respectively. A measure of the expansion anisotropy shows a positively skewed distribution, similar to the principal expansion coefficients themselves, and ranges based on suggested half normal distributions are shown to highlight literature cases of exceptional thermal expansion.

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.


2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.


1985 ◽  
Vol 82 (3) ◽  
pp. 1611-1612 ◽  
Author(s):  
Stanley L. Segel ◽  
H. Karlsson ◽  
T. Gustavson ◽  
K. Edstrom

Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Christopher D. Harvey ◽  
...  

The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.


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