scholarly journals Digital image correlation for sensing kinematic fields in manufacturing processes: a review

2021 ◽  
Vol 2 (2) ◽  
pp. 37-62
Author(s):  
Pingan Zhu ◽  
Chao Zhang ◽  
Jun Zou
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Measurement Errors ◽  
Design Methodology ◽  
Measurement Accuracy ◽  
Intelligent Manufacturing ◽  
Image Correlation ◽  
Basic Principles ◽  
Content Type ◽  
Dic Technique

PurposeThe purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the area of manufacturing.Design/methodology/approachNo methodology was used because the paper is a review article.Findingsno fundings.Originality/valueHerein, the historical development, main strengths and measurement setup of DIC are introduced. Subsequently, the basic principles of the DIC technique are outlined in detail. The analysis of measurement accuracy associated with experimental factors and correlation algorithms is discussed and some useful recommendations for reducing measurement errors are also offered. Then, the utilization of DIC in different manufacturing fields (e.g. cutting, welding, forming and additive manufacturing) is summarized. Finally, the current challenges and prospects of DIC in intelligent manufacturing are discussed.

Thermal deformation analysis of BGA package by digital image correlation technique

2005 ◽  
Vol 22 (1) ◽  
pp. 34-42 ◽  
Author(s):  
J. Zhang ◽  
M. Li ◽  
C.Y. Xiong ◽  
J. Fang ◽  
S. Yi
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Electronic Packaging ◽  
Thermal Deformation ◽  
Failure Prediction ◽  
Image Correlation ◽  
Content Type ◽  
Strain Components ◽  
Bga Package ◽  
Dic Technique

PurposeThe mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental evaluation of the thermal stresses and strains in those electronic composites is becoming significantly important for optimizing design and failure prediction of the electronic devices.Design/methodology/approachDigital image correlation (DIC) technique was utilized to obtain thermal deformation filed of a BGA package. With the help of white light to illuminate the cross section of the BGA package, the gray images were taken from the rough surface of the specimen, that offer a kid of carrier pattern for the DIC processing with statistical resemblance in gray distributions. By using the algorithm of correlation computation, the DIC searched the matching spots in a pair of those images in which the spot displacements were involved in between, to obtain the deformation fields of the package specimen caused by temperature changes.FindingsThe results show interesting strain distributions in the assembly. Both the horizontal displacement component and its normal derivative are strongly related to the arrangement of the solder joints in the bonding medium between the die and the ceramic substrate. The strain components in the middle region of the package are larger than those in the side regions where the strain relaxation may exist near the stress‐free boundaries. The shear strain components show special bands of parallel lines with identical amount over the chip‐package to sustain the shearing of the packed structure under thermal loading.Originality/valueThe DIC technique shows to be a useful tool for the thermal strain analysis of the electronic packaging devices. Not only provides it the whole field deformation of the assembly, but also maintains the surface pictures of the package without covering any fringes, which is important to compare the deformation field with the specimen surface to reveal the stain distribution related to the failure prediction of the materials.

Methodology for in situ stress intensity factor determination on cracked structures by digital image correlation

2010 ◽  
Vol 1 (4) ◽  
pp. 344-357 ◽  
Author(s):  
V. Richter‐Trummer ◽  
P.M.G.P. Moreira ◽  
S.D. Pastrama ◽  
M.A.P. Vaz ◽  
P.M.S.T. de Castro
Keyword(s):  
Stress Intensity Factor ◽  
Stress Intensity ◽  
Digital Image Correlation ◽  
Intensity Factor ◽  
Digital Image ◽  
Strain Field ◽  
Image Correlation ◽  
Content Type ◽  
Cracked Structures

PurposeThe purpose of this paper is to develop a methodology for in situ stress intensity factor (SIF) determination that can be used for the analysis of cracked structures. The technique is based on digital image correlation (DIC) combined with an overdetermined algorithm.Design/methodology/approachThe linear overdeterministic algorithm for calculating the SIF based on stress values around the crack tip is applied to a strain field obtained by DIC.FindingsAs long as the image quality is sufficiently high, a good accuracy can be obtained for the measured SIF. The crack tip can be automatically detected based on the same strain field. The use of the strain field instead of the displacement field, eliminates problems related to the rigid body motion of the analysed structure.Practical implicationsIn future works, based on the applied techniques, the SIF of complex cracked plane stress structures can be accurately determined in real engineering applications.Originality/valueThe paper demonstrates application of known techniques, refined for other applications, also the use of stress field for SIF overdeterministic calculations.

SIF determination with digital image correlation

2015 ◽  
Vol 6 (6) ◽  
pp. 668-676 ◽  
Author(s):  
Paulo J Tavares ◽  
Tiago Ramos ◽  
Daniel Braga ◽  
Mario A P Vaz ◽  
Pedro Miguel Guimarães Pires Moreira
Keyword(s):  
Experimental Data ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Fatigue Testing ◽  
Image Correlation ◽  
Image Method ◽  
Mode Ii ◽  
Pure Mode ◽  
Great Success ◽  
Content Type

Purpose – Hybrid methods, wherefore numerical and experimental data are used to calculate a critical parameter, have been used for several years with great success in Experimental Mechanics and, in particular, in fracture mechanics. The purpose of this paper is to report on the comparison of the strain field from numerical modelling forecasts against the experimental data obtained with the digital image correlation method under Mode II loading in fatigue testing. The numerical dual boundary element method has been established in the past as a very reliable method near singular regions where stresses tend to grow abruptly. The results obtained from the strain data near the crack tip were used in Williams expansion and agree fairly well with both the numerical results and the analytical solution proposed for pure Mode II testing. Design/methodology/approach – The work presented in this note is experimental. The proposed methodology is of an hybrid experimental/numerical nature in that a numerical stress intensity factor calculation hinges upon a stress field obtained with an image method. Findings – The obtained results are an important step towards the development of a practical tool for crack behaviour prediction in fatigue dominated events. Research limitations/implications – The results also stress the necessity of improving the experimental techniques to a point where the methods can be applied in real-life solicitations outside of laboratory premises. Originality/value – Although several research teams around the globe are presently working in this field, the present research topic is original and the proposed methodology has been presented initially by the research team years ago.

Comparison of Digital Image Correlation (DIC) Technique with Nanomaterial-Based Sensor for the Analysis of Strain Measurements

2021 ◽  
pp. 2150032
Author(s):  
A. Deepak ◽  
D. F. L. Jenkins
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Standard Specimen ◽  
Strain Sensor ◽  
Constant Load ◽  
Strain Sensors ◽  
Image Correlation ◽  
Strain Measurements ◽  
American Society ◽  
Dic Technique

Digital Image Correlation (DIC) techniques can be used to visually map and measure strain in materials such as metals and metallic alloys. The strain induced in an American Society for Testing and Materials (ASTMs) standard specimen can be measured using a DIC technique. Image patterns indicating the localized strain variations as a function of time for the constant load applied were also obtained. Results obtained using the DIC technique were more accurate compared to conventional strain sensors. DIC results were also compared with nanomaterial-based strain sensor output. Localized strain induced in the material can be visualized and quantified analytically using DIC.

scholarly journals Assessment of Digital Image Correlation Measurement Errors: Methodology and Results

2008 ◽  
Vol 49 (3) ◽  
pp. 353-370 ◽  
Author(s):  
M. Bornert ◽  
F. Brémand ◽  
P. Doumalin ◽  
J.-C. Dupré ◽  
M. Fazzini ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Measurement Errors ◽  
Correlation Measurement ◽  
Image Correlation

scholarly journals Study of size effect using digital image correlation

2015 ◽  
Vol 8 (3) ◽  
pp. 323-340 ◽  
Author(s):  
A. H. A. SANTOS ◽  
R. L. S. PITANGUEIRA ◽  
G. O. RIBEIRO ◽  
R. B. CALDAS
Keyword(s):  
Digital Image Correlation ◽  
Size Effect ◽  
Digital Image ◽  
Concrete Beams ◽  
Image Correlation ◽  
Displacement Fields ◽  
Bending Tests ◽  
Three Point Bending ◽  
New Methods ◽  
Dic Technique

Size effect is an important issue in concrete structures bearing in mind that it can influence many aspects of analysis such as strength, brittleness and structural ductility, fracture toughness and fracture energy, among others. Further this, ever more new methods are being developed to evaluate displacement fields in structures. In this paper an experimental evaluation of the size effect is performed applying Digital Image Correlation (DIC) technique to measure displacements on the surface of beams. Three point bending tests were performed on three different size concrete beams with a notch at the midspan. The results allow a better understanding of the size effect and demonstrate the efficiency of Digital Image Correlation to obtain measures of displacements.

Development of a Railway Track Displacement Monitoring by Using Digital Image Correlation Technique

2014 ◽  
Vol 548-549 ◽  
pp. 683-687 ◽  
Author(s):  
Lenny Iryani ◽  
Hery Setiawan ◽  
Tatacipta Dirgantara ◽  
Ichsan Setya Putra
Keyword(s):  
Digital Image Correlation ◽  
Stress Field ◽  
Digital Image ◽  
Displacement Field ◽  
Image Correlation ◽  
Railway Track ◽  
Remaining Life ◽  
Full Field ◽  
Field Displacement ◽  
Dic Technique

To avoid an unnecessary catastrophic accident due to a failure of a railway track, it is important to have a reliable condition monitoring system for the railway track. The integrity of the railway track can be assessed by monitoring the displacement field of the track, which can then be used to determine the strain and stress field. By knowing the stress history of the track and the S–N curves of the track material, the remaining life of the railway track can be predicted. In the present work, a simple system to monitor and record the displacement field of the railway track has been developed by using Digital Image Correlation (DIC) technique. The set–up to monitor the displacement field of the railway track was developed using a high speed video camera of Nikon J1 to capture the image of the railway track when the train passing through. The DIC technique was then employed off line to measure the displacement field of the 2D image captured. The results showed that the full field displacement measured by using DIC technique gives a good agreement compared to the finite element results. The full field displacement can be used to calculate the strain-stress field, and later on the remaining life assessment can be conducted based on the results.

scholarly journals Analysis for Shear Behavior of SRC Deep Beams Based on Tests, Digital Image Correlation Technique, and Finite Elemental Simulation

2021 ◽  
Vol 2021 ◽  
pp. 1-13
Author(s):  
Buqing Chen ◽  
Jun Wu ◽  
Changjun Liu ◽  
Yanhua Liu ◽  
Wenmei Zhou ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Failure Modes ◽  
Parameter Analysis ◽  
Image Correlation ◽  
Superposition Method ◽  
Deep Beams ◽  
Shear Span ◽  
Depth Ratio ◽  
Dic Technique

Seven steel-reinforced concrete (SRC) deep beams were tested to investigate the shear performance, including peak loads, failure modes, mid-span deflections, and cracking patterns. The parameters include the shear span-to-depth ratio and the dimensions of the steel skeleton. The digital image correlation (DIC) technique was utilized for real-time recording of the in-plane strain and deformation. The experiment results show that the failure modes of specimens could be concluded as two forms: diagonal compression failure and shear failure. The DIC technique was proved to be efficient for tracking the development of crack patterns and recording the failure modes. The corresponding numerical analyses based on experiments were carried out and demonstrated to be a reliable method to simulate the shear response. Furthermore, the most significant parameters and their interactions were identified by finite element models parameter analysis. The steel skeleton height and shear span-to-depth ratio were the main parameters affecting shear capacity. A design formula based on the strength superposition method was presented. The calculated results were basically in agreement with the test results, where the mean and coefficient of variation were 1.04 and 0.09, respectively.

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