scholarly journals Analysis for Shear Behavior of SRC Deep Beams Based on Tests, Digital Image Correlation Technique, and Finite Elemental Simulation

2021 ◽  
Vol 2021 ◽  
pp. 1-13
Author(s):  
Buqing Chen ◽  
Jun Wu ◽  
Changjun Liu ◽  
Yanhua Liu ◽  
Wenmei Zhou ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Failure Modes ◽  
Parameter Analysis ◽  
Image Correlation ◽  
Superposition Method ◽  
Deep Beams ◽  
Shear Span ◽  
Depth Ratio ◽  
Dic Technique

Seven steel-reinforced concrete (SRC) deep beams were tested to investigate the shear performance, including peak loads, failure modes, mid-span deflections, and cracking patterns. The parameters include the shear span-to-depth ratio and the dimensions of the steel skeleton. The digital image correlation (DIC) technique was utilized for real-time recording of the in-plane strain and deformation. The experiment results show that the failure modes of specimens could be concluded as two forms: diagonal compression failure and shear failure. The DIC technique was proved to be efficient for tracking the development of crack patterns and recording the failure modes. The corresponding numerical analyses based on experiments were carried out and demonstrated to be a reliable method to simulate the shear response. Furthermore, the most significant parameters and their interactions were identified by finite element models parameter analysis. The steel skeleton height and shear span-to-depth ratio were the main parameters affecting shear capacity. A design formula based on the strength superposition method was presented. The calculated results were basically in agreement with the test results, where the mean and coefficient of variation were 1.04 and 0.09, respectively.

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Sandeep Shantaram ◽  
Arjun Angral ◽  
Mandar Kulkarni ◽  
Jeff Suhling
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Thermal Aging ◽  
Cohesive Zone ◽  
Life Prediction ◽  
Failure Modes ◽  
Damage Index ◽  
Image Correlation ◽  
Shock Impact ◽  
Cohesive Zone Elements

Relative damage-index based on the leadfree interconnect transient strain history from digital image correlation, explicit finite-elements, cohesive-zone elements, and component’s survivability envelope has been developed for life-prediction of two-leadfree electronic alloy systems. Life prediction of pristine and thermally-aged assemblies, have been investigated. Solder alloy system studied include Sn1Ag0.5Cu, and 96.5Sn3.5Ag. Transient strains during the shock-impact have been measured using digital image correlation in conjunction with high-speed cameras operating at 50,000 fps. Both the board strains and the package strains have been measured in a variety of drop orientations including JEDEC horizontal drop orientation, vertical drop orientation and intermediate drop orientations. In addition the effect of sequential stresses of thermal aging and shock-impact on the failure mechanisms has also been studied. The thermal aging condition used for the study includes 125°C for 100 hrs. The presented methodology addresses the need for life prediction of new lead-free alloy-systems under shock and vibration, which is largely beyond the state of art. Three failure modes have been predicted including interfacial failure at the copper-solder interface, solder-PCB interface, and the solder joint failure. Explicit non-linear finite element models with cohesive-zone elements have been developed and correlated with experimental results. Velocity data from digital image correlation has been used to drive the attachment degrees of freedom of the submodel and extract transient interconnect strain histories. Explicit finite-element sub-modeling has been correlated with the full-field strain in various locations, orientations, on both the package and the board-side. The survivability of the leadfree interconnections under sequential loading (thermal aging and shock-impact) from simulation has been compared with pristine circuit assemblies subjected to shock-impact. Sequential loading changes the failure modes and decreases the drop reliability as compared to the room temperature experimental results. Damage index based survivability envelope is intended for component integration to ensure reliability in harsh environments.

Comparison of Digital Image Correlation (DIC) Technique with Nanomaterial-Based Sensor for the Analysis of Strain Measurements

2021 ◽  
pp. 2150032
Author(s):  
A. Deepak ◽  
D. F. L. Jenkins
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Standard Specimen ◽  
Strain Sensor ◽  
Constant Load ◽  
Strain Sensors ◽  
Image Correlation ◽  
Strain Measurements ◽  
American Society ◽  
Dic Technique

Digital Image Correlation (DIC) techniques can be used to visually map and measure strain in materials such as metals and metallic alloys. The strain induced in an American Society for Testing and Materials (ASTMs) standard specimen can be measured using a DIC technique. Image patterns indicating the localized strain variations as a function of time for the constant load applied were also obtained. Results obtained using the DIC technique were more accurate compared to conventional strain sensors. DIC results were also compared with nanomaterial-based strain sensor output. Localized strain induced in the material can be visualized and quantified analytically using DIC.

scholarly journals Study of size effect using digital image correlation

2015 ◽  
Vol 8 (3) ◽  
pp. 323-340 ◽  
Author(s):  
A. H. A. SANTOS ◽  
R. L. S. PITANGUEIRA ◽  
G. O. RIBEIRO ◽  
R. B. CALDAS
Keyword(s):  
Digital Image Correlation ◽  
Size Effect ◽  
Digital Image ◽  
Concrete Beams ◽  
Image Correlation ◽  
Displacement Fields ◽  
Bending Tests ◽  
Three Point Bending ◽  
New Methods ◽  
Dic Technique

Size effect is an important issue in concrete structures bearing in mind that it can influence many aspects of analysis such as strength, brittleness and structural ductility, fracture toughness and fracture energy, among others. Further this, ever more new methods are being developed to evaluate displacement fields in structures. In this paper an experimental evaluation of the size effect is performed applying Digital Image Correlation (DIC) technique to measure displacements on the surface of beams. Three point bending tests were performed on three different size concrete beams with a notch at the midspan. The results allow a better understanding of the size effect and demonstrate the efficiency of Digital Image Correlation to obtain measures of displacements.

Development of a Railway Track Displacement Monitoring by Using Digital Image Correlation Technique

2014 ◽  
Vol 548-549 ◽  
pp. 683-687 ◽  
Author(s):  
Lenny Iryani ◽  
Hery Setiawan ◽  
Tatacipta Dirgantara ◽  
Ichsan Setya Putra
Keyword(s):  
Digital Image Correlation ◽  
Stress Field ◽  
Digital Image ◽  
Displacement Field ◽  
Image Correlation ◽  
Railway Track ◽  
Remaining Life ◽  
Full Field ◽  
Field Displacement ◽  
Dic Technique

To avoid an unnecessary catastrophic accident due to a failure of a railway track, it is important to have a reliable condition monitoring system for the railway track. The integrity of the railway track can be assessed by monitoring the displacement field of the track, which can then be used to determine the strain and stress field. By knowing the stress history of the track and the S–N curves of the track material, the remaining life of the railway track can be predicted. In the present work, a simple system to monitor and record the displacement field of the railway track has been developed by using Digital Image Correlation (DIC) technique. The set–up to monitor the displacement field of the railway track was developed using a high speed video camera of Nikon J1 to capture the image of the railway track when the train passing through. The DIC technique was then employed off line to measure the displacement field of the 2D image captured. The results showed that the full field displacement measured by using DIC technique gives a good agreement compared to the finite element results. The full field displacement can be used to calculate the strain-stress field, and later on the remaining life assessment can be conducted based on the results.

Characterization of LIGA Microsystems Using Digital Image Correlation Technique and SEM Imaging

Aerospace ◽  
2005 ◽  
Author(s):  
Helena (Huiqing) Jin ◽  
Wei-Yang Lu ◽  
Jeff Chames ◽  
Nancy Yang
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Speckle Pattern ◽  
Image Correlation ◽  
Specimen Surface ◽  
Correlation Technique ◽  
Sem Images ◽  
Full Field ◽  
Speckle Patterns ◽  
Dic Technique

A new experimental technique was developed to characterize the mechanical properties of LIGA (an acronym from German words for lithography, electroplating, and molding) materials. An advanced imaging capability, scanning electron microscopy (SEM), with an integrated loading stage allows the acquisition of in situ microstructural images at the micro scale during loading. The load is measured directly from a load cell, and the displacement field is calculated from the SEM images based on the digital image correlation (DIC) technique. The DIC technique is a full-field deformation measurement technique which obtains displacement fields by comparing random speckle patterns on the specimen surface before and after deformation. The random speckle patterns are typically generated by applying a thin layer of material with high contrast to a specimen surface. Alternatively, DIC can also be applied using the microstructural features of a surface as texture patterns for correlation. DIC technique is ideally suited to characterize the deformation field of MEMS structures without the need to generate a random speckle pattern, which can be very challenging on the micro and nanoscale. In this paper, the technique is experimentally demonstrated on a LIGA specimen. The digital images showing LIGA surface features acquired during the loading can serve as random patterns for the DIC method. Therefore, full-field displacement and strain can be obtained directly on the specimen and the errors incurred by the testing system can be eliminated.

Characterization of Mechanical Behavior of Polyurethane Foams Using Digital Image Correlation

2005 ◽  
Author(s):  
Helena (Huiqing) Jin ◽  
Wei-Yang Lu ◽  
Simon Scheffel ◽  
Michael K. Neilsen ◽  
Terry D. Hinnerichs
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Polyurethane Foams ◽  
Image Correlation ◽  
Compression Tests ◽  
Steel Cylinder ◽  
Full Field ◽  
Strain Concentration ◽  
The Impact ◽  
Dic Technique

Polyurethane foams have good energy absorption properties and are effective in protecting sensitive components from damages due to impact. The foam absorbs impact energy by crushing cells and undergoing large deformation. The complex deformation of the foam needs to be modeled accurately to simulate the impact events. In this paper, the Digital Image Correlation (DIC) technique was implemented to obtain the deformation field of foam specimens under compression tests. Images of foam specimen were continuously acquired using high-speed cameras. The full field displacement and strain at each incremental step of loading were calculated from these images. The closed-cell polyurethane foam used in this investigation was nominal 0.32 kg/m^3 (20 pcf). In the first experiment, cubic specimens were compressed uniaxially up to 60%. The full-field displacements and strains obtained using the DIC technique provide detailed information about the inhomogeneous deformation over the area of interest during loading. In the second experiment, compression tests were conducted for a simple foam structure - cubic foam specimens with a steel cylinder inclusion. The strain concentration at the interface between steel cylinder and foam was studied to simulate the deformation of foam in a typical application. In the third experiment, the foam was loaded from the steel cylinder during the compression. The strain concentration at the interface and the displacement distribution over the surface were compared for cases with and without a confinement fixture to study the effects of confinement. These experimental results demonstrate that the DIC technique can be applied to polyurethane foams to study the heterogeneous deformation. The experimental data is briefly compared with the results from modeling and simulation using a viscoplastic model for the foam.

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