Wetting properties of Nd:YAG laser treated copper by SAC solders

2017 ◽  
Vol 29 (2) ◽  
pp. 69-74 ◽  
Author(s):  
József Hlinka ◽  
Miklós Berczeli ◽  
Gábor Buza ◽  
Zoltán Weltsch
Keyword(s):  
Surface Treatment ◽  
Laser Treatment ◽  
Contact Angles ◽  
Laser Surface ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Laser Surface Treatment ◽  
Content Type ◽  
Wetting Properties ◽  
Free Solder

Purpose This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties. Design/methodology/approach The surfaces of copper plates were treated using an Nd:YAG laser with varying laser powers. After laser surface treatment, wetting experiments were performed between the copper plates and SAC305 lead-free solder paste. The effect of laser treatment on copper surface was analysed using optical microscopy and scanning electron microscopy (SEM). Findings The experimental results showed that the wetting contact angles changed with the variation in laser power. Furthermore, it means that the surface energy of copper plates was changed by the laser treatment. The results demonstrated that the contact angles also changed when a different soldering paste was used. Originality/value Previous laser surface treatment can be a possible way to optimize the wettability between solders and substrates and to increase the quality of the soldered joints.

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

2018 ◽  
Vol 30 (1) ◽  
pp. 1-13 ◽  
Author(s):  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
Abdullah Aziz Saad ◽  
Chu Yee Khor ◽  
Roslina Ismail ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Solder Joint ◽  
Solder Joints ◽  
Ion Beam ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Content Type ◽  
X Ray ◽  
Free Solder

Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

scholarly journals Fibre Laser Treatment of Beta TNZT Titanium Alloys for Load-Bearing Implant Applications: Effects of Surface Physical and Chemical Features on Mesenchymal Stem Cell Response and Staphylococcus aureus Bacterial Attachment

Coatings ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 186 ◽  
Author(s):  
Clare Donaghy ◽  
Ryan McFadden ◽  
Graham Smith ◽  
Sophia Kelaini ◽  
Louise Carson ◽  
...  
Keyword(s):  
Staphylococcus Aureus ◽  
Surface Treatment ◽  
Laser Treatment ◽  
Bulk Composition ◽  
Bacterial Attachment ◽  
Laser Surface ◽  
Fibre Laser ◽  
Elemental Distribution ◽  
Laser Surface Treatment ◽  
Load Bearing

A mismatch in bone and implant elastic modulus can lead to aseptic loosening and ultimately implant failure. Selective elemental composition of titanium (Ti) alloys coupled with surface treatment can be used to improve osseointegration and reduce bacterial adhesion. The biocompatibility and antibacterial properties of Ti-35Nb-7Zr-6Ta (TNZT) using fibre laser surface treatment were assessed in this work, due to its excellent material properties (low Young’s modulus and non-toxicity) and the promising attributes of fibre laser treatment (very fast, non-contact, clean and only causes changes in surface without altering the bulk composition/microstructure). The TNZT surfaces in this study were treated in a high speed regime, specifically 100 and 200 mm/s, (or 6 and 12 m/min). Surface roughness and topography (WLI and SEM), chemical composition (SEM-EDX), microstructure (XRD) and chemistry (XPS) were investigated. The biocompatibility of the laser treated surfaces was evaluated using mesenchymal stem cells (MSCs) cultured in vitro at various time points to assess cell attachment (6, 24 and 48 h), proliferation (3, 7 and 14 days) and differentiation (7, 14 and 21 days). Antibacterial performance was also evaluated using Staphylococcus aureus (S. aureus) and Live/Dead staining. Sample groups included untreated base metal (BM), laser treated at 100 mm/s (LT100) and 200 mm/s (LT200). The results demonstrated that laser surface treatment creates a rougher (Ra value of BM is 199 nm, LT100 is 256 nm and LT200 is 232 nm), spiky surface (Rsk > 0 and Rku > 3) with homogenous elemental distribution and decreasing peak-to-peak distance between ripples (0.63 to 0.315 µm) as the scanning speed increases (p < 0.05), generating a surface with distinct micron and nano scale features. The improvement in cell spreading, formation of bone-like nodules (only seen on the laser treated samples) and subsequent four-fold reduction in bacterial attachment (p < 0.001) can be attributed to the features created through fibre laser treatment, making it an excellent choice for load bearing implant applications. Last but not least, the presence of TiN in the outermost surface oxide might also account for the improved biocompatibility and antibacterial performances of TNZT.

Enhancing Corrosion Resistance of Stainless Steel 304 Using Laser Surface Treatment

2008 ◽  
Vol 384 ◽  
pp. 157-183 ◽  
Author(s):  
Ibrahim M. Ghayad ◽  
Madiha Shoeib ◽  
Taha Mattar ◽  
Huda M. Hussain
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Surface Treatment ◽  
Laser Irradiation ◽  
Laser Treatment ◽  
Surface Composition ◽  
Specific Treatment ◽  
Laser Surface ◽  
Laser Surface Treatment ◽  
Aisi 304

Stainless steel AISI 304 was laser treated to enhance corrosion resistance and improve surface properties. . This alloy has many applications in auto industry (car body,) as well as oil and gas industry. Different conditions were applied in the laser surface treatment, namely: laser power density, scan speed, distance between paths, medium gas (air, argon and nitrogen). After laser treatment, the samples microstructures were investigated using optical microscope to examine micro structural changes due to laser irradiation. Specimen surfaces were investigated using XRD, SEM and EDAX before and after laser treatment to examine the surface composition changes brought by laser irradiation. Results showed that laser irradiation enhances the corrosion resistance of AISI 304 Stainless steel to a large extent. Corrosion rates as low as 0.011 mpy for laser treated samples were obtained in comparison to 0.952 mpy obtained for the untreated samples. Superior pitting corrosion resistance was obtained under specific treatment conditions. The enhancement of corrosion resistance depends on the laser irradiation conditions. The corrosion protection afforded by laser treatment is attributed mainly to the grain refinement of the top surface layer. This layer is found to consist of nano-scale grains.

Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

2015 ◽  
Vol 27 (3) ◽  
pp. 98-102 ◽  
Author(s):  
Janusz Sitek ◽  
Wojciech Stęplewski ◽  
Kamil Janeczek ◽  
Marek Kościelski ◽  
Krzysztof Lipiec ◽  
...  
Keyword(s):  
Solder Joints ◽  
Accelerated Aging ◽  
Lead Free ◽  
Process Window ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Materials Selection ◽  
Content Type ◽  
Free Solder ◽  
Component Assembly

Purpose – The purpose of this paper is to evaluate the influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) Technology and demonstrate factors important for this issue. Design/methodology/approach – Two types of soldering materials and three different assembly procedures were used for assembly of PoP system. The reliability properties of assembled PoP systems were investigated using accelerated aging and periodic resistance measurements of daisy-chain solder joints systems. The purpose of such approach was to determine which soldering material (flux or solder paste) as well as which assembly process parameter (dipping depth of upper component in soldering material), would provide better reliability properties of the solder joints in the PoP system. Findings – It was stated that both selected flux and solder paste dedicated to assembly of PoP systems can be utilized in soldering of PoP applications. More reliable PoP systems applications require larger attention regarding materials selection and assembly parameters. It is recommended 50 per cent dipping depth of ball’s height into soldering material during upper PoP component assembly for more reliable applications. For less demanding PoP systems, the process window from 30 up to 70 per cent is acceptable. All observed failures after thermal shocks occurred in upper PoP components. Originality/value – This paper explains how materials and assembly parameters have influence on lead-free solder joints reliability in PoP systems. Especially, influence of process window for dipping procedure of upper components balls into soldering material was presented.

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

2019 ◽  
Vol 31 (2) ◽  
pp. 109-124 ◽  
Author(s):  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
Abdullah Aziz Saad ◽  
Chu Yee Khor ◽  
Mohamad Aizat Abas ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Solder Joint ◽  
Lead Free ◽  
Inspection System ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Nio Nanoparticles ◽  
Content Type ◽  
X Ray ◽  
Free Solder

Purpose This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

2019 ◽  
Vol 32 (1) ◽  
pp. 19-23 ◽  
Author(s):  
Ahmet Mustafa Erer ◽  
Serkan Oguz
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Cu Substrate ◽  
Wetting Properties ◽  
Free Solder ◽  
Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

Solderability of Coloured Lead Free Solder Composite

2020 ◽  
Vol 307 ◽  
pp. 15-19
Author(s):  
Maria Abu Bakar ◽  
Azman Jalar ◽  
Norliza Ismail ◽  
Ahmad Ghadafi Ismail ◽  
Najib Saedi Ibrahim
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Green Pigment ◽  
Dark Pigment ◽  
Soldering Process ◽  
Wetting Properties ◽  
Wide Range ◽  
Free Solder ◽  
Solder Composite

Coloured solders offer wide range of possible application on top of conventional usage related to solder and soldering. Coloured solder can be produced by adding colour pigment into solder formulation to form coloured solder composite. The performance of coloured solder joint typically determined by good solderability, which influenced by wetting properties. The objectives of this paper is to investigate the solderability of coloured lead free solder composite with different formulation type of colour pigment and variation of colour pigment composition. Green and “glow in the dark pigment” with composition of 5% and 10% respectively were added into the lead free solder paste. Each coloured solder paste was stencil printed on the PCB and then reflowed using reflow soldering process. The wettability of the solder composite was measured and observed using Infinite Focus Measurements (IFM). The results demonstrated that coloured lead free solder composite have a good wettability. This finding also indicates that use of green pigment into the solder composite has shown greater wettability as compared to glow in the dark pigment. Higher percentage of added colour pigment of 10% has significantly reduced the wettability of solder composite. Wettability of coloured solder composite with small amount of added pigment is in the acceptable range of contact angle, showing good solderability of joining.

Laser surface treatment of granite stones

2001 ◽  
Author(s):  
J. Pou ◽  
R. Soto ◽  
C. Trillo ◽  
A. F. Doval ◽  
M. Boutinguiza ◽  
...  
Keyword(s):  
Surface Treatment ◽  
Laser Surface ◽  
Laser Surface Treatment
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