Signal integrity analysis of interconnects using the FDTD method and a layer peeling technique

2000 ◽  
Vol 42 (2) ◽  
pp. 229-233 ◽  
Author(s):  
C. Schuster ◽  
W. Fichtner
2014 ◽  
Vol 24 (01) ◽  
pp. 1530001 ◽  
Author(s):  
N. S. Murthy ◽  
M. Kavicharan

This paper presents a selective survey of finite difference time domain (FDTD)-based interconnects modeling for signal integrity analysis problems. In spite of 47 years of its existence, researchers have focused on FDTD method with further modifications and enhancements for the signal integrity analysis of interconnects over the past two decades only. Because of the remarkable amount of interconnect-based FDTD-related research activity, tracking the FDTD literature can be a tedious and challenging task. This survey presents some of the significant methods and approaches employed to analyze the developments achieved up to the present-day signal integrity related research. These methods are based on solving telegrapher's equations which represent the transmission line behavior of interconnects. Recent research concentrates on developing novel methods for accurate interconnect modeling, extraction of interconnect parameters and incorporation of more lumped elements into FDTD. In this paper an attempt has been made to compare and summarize some of the well-known FDTD-based methods, which were used in interconnect related research.


2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan

Author(s):  
Abhijit Dharchoudhury ◽  
David Blaauw ◽  
Shantanu Ganguly

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