Quality in 3D assembly — Is “Known Good Die” good enough?

Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rapidly growing interest, owing to their potential uses across a broad range of fundamental and applied areas of application. Recently developed approaches to 3D assembly that rely on controlled buckling mechanics serve as versatile routes to 3D mesostructures in a diverse range of high-quality materials and length scales of relevance for 3D microsystems with unusual function and/or enhanced performance. Nonlinear buckling and delamination behaviors in materials that combine both weak and strong interfaces are foundational to the assembly process, but they can be difficult to control, especially for complex geometries. This paper presents theoretical and experimental studies of the fundamental aspects of adhesion and delamination in this context. By quantifying the effects of various essential parameters on these processes, we establish general design diagrams for different material systems, taking into account 4 dominant delamination states (wrinkling, partial delamination of the weak interface, full delamination of the weak interface, and partial delamination of the strong interface). These diagrams provide guidelines for the selection of engineering parameters that avoid interface-related failure, as demonstrated by a series of examples in 3D helical mesostructures and mesostructures that are reconfigurable based on the control of loading-path trajectories. Three-dimensional micromechanical resonators with frequencies that can be selected between 2 distinct values serve as demonstrative examples.

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Modelling approaches in biomechanics

Philosophical Transactions of the Royal Society B Biological Sciences ◽

10.1098/rstb.2003.1336 ◽

2003 ◽

Vol 358 (1437) ◽

pp. 1429-1435 ◽

Cited By ~ 47

Author(s):

R. McN Alexander

Keyword(s):

Mathematical Models ◽

Conceptual Models ◽

Semicircular Canals ◽

Physical Models ◽

Anatomical Changes ◽

Body Segments ◽

Insect Wings ◽

Calculated Effect ◽

3D Assembly ◽

Physical And Mathematical Models

Conceptual, physical and mathematical models have all proved useful in biomechanics. Conceptual models, which have been used only occasionally, clarify a point without having to be constructed physically or analysed mathematically. Some physical models are designed to demonstrate a proposed mechanism, for example the folding mechanisms of insect wings. Others have been used to check the conclusions of mathematical modelling. However, others facilitate observations that would be difficult to make on real organisms, for example on the flow of air around the wings of small insects. Mathematical models have been used more often than physical ones. Some of them are predictive, designed for example to calculate the effects of anatomical changes on jumping performance, or the pattern of flow in a 3D assembly of semicircular canals. Others seek an optimum, for example the best possible technique for a high jump. A few have been used in inverse optimization studies, which search for variables that are optimized by observed patterns of behaviour. Mathematical models range from the extreme simplicity of some models of walking and running, to the complexity of models that represent numerous body segments and muscles, or elaborate bone shapes. The simpler the model, the clearer it is which of its features is essential to the calculated effect.

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Scalable Microsprings for Integrated Test and Packaging

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 ◽

10.1115/ipack2011-52297 ◽

2011 ◽

Author(s):

Eugene M. Chow

Keyword(s):

Thermal Expansion ◽

Low Temperature ◽

Electrical Contacts ◽

Next Generation ◽

Stress Isolation ◽

Lower Height ◽

The Cost ◽

Low K ◽

Known Good Die ◽

Very High

Lithographically defined spring electrical contacts have many applications for next generation electronics test and packaging. The springs can lower the cost of multi-chip modules because their rework ability addresses the known-good-die problem. Lower height chip stacking for mobile electronics markets is enabled because a sliding spring can have a much shorter profile than solder. Larger die can be directly bonded to the board because the compliance absorbs thermal expansion mismatches between substrates. Significant stress isolation is possible, which is important for mechanically sensitive die such as MEMS and low K die. Very high density is possible, as 6 (am pitch has been demonstrated. Fabrication is scalable and assembly is low temperature. This paper reviews our prototype demonstrations for these applications as well as relevant reliability data and contact studies.

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