Heat transfer in high-power LED with thermally conductive particle-filled epoxy composite as thermal interface material for system-level analysis

2013 ◽  
Author(s):  
P. Anithambigai ◽  
S. Shanmugan ◽  
D. Mutharasu ◽  
K. Ibrahim
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Epoxy Composite ◽  
Thermal Interface Material ◽  
System Level ◽  
Conductive Particle ◽  
Thermal Interface ◽  
High Power Led ◽  
Thermally Conductive ◽  
Level Analysis

Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material

2014 ◽  
Vol 45 (12) ◽  
pp. 1726-1733 ◽  
Author(s):  
P. Anithambigai ◽  
S. Shanmugan ◽  
D. Mutharasu ◽  
T. Zahner ◽  
D. Lacey
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Epoxy Composite ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
High Power Led

Development of High Thermally Conductive Die Attach for TIM Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000312-000315
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.

Influence of thermal interface material on the thermal resistance of high power LED

2011 ◽  
Author(s):  
Anithambigai Permal ◽  
Teeba Nadarajah ◽  
Dinash Kandasamy ◽  
Mutharasu Devarajan ◽  
Choon Kim Lim
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
High Power Led

scholarly journals Development of High Thermally Conductive Die Attach for TIM Applications

2020 ◽  
Vol 17 (3) ◽  
pp. 106-109
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High-power semiconductor applications require a thermal interface die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current thermal interface material solutions such as thermal grease, thermal pads, and silicones have been industry standards, however may fall short in performance for high-temperature or high-power applications. This article focuses on development of a cutting-edge die attach solution for thermal interface management, focusing on fusion-type epoxy-based Ag adhesive with an extremely low storage modulus and the thermal conductivity reaching up to 30 W/mK, and also very low-modulus, low-temperature pressureless sintering silver die attach with a thermal conductivity of 70 W/mK.

scholarly journals Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1699
Author(s):  
Sriharsha Sudhindra ◽  
Fariborz Kargar ◽  
Alexander A. Balandin
Keyword(s):  
Contact Resistance ◽  
High Power ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Wide Band ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Interface Materials

We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt %. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

Characterization of Thermal Contact Resistance in Metal Micro-Textured Thermal Interface Materials Using Electrical Contact Resistance Measurements

2010 ◽  
Vol 297-301 ◽  
pp. 1190-1198 ◽  
Author(s):  
R. Kempers ◽  
A.J. Robinson ◽  
A. Lyons
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Electrical Contact ◽  
Applied Pressure ◽  
Thermal Interface Material ◽  
Metal Foil ◽  
Electrical Contact Resistance ◽  
Thermal Interface ◽  
Thermally Conductive

A novel Metal Micro-Textured Thermal Interface Material (MMT-TIM) has been developed to address a number of shortcomings in conventional TIMs. This material consists of a thin metal foil with raised micro-scale features that plastically deform under an applied pressure thereby creating a continuous, thermally conductive, path between the mating surfaces. One of the difficulties in experimentally characterizing MMT-TIMs however, is distinguishing the bulk thermal resistance of the MMT-TIM from the thermal contact resistance that exists where it contacts the test apparatus. Since these materials are highly electrically conductive, this study attempts to employ electrical contact resistance measurements to estimate their thermal contact resistance. Tests using flat silver and gold specimens of known bulk thermal conductivity were used to develop a correlation between electrical and thermal contact resistance. This relationship was then employed to estimate the thermal contact resistance of a prototype silver MMT-TIM and indicates the thermal contact resistance accounts for approximately 10% of the measured thermal contact resistance. A number of issues related to this technique are discussed as well as its future outlook.

Analysis of heat transfer of loop heat pipe used to cool high power LED

2009 ◽  
Vol 52 (12) ◽  
pp. 3527-3532 ◽  
Author(s):  
XiangYou Lu ◽  
ZeZhao Hua ◽  
MeiJing Liu ◽  
YuanXia Cheng
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
High Power ◽  
Loop Heat Pipe ◽  
High Power Led

scholarly journals Use of 1D mechanical and thermal models to predetermine the heat transferable by a thermal interface material layer in space applications

2020 ◽  
Vol 234 (17) ◽  
pp. 3459-3473
Author(s):  
Simon Vandevelde ◽  
Alain Daidié ◽  
Marc Sartor
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Thermal Contact ◽  
Interface Layer ◽  
Thermal Interface Material ◽  
Space Applications ◽  
Thermal Interface ◽  
Steady State Heat ◽  
Steady State Heat Transfer ◽  
Assistance Tool

This paper proposes the use of 1D basic models to build a design assistance tool capable of evaluating the heat transfer between a third-level electronic packaging and its support, considering a conventional configuration where a thermal interface material is placed between these two parts. Using this kind of tool early in the design process may facilitate choices concerning geometry and material. The packaging is modelled by a stepped beam (the equipment) and the interface layer by a nonlinear elastic foundation (the thermal interface material). Considering that the electronic equipment bends under the effect of the forces exerted by the fasteners, the tool makes it possible to determine the contact zone remaining operative after deformation, and the pressure distribution at the interface. Mechanical results are then used to calculate the steady-state heat transfer between the equipment and its support, taking into account the diffusion within the equipment and the thermal interface material, and also the thermal contact resistances, the latter being dependent on the contact pressure. A detailed case study is used to illustrate the utility of the approach. The 1D models are exploited to illustrate the interest of the design assistance tool. The influence of different parameters on the thermal performance is studied and a new innovative proposal is analyzed, which could lead to a significant increase in thermal performance.

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