Flip chip assembly utilizing anisotropic conductive films: a feasibility study

2002 ◽  
Author(s):  
D. Delaney ◽  
J. White
Keyword(s):  
Feasibility Study ◽  
Flip Chip ◽  
Conductive Films ◽  
Flip Chip Assembly

Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications

2008 ◽  
Vol 48 (7) ◽  
pp. 1052-1061 ◽  
Author(s):  
Kyung-Woon Jang ◽  
Chang-Kyu Chung ◽  
Woong-Sun Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Material Properties ◽  
Flash Memory ◽  
Flip Chip ◽  
Nand Flash ◽  
Nand Flash Memory ◽  
Conductive Films ◽  
Flip Chip Assembly ◽  
Memory Applications

63.1: Flip Chip Assembly of Panel-Sized TFT-LCD Scan Drivers with Electroless-Plated Bumps Using Anisotropic Conductive Films

2005 ◽  
Vol 36 (1) ◽  
pp. 1788 ◽  
Author(s):  
Shunji Noda ◽  
Tamaki Toba ◽  
Hiroshi Hayama
Keyword(s):  
Flip Chip ◽  
Conductive Films ◽  
Flip Chip Assembly

A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly

2018 ◽  
Author(s):  
HanMin Lee ◽  
SeYong Lee ◽  
JongHo Park ◽  
Chang-kyu Chung ◽  
Kyung-Woon Jang ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Conductive Films ◽  
Flip Chip Assembly

scholarly journals Co-design/simulation of flip-chip assembly for high voltage IGBT packages

2017 ◽  
Author(s):  
P. Rajaguru ◽  
C. Bailey ◽  
H. Lu ◽  
A. M. Aliyu ◽  
A. Castellazzi ◽  
...  
Keyword(s):  
High Voltage ◽  
Flip Chip ◽  
Flip Chip Assembly

Indium Bumps Investigation for the Flip-chip Assembly

2006 ◽  
Author(s):  
Aidar Biktashov ◽  
Nikolai Kuzmin ◽  
Andrei Paulish
Keyword(s):  
Flip Chip ◽  
Indium Bumps ◽  
Flip Chip Assembly

The effect of polyimide surface treatment on flip-chip assembly

2009 ◽  
Author(s):  
M.C. Ong ◽  
X.L. Zhao ◽  
S.H. Lim ◽  
J.M. Chin ◽  
Chia-Ken Leong ◽  
...  
Keyword(s):  
Surface Treatment ◽  
Flip Chip ◽  
Flip Chip Assembly
Sign in / Sign up

Export Citation Format

Share Document