Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

2005 ◽  
Vol 34 (11) ◽  
pp. 1455-1461 ◽  
Author(s):  
J. W. Hwang ◽  
M. J. Yim ◽  
K. W. Paik
Keyword(s):  
Flip Chip ◽  
Resin Content ◽  
Test Reliability ◽  
Anisotropic Conductive Film ◽  
Thermoplastic Resin ◽  
Conductive Films ◽  
Conductive Film ◽  
Flip Chip Assembly

Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications

2005 ◽  
Author(s):  
Chunyan Yin ◽  
Hua Lu ◽  
Chris Bailey ◽  
Yan-Cheong Chan
Keyword(s):  
Contact Resistance ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Moisture Diffusion ◽  
Testing Time ◽  
Anisotropic Conductive Film ◽  
Conductive Films ◽  
Conductive Film ◽  
Moisture Effects ◽  
Conductive Particles

Anisotropic conductive film (ACF) which consists of an adhesive epoxy matrix and randomly distributed conductive particles are widely used as the connection material for electronic devices with high I/O counts. However, for the semiconductor industry the reliability of the ACF is still a major concern due to a lack of experimental reliability data. This paper reports the investigations into the moisture-induced failures in Flip-Chip-on-Flex interconnections with Anisotropic Conductive Films (ACFs). Both experimental and modeling methods were applied. In the experiments, the contact resistance was used as a quality indicator and was measured continuously during the accelerated tests (autoclave tests). The temperature, relative humidity and the pressure were set at 121°C, 100%RH, and 2atm respectively. The contact resistance of the ACF joints increased during the tests and nearly 25% of the joints were found to be open after 168 hours’ testing time. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. For a better understanding of the experimental results, 3-D Finite Element (FE) models were built and a macro-micro modeling method was used to determine the moisture diffusion and moisture-induced stresses inside the ACF joints. Modeling results are consistent with the findings in the experimental work.

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film
Sign in / Sign up

Export Citation Format

Share Document