Characterization of lead-free solders and under bump metallurgies for flip-chip package

2002 ◽  
Author(s):  
Jong-Kai Lin ◽  
A. De Silva ◽  
D. Frear ◽  
Yifan Guo ◽  
Jin-Wook Jang ◽  
...  
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solders

Characterization of lead-free solders and under bump metallurgies for flip-chip package

2002 ◽  
Vol 25 (4) ◽  
pp. 300-307 ◽  
Author(s):  
Jong-Kai Lin ◽  
A. De Silva ◽  
D. Frear ◽  
Y. Guo ◽  
S. Hayes ◽  
...  
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solders

scholarly journals Phase equilibria investigation and alloys characterization in Sn-In-Ag system

2008 ◽  
Vol 62 (3) ◽  
pp. 148-152
Author(s):  
Aleksandra Milosavljevic ◽  
Dragana Zivkovic ◽  
Dragan Manasijevic ◽  
Nadezda Talijan ◽  
Aleksandar Grujic ◽  
...  
Keyword(s):  
Phase Equilibria ◽  
Xrd Analysis ◽  
Lead Free ◽  
Solder Alloys ◽  
Standard Lead ◽  
Free Solder ◽  
Dsc Method ◽  
Lead Free Solders ◽  
Thermocalc Software

Lead-free soldering has become very popular in the world recently, especially in electronics, because of high ecological demands in industry. Some of lead-free solder alloys are already used in electronic industry, but despite that investigations are still going in order to find suitable replacement for Pb-Sn standard solder. In this paper phase equilibria and characterization of Sn-In-Ag alloys in section In:Ag = 7:3 are investigated. The results of phase diagram calculation are obtained by ThermoCalc software, and characteristic temperatures by DSC method. The results of XRD analysis, optical microscopy, microhardness and electrical conductivity are also presented. These results are given in order to contribute the knowledge about lead-free solders, especially Sn-In-Ag solder alloys, which are potential candidates for replacement standard lead solders.

Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

2015 ◽  
Vol 84 ◽  
pp. 331-339 ◽  
Author(s):  
Jian-Chun Liu ◽  
Gong Zhang ◽  
Zheng-Hong Wang ◽  
Ju-Sheng Ma ◽  
Katsuaki Suganuma
Keyword(s):  
Low Temperature ◽  
Thermal Property ◽  
Lead Free ◽  
Lead Free Solders

scholarly journals Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders

2001 ◽  
Vol 42 (5) ◽  
pp. 790-793 ◽  
Author(s):  
Ikuo Shohji ◽  
Fuminari Mori ◽  
Kojiro F. Kobayashi
Keyword(s):  
Thermal Fatigue ◽  
Flip Chip ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Thermal Fatigue Behavior ◽  
Lead Free Solders
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