Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders. This is followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also included. The chapter then describes several evaluation procedures and tests developed to measure solderability. Reference is also made to the production of calibration standards of solderability. The chapter also describes the characteristics of reinforced solders and amalgams as solders and the strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
