Flip-chip based 3-D high-Q integrated inductors

Author(s):  
Jing-Feng Gong ◽  
P.C.H. Chan
Author(s):  
Xiuhan Li ◽  
Guanghua Shu ◽  
Jinan Sao ◽  
Xiongwei Zhang

A* high Q-factor circular-section solenoid-type inductor is designed and fabricated through micro electro mechanical system (MEMS) technology. The radius of the circular-section is 100μm. Ansoft HFSS is used to design and optimize the structure parameters of the inductor. The stable inductance of 10nH and maximum Q-factor of 46 is gained at the N of 10, wire width w of 10μm, space between wires d of 15μm and the self-resonance frequency of the inductor is above 10GHz. A novel fabrication method—flip chip bonding is proposed to bond the two parts of the inductor, and the process is compatible with CMOS process.


2006 ◽  
Vol 50 (2) ◽  
pp. 89-93 ◽  
Author(s):  
Dae-Hee Weon ◽  
Jeong-Il Kim ◽  
Saeed Mohammadi

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