Crack growth-resistant interconnects for high-reliability microelectronics

2008 ◽  
Author(s):  
Ilyas Mohammed ◽  
Bahareh Banijamali ◽  
Piyush Savalia
Keyword(s):  
Crack Growth ◽  
High Reliability

FINITELY SCOPED, HIGH RELIABILITY FATIGUE CRACK GROWTH MEASUREMENTS

2018 ◽  
Vol 91 (4) ◽  
pp. 644-650
Author(s):  
Joshua R. Goossens ◽  
William V. Mars
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
High Reliability ◽  
Time Budget ◽  
Rest Period ◽  
Operating Conditions ◽  
Test Time ◽  
Crack Growth Behavior ◽  
Strain Peak

ABSTRACT Classical procedures for characterizing fatigue crack growth behavior often suffer from uncertainties that make it difficult to plan for productive use of test instrument time, and that can result ultimately in too noisy measurements. An enhanced procedure has been implemented that is based on a fixed test time budget, and that establishes operating conditions that produce crack growth rates down to minimum measurable rates. The procedure features (1) a haversine pulse deformation test cycle followed by a rest period, (2) a strain peak that ramps linearly over time, (3) minimum and maximum limits on the strain peak chosen to avoid unproductive test time, and (4) a stress–strain probe cycle for purposes of observing strain energy density. A set of replicates of a carbon black filled, natural rubber bushing compound has been characterized via both procedures, and a statistical analysis is made to compare both. The new procedure significantly improves the quality of crack growth rate curve measurements.

Statistical Model of Micro Crack Growth for the Evaluation of Accumulated Fatigue in NPPs

2014 ◽  
Author(s):  
Shigeki Abe ◽  
Takao Nakamura
Keyword(s):  
Statistical Model ◽  
Crack Growth ◽  
Fatigue Failure ◽  
Structural Factor ◽  
Nuclear Power ◽  
Power Plants ◽  
Low Cycle Fatigue ◽  
High Reliability ◽  
Reduction Factor ◽  
Cycle Fatigue

In order to establish sophisticated management of aging degradation and to achieve high reliability of components in nuclear power plants (NPPs), it is required to reveal the mechanism of aging degradation and to quantify its deterioration. Present design code requires the assessment of CUF (cumulated usage factor) using design fatigue curve to prevent the occurrence of low-cycle fatigue failure in class 1 components of NPPs. This assessment of CUF prevents the low-cycle fatigue failure effectively up to the present date. However, the margins of structural factor (safety factor) and environmental fatigue reduction factor Fen need to be clarified for the quantitative assessment of aging degradation based on the mechanism of fatigue accumulation in NPPs,. Structural factor and environmental factor are defined in NUREG/CR6909, etc, but they do not clearly explain the technical basis of these factors according to the mechanism of fatigue and environmental effect. In this study, we quantify the dispersions of crack initiation and crack growth in fatigue test in a certain condition aiming at more sophisticated management of aging degradation based on the mechanism of crack growth. Applying these dispersions, we establish a statistical model of micro crack growth to predict fatigue life. We will propose the application of this prediction model of fatigue crack growth to the management of actual components degradation and establish proper maintenance program in order to achieve high reliability of components in NPPs in future.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Examination of Fracture Interfaces in Silicon Nitride

1975 ◽  
Vol 33 ◽  
pp. 60-61
Author(s):  
Nancy J. Tighe
Keyword(s):  
Silicon Nitride ◽  
Grain Boundary ◽  
Crack Growth ◽  
Subcritical Crack Growth ◽  
Slow Crack Growth ◽  
Ceramic Materials ◽  
Grain Boundary Sliding ◽  
Boundary Phase ◽  
Turbine Engines ◽  
Boundary Sliding

Silicon nitride is one of the ceramic materials being considered for the components in gas turbine engines which will be exposed to temperatures of 1000 to 1400°C. Test specimens from hot-pressed billets exhibit flexural strengths of approximately 50 MN/m2 at 1000°C. However, the strength degrades rapidly to less than 20 MN/m2 at 1400°C. The strength degradition is attributed to subcritical crack growth phenomena evidenced by a stress rate dependence of the flexural strength and the stress intensity factor. This phenomena is termed slow crack growth and is associated with the onset of plastic deformation at the crack tip. Lange attributed the subcritical crack growth tb a glassy silicate grain boundary phase which decreased in viscosity with increased temperature and permitted a form of grain boundary sliding to occur.

A discrete dislocation analysis of fatigue crack growth

2001 ◽  
Vol 11 (PR5) ◽  
pp. Pr5-69-Pr5-75
Author(s):  
V. S. Deshpande ◽  
H. H.M. Cleveringa ◽  
E. Van der Giessen ◽  
A. Needleman
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Discrete Dislocation

Fuzzy multi-objective location and routing problem

2020 ◽  
Vol 39 (3) ◽  
pp. 3259-3273
Author(s):  
Nasser Shahsavari-Pour ◽  
Najmeh Bahram-Pour ◽  
Mojde Kazemi
Keyword(s):  
Firefly Algorithm ◽  
High Reliability ◽  
Research Area ◽  
Nsga Ii ◽  
Location Routing Problem ◽  
Routing Problem ◽  
Location Allocation ◽  
Multi Objective ◽  
Location Routing ◽  
The Cost

The location-routing problem is a research area that simultaneously solves location-allocation and vehicle routing issues. It is critical to delivering emergency goods to customers with high reliability. In this paper, reliability in location and routing problems was considered as the probability of failure in depots, vehicles, and routs. The problem has two objectives, minimizing the cost and maximizing the reliability, the latter expressed by minimizing the expected cost of failure. First, a mathematical model of the problem was presented and due to its NP-hard nature, it was solved by a meta-heuristic approach using a NSGA-II algorithm and a discrete multi-objective firefly algorithm. The efficiency of these algorithms was studied through a complete set of examples and it was found that the multi-objective discrete firefly algorithm has a better Diversification Metric (DM) index; the Mean Ideal Distance (MID) and Spacing Metric (SM) indexes are only suitable for small to medium problems, losing their effectiveness for big problems.

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