Design and fabrication of low-loss horizontal and vertical interconnect links using air-clad transmission lines and through silicon vias

2012 ◽  
Author(s):  
Rohit Sharma ◽  
Erdal Uzunlar ◽  
Vachan Kumar ◽  
Rajarshi Saha ◽  
Xinyi Yeow ◽  
...  
Keyword(s):  
Transmission Lines ◽  
Low Loss ◽  
Through Silicon Vias ◽  
Silicon Vias ◽  
Vertical Interconnect

Low-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration

2021 ◽  
Vol 238 ◽  
pp. 111509
Author(s):  
Shuxiao Wang ◽  
Qing Wang ◽  
Yufei Liu ◽  
Lianxi Jia ◽  
Mingbin Yu ◽  
...  
Keyword(s):  
Transmission Lines ◽  
Low Loss ◽  
Through Silicon Vias ◽  
Optoelectronic Integration ◽  
Silicon Vias

Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers

2016 ◽  
Vol 26 (3) ◽  
pp. 168-170 ◽  
Author(s):  
Hanju Oh ◽  
Paragkumar A. Thadesar ◽  
Gary S. May ◽  
Muhannad S. Bakir
Keyword(s):  
Low Loss ◽  
Through Silicon Vias ◽  
Silicon Vias

scholarly journals Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle

2016 ◽  
Vol 58 ◽  
pp. 83-88 ◽  
Author(s):  
Jinrong Su ◽  
Runbo Ma ◽  
Xinwei Chen ◽  
Liping Han ◽  
Rongcao Yang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Low Loss ◽  
Through Silicon Vias ◽  
Multi Walled Carbon Nanotube ◽  
Silicon Vias ◽  
Nanotube Bundle

Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration

2016 ◽  
Vol 149 ◽  
pp. 145-152 ◽  
Author(s):  
Xin Sun ◽  
Runiu Fang ◽  
Yunhui Zhu ◽  
Xiao Zhong ◽  
Yuan Bian ◽  
...  
Keyword(s):  
Transmission Lines ◽  
Electrical Characterization ◽  
3D Integration ◽  
Through Silicon Vias ◽  
Silicon Vias

Failure and Stress Analysis of Cu TSVs Using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy

2015 ◽  
Author(s):  
Ingrid De Wolf ◽  
Ahmad Khaled ◽  
Martin Herms ◽  
Matthias Wagner ◽  
Tatjana Djuric ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Stress Analysis ◽  
Rayleigh Waves ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Through Silicon Vias ◽  
Stress Anisotropy ◽  
Silicon Vias ◽  
Ic Technology ◽  
Detection Of Defects

Abstract This paper discusses the application of two different techniques for failure analysis of Cu through-silicon vias (TSVs), used in 3D stacked-IC technology. The first technique is GHz Scanning Acoustic Microscopy (GHz- SAM), which not only allows detection of defects like voids, cracks and delamination, but also the visualization of Rayleigh waves. GHz-SAM can provide information on voids, delamination and possibly stress near the TSVs. The second is a reflection-based photoelastic technique (SIREX), which is shown to be very sensitive to stress anisotropy in the Si near TSVs and as such also to any defect affecting this stress, such as delamination and large voids.

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