Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods
2019 ◽
Vol 19
(2)
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pp. 322-332
Keyword(s):
Keyword(s):
2008 ◽
Vol 311
(1-2)
◽
pp. 39-55
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1992 ◽
Vol 31
(1-2)
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pp. 255-263
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Keyword(s):
Keyword(s):
2014 ◽
Vol 23
(7)
◽
pp. 964-978
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2004 ◽
Vol 46
(6)
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pp. 841-854
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