Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874428 ◽

2016 ◽

Author(s):

Hyunsuk Lee ◽

Kyungjun Cho ◽

Heegon Kim ◽

Sumin Choi ◽

Jaemin Lim ◽

...

Keyword(s):

Signal Integrity ◽

High Bandwidth ◽

Integrity Analysis

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Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347149 ◽

2015 ◽

Author(s):

Hyunsuk Lee ◽

Kyungjun Cho ◽

Heegon Kim ◽

Sumin Choi ◽

Jaemin Lim ◽

...

Keyword(s):

Signal Integrity ◽

High Bandwidth ◽

Integrity Analysis

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Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680900 ◽

2018 ◽

Author(s):

Surender Singh ◽

Ashish Gupta

Keyword(s):

Signal Integrity ◽

High Density ◽

Next Generation ◽

Integrity Analysis

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Machine Learning Based Design Space Exploration and Applications to Signal Integrity Analysis of 112Gb SerDes Systems

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00201 ◽

2021 ◽

Author(s):

Alex Manukovsky ◽

Yuriy Shlepnev ◽

Zurab Khasidashvili

Keyword(s):

Machine Learning ◽

Design Space Exploration ◽

Design Space ◽

Space Exploration ◽

Signal Integrity ◽

Integrity Analysis

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Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383697 ◽

2015 ◽

Author(s):

Kyungjun Cho ◽

Hyunsuk Lee ◽

Heegon Kim ◽

Sumin Choi ◽

Youngwoo Kim ◽

...

Keyword(s):

Design Optimization ◽

Signal Integrity ◽

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Statistical Signal Integrity Analysis and Diagnosis Methodology for High-Speed Systems

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2004.831856 ◽

2004 ◽

Vol 27 (4) ◽

pp. 611-629 ◽

Author(s):

E. Matoglu ◽

N. Pham ◽

D.N. deAraujo ◽

M. Cases ◽

M. Swaminathan

Keyword(s):

Signal Integrity ◽

Integrity Analysis

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Timing and Signal Integrity Analysis

The VLSI Handbook, Second Edition - Electrical Engineering Handbook ◽

10.1201/9781420005967.ch63 ◽

2006 ◽

pp. 63-1-63-34

Author(s):

Abhijit Dharchoudhury ◽

David Blaauw ◽

Shantanu Ganguly

Keyword(s):

Signal Integrity ◽

Integrity Analysis

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Timing and Signal Integrity Analysis

The VLSI Handbook ◽

10.1201/9781420049671-64 ◽

1999 ◽

pp. 1285-1315

Keyword(s):

Signal Integrity ◽

Integrity Analysis

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Development of the Physical Layer and Signal Integrity Analysis of FlexRay™ Design Systems

10.4271/2007-01-1636 ◽

2007 ◽

Author(s):

Thorsten Gerke ◽

David Bollati

Keyword(s):

Signal Integrity ◽

Physical Layer ◽

Design Systems ◽

Integrity Analysis

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Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing

10.1109/eptc53413.2021.9663999 ◽

2021 ◽

Author(s):

Li Kangrong ◽

Ratan Bhimrao Umralkar

Keyword(s):

Signal Integrity ◽

Integrity Analysis

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Timing and Signal Integrity Analysis

Memory, Microprocessor, and ASIC ◽

10.1201/9780203010235-11 ◽

2003 ◽

pp. 191-220

Keyword(s):

Signal Integrity ◽

Integrity Analysis

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