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Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)
◽
10.1109/epeps.2015.7347149
◽
2015
◽
Cited By ~ 2
Author(s):
Hyunsuk Lee
◽
Kyungjun Cho
◽
Heegon Kim
◽
Sumin Choi
◽
Jaemin Lim
◽
...
Keyword(s):
Signal Integrity
◽
High Bandwidth
◽
Integrity Analysis
Download Full-text
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Cited By
References
Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
◽
10.1109/edaps.2016.7874428
◽
2016
◽
Author(s):
Hyunsuk Lee
◽
Kyungjun Cho
◽
Heegon Kim
◽
Sumin Choi
◽
Jaemin Lim
◽
...
Keyword(s):
Signal Integrity
◽
High Bandwidth
◽
Integrity Analysis
Download Full-text
Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
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10.1109/edaps.2018.8680900
◽
2018
◽
Author(s):
Surender Singh
◽
Ashish Gupta
Keyword(s):
Signal Integrity
◽
High Density
◽
Next Generation
◽
Integrity Analysis
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Machine Learning Based Design Space Exploration and Applications to Signal Integrity Analysis of 112Gb SerDes Systems
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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10.1109/ectc32696.2021.00201
◽
2021
◽
Author(s):
Alex Manukovsky
◽
Yuriy Shlepnev
◽
Zurab Khasidashvili
Keyword(s):
Machine Learning
◽
Design Space Exploration
◽
Design Space
◽
Space Exploration
◽
Signal Integrity
◽
Integrity Analysis
Download Full-text
Design optimization of high bandwidth memory (HBM) interposer considering signal integrity
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
◽
10.1109/edaps.2015.7383697
◽
2015
◽
Cited By ~ 12
Author(s):
Kyungjun Cho
◽
Hyunsuk Lee
◽
Heegon Kim
◽
Sumin Choi
◽
Youngwoo Kim
◽
...
Keyword(s):
Design Optimization
◽
Signal Integrity
◽
High Bandwidth
Download Full-text
Statistical Signal Integrity Analysis and Diagnosis Methodology for High-Speed Systems
IEEE Transactions on Advanced Packaging
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10.1109/tadvp.2004.831856
◽
2004
◽
Vol 27
(4)
◽
pp. 611-629
◽
Cited By ~ 44
Author(s):
E. Matoglu
◽
N. Pham
◽
D.N. deAraujo
◽
M. Cases
◽
M. Swaminathan
Keyword(s):
High Speed
◽
Signal Integrity
◽
Integrity Analysis
Download Full-text
Timing and Signal Integrity Analysis
The VLSI Handbook, Second Edition - Electrical Engineering Handbook
◽
10.1201/9781420005967.ch63
◽
2006
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pp. 63-1-63-34
Author(s):
Abhijit Dharchoudhury
◽
David Blaauw
◽
Shantanu Ganguly
Keyword(s):
Signal Integrity
◽
Integrity Analysis
Download Full-text
Timing and Signal Integrity Analysis
The VLSI Handbook
◽
10.1201/9781420049671-64
◽
1999
◽
pp. 1285-1315
Keyword(s):
Signal Integrity
◽
Integrity Analysis
Download Full-text
Development of the Physical Layer and Signal Integrity Analysis of FlexRay™ Design Systems
10.4271/2007-01-1636
◽
2007
◽
Cited By ~ 5
Author(s):
Thorsten Gerke
◽
David Bollati
Keyword(s):
Signal Integrity
◽
Physical Layer
◽
Design Systems
◽
Integrity Analysis
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Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing
10.1109/eptc53413.2021.9663999
◽
2021
◽
Author(s):
Li Kangrong
◽
Ratan Bhimrao Umralkar
Keyword(s):
Signal Integrity
◽
Fine Pitch
◽
Probe Card
◽
Integrity Analysis
Download Full-text
Timing and Signal Integrity Analysis
Memory, Microprocessor, and ASIC
◽
10.1201/9780203010235-11
◽
2003
◽
pp. 191-220
Keyword(s):
Signal Integrity
◽
Integrity Analysis
Download Full-text
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