Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

Abstract Heterogeneous packaging is one of the advanced technologies. Especially for high-end applications such as data center server, HPC and Artificial-Intelligence (AI), High-Bandwidth Memory (HBM) integration is a key and strongly required. As we know, the 2.5D silicon interposer packaging is an expanded solution for HBM interconnections. However, we developed 2.1D high density organic package called i-THOP® (integrated-Thin film High density Organic Package) to take advantages of an organic solution. Furthermore, we are now focusing on 2.3D i-THOP® to have more benefits in the manufacturing. The 2.3D structure consists of two substrates. One is a thin i-THOP® interposer, the other one is a conventional build-up (BU) substrate. These two substrates are combined as the interposer placed onto the build-up substrate. In this paper, the electrical properties of 2.3D i-THOP® are studied to confirm the possibility of the 2.3D structure organic packages from the perspective of signal and power integrity. Firstly, the signal integrity between two devices is simulated, comparing the differences between i-THOP® and the 2.5D silicon interposer. Secondly, the signal integrity in die-to-substrate vertical interconnection is simulated, comparing between 2.1D, 2.3D i-THOP® and the 2.5D silicon interposer. Finally, as for the power delivery point of view, power distribution network (PDN) impedance is compared between 2.1D and 2.3D i-THOP®.

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Quality and Reliability of 3D High-Performance Heterogeneous Integration through Die Stacking

International Symposium on Microelectronics ◽

10.4071/isom-2012-tp14 ◽

2012 ◽

Vol 2012 (1) ◽

pp. 000249-000253 ◽

Cited By ~ 1

Author(s):

Bahareh Banijamali ◽

Liam Madden ◽

Suresh Ramalingam ◽

Ephrem Wu

Keyword(s):

High Performance ◽

Signal Integrity ◽

3D Integration ◽

Die Stacking ◽

High Bandwidth ◽

Low K ◽

Optimal Signal ◽

Very High ◽

Package Reliability ◽

Underfill Material

This paper studies package reliability for the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration) delivering up to 2.78 Tb/s transceiver bandwidth. Each device is packaged on a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. 3D thermal-mechanical simulations are built to analyze package warpage, low-k stresses, microbumps and C4 bumps fatigue as well as BGA ball reliability. Different substrate sizes and designs, lid designs, lid materials and C4 bump underfill materials are investigated in order to optimize package reliability. LTCC ceramic package reduces fatigue in C4 bumps when increasing the risk for BGA balls to fail in thermal stressing. Hence, lid design and C4 bump underfill material are optimized to increase fatigue life for BGA balls. Simulation results indicate heterogeneous stacked-silicon (3D) integration is a reliable method to build very high-bandwidth multi-chip devices that exceed current monolithic capabilities.

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Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874428 ◽

2016 ◽

Author(s):

Hyunsuk Lee ◽

Kyungjun Cho ◽

Heegon Kim ◽

Sumin Choi ◽

Jaemin Lim ◽

...

Keyword(s):

Signal Integrity ◽

High Bandwidth ◽

Integrity Analysis

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Laser Absorption Sensing Systems: Challenges, Modeling, and Design Optimization

Applied Sciences ◽

10.3390/app9132723 ◽

2019 ◽

Vol 9 (13) ◽

pp. 2723 ◽

Cited By ~ 14

Author(s):

Zhenhai Wang ◽

Pengfei Fu ◽

Xing Chao

Keyword(s):

Design Optimization ◽

Absorption Spectroscopy ◽

Laser Absorption ◽

Direct Absorption Spectroscopy ◽

Quantitative Measurements ◽

High Bandwidth ◽

Laser Control ◽

Diagnostic Research ◽

Species Specific ◽

Sensor System Design

Laser absorption spectroscopy (LAS) is a promising diagnostic method capable of providing high-bandwidth, species-specific sensing, and highly quantitative measurements. This review aims at providing general guidelines from the perspective of LAS sensor system design for realizing quantitative species diagnostics in combustion-related environments. A brief overview of representative detection limits and bandwidths achieved in different measurement scenarios is first provided to understand measurement needs and identify design targets. Different measurement schemes including direct absorption spectroscopy (DAS), wavelength modulation spectroscopy (WMS), and their variations are discussed and compared in terms of advantages and limitations. Based on the analysis of the major sources of noise including electronic, optical, and environmental noises, strategies of noise reduction and design optimization are categorized and compared. This addresses various means of laser control parameter optimization and data processing algorithms such as baseline extraction, in situ laser characterization, and wavelet analysis. There is still a large gap between the current sensor capabilities and the demands of combustion and engine diagnostic research. This calls for a profound understanding of the underlying fundamentals of a LAS sensing system in terms of optics, spectroscopy, and signal processing.

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