A Study on Space Charge Dynamics in Ultra Thin Aluminum-oxide Barrier Layer of TMR Heads

Author(s):  
Yue Liu ◽  
M. Dovek ◽  
PoKang Wang
2011 ◽  
Vol 158 (5) ◽  
pp. D254 ◽  
Author(s):  
J. K. Yeon ◽  
W. S. Lim ◽  
J. B. Park ◽  
N. Y. Kwon ◽  
S. I. Kim ◽  
...  

Langmuir ◽  
2007 ◽  
Vol 23 (3) ◽  
pp. 1564-1568 ◽  
Author(s):  
Catherine Y. Han ◽  
Gerold A. Willing ◽  
Zhili Xiao ◽  
H. Hau Wang

1993 ◽  
Vol 115 (4) ◽  
pp. 615-619 ◽  
Author(s):  
M. Nakanishi ◽  
H. Okuya ◽  
K. Nakajima

The strength of deposited film and the adhesion between the film and the substrate were investigated with deposited aluminum oxide film on iron surface by scratching the surface with a diamond cone. Two types of samples were examined, one with oxide film deposited after cleaning the substrate surface by sputter etching, the other with the film deposited without any sputter etching. It was found that a law similar to Meyers’ for indentation hardness holds between the load and scratch width on the sample examined. These results suggest that by analyzing the scratch data the adhesion strength of the film to the substrate can be estimated together with the hardness of the film itself. Analyses by EPMA (electron probe X-ray microanalyzer) and AES (Auger electron spectroscopy) were conducted to correlate the results obtained by the scratch tests and friction experiments, and it was confirmed that (i) adhesion is improved by sputter etching prior to the deposition of the film; (ii) adhesion decreases considerably due to the progress of oxidation in the vicinity of the interface, which depends markedly on the oxygen concentration in the oxide film; and (iii) there is an optimum thickness of the three-component layer (Fe, Al, and O) formed by atomic mixing at the interface for maximizing the adhesion.


Author(s):  
Zhijing Hu ◽  
Zi Wang ◽  
Yanlin Li ◽  
Tao Shen ◽  
Ming Yan ◽  
...  

2001 ◽  
Vol 79 (19) ◽  
pp. 3158-3160 ◽  
Author(s):  
J. Carrey ◽  
K. Bouzehouane ◽  
J.-M. George ◽  
C. Ceneray ◽  
A. Fert ◽  
...  

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1836 ◽  
Author(s):  
Ik-Soo Kwon ◽  
Sun-Jin Kim ◽  
Mansoor Asif ◽  
Bang-Wook Lee

The influx of a switching impulse during DC steady-state operations causes severe electrical stress on the insulation of HVDC cables. Thus, the insulation should be designed to withstand a superimposed switching impulse. All major manufacturers of DC cables perform superimposed switching impulse breakdown tests for prequalification. However, an experimental approach to study space charge dynamics in dielectrics under a switching impulse superposed on DC voltage has not been reported yet. This is because, unlike the DC stress, it is not possible to study the charge dynamics experimentally under complex stresses, such as switching impulse superposition. Hence, in order to predict and investigate the breakdown characteristics, it is necessary to obtain accurate electric field distribution considering space charge dynamics using a numerical approach. Therefore, in this paper, a numerical study on the switching impulse superposition was carried out. The space charge dynamics and its distribution within the dielectric under DC stress were compared with those under a superimposed switching impulse using a bipolar charge transport (BCT) model. In addition, we estimated the effect of a superimposed switching impulse on a DC electric field distribution. It was concluded that the temperature conditions of dielectrics have a significant influence on electric field and space charge dynamics.


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