A new package with kelvin source connection for increasing power density in power electronics design

Author(s):  
Vittorio Crisafulli
2010 ◽  
Vol 645-648 ◽  
pp. 1101-1106 ◽  
Author(s):  
Jürgen Biela ◽  
Mario Schweizer ◽  
Stefan Waffler ◽  
Benjamin Wrzecionko ◽  
Johann Walter Kolar

Switching devices based on wide band gap materials as SiC oer a signicant perfor- mance improvement on the switch level compared to Si devices. A well known example are SiC diodes employed e.g. in PFC converters. In this paper, the impact on the system level perfor- mance, i.e. eciency/power density, of a PFC and of a DC-DC converter resulting with the new SiC devices is evaluated based on analytical optimisation procedures and prototype systems. There, normally-on JFETs by SiCED and normally-off JFETs by SemiSouth are considered.


Author(s):  
Vedant ◽  
James T. Allison

Abstract Multifunctional Structures for Attitude Control (MSAC) is a new spacecraft attitude control system that utilizes deployable panels as multifunctional intelligent structures to provide both fine pointing and large slew attitude control. Previous studies introduced MSAC design and operation concepts, simulation-based design studies, and Hardware-in-the-Loop (HIL) validation of a simplified prototype. In this article, we expand the scope of design studies to include individual compliant piezo-electric actuators and associated power electronics. This advance is a step toward high-fidelity MSAC system operation, and reveals new design insights for further performance enhancement. Actuators are designed using pseudo rigid body dynamic models (PRBDMs), and are validated for steady-state and step responses against Finite Element Analysis. The drive electronics model consists of a few distinct topologies that will be used to evaluate system performance for given mechanical and control system designs. Subsequently, a high-fidelity multiphysics multibody MSAC system model, based on the validated compliant actuators and drive electronics, is developed to support implementation of MSAC Control Co-design optimization studies. This model will be used to demonstrate the impact of including the power electronics design in the Optimal Control Co-Design domain. The different control trajectories are compared for slew rates and the vibrational jitter introduced to the satellite. The results from this work will be used to realize closed-loop control trajectories that have minimal jitter introduction while providing high slew rates.


2009 ◽  
Vol 52 (4) ◽  
pp. 524-531 ◽  
Author(s):  
Lena Max ◽  
TorbjÖrn Thiringer ◽  
Tore Undeland ◽  
Robert Karlsson

EPE Journal ◽  
1993 ◽  
Vol 3 (2) ◽  
pp. 85-92 ◽  
Author(s):  
D. O’Sullivan

Author(s):  
Gilberto Moreno ◽  
Sreekant Narumanchi ◽  
Xuhui Feng ◽  
Paul Anschel ◽  
Steve Myers ◽  
...  

Abstract Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles and is necessary for increasing power density and improving reliability. Replacing traditional silicon devices with more efficient, higher temperature, higher voltage, and higher frequency wide-bandgap (WBG) devices will enable increased power density but will result in higher device heat fluxes. Compact packaging of high-temperature WBG devices near low-temperature-rated components creates thermal management challenges that need to be addressed for future power-dense systems. This paper summarizes the thermal performance of on-road automotive power electronics thermal management systems and provides thermal performance and pumping-power metrics for select vehicles. Thermal analyses reveal that the package/conduction resistance dominates the total thermal resistance (for existing automotive systems). We model advanced packaging concepts and compare the results with existing packaging designs to quantify their thermal performance enhancements. Double-side-cooled configurations that do not use thermal interface materials are package concepts predicted to provide a low junction-to-fluid thermal resistance (compared to current packages). Dielectric-fluid-cooled concepts enable a redesign of the package to reduce the package resistance, can be implemented in single- and two-phase cooling approaches, and allow for cooling of passive components (e.g., capacitors) and bus bars.


Author(s):  
Abdul-Hakeem Mohammed Dobi ◽  
Mohd Rodhi Sahid ◽  
Tole Sutikno

Application of soft switching in DC-DC converter has achieved a remarkable success in power electronics technology in terms of reduction in switching losses, improve in power density, minimization of electromagnetic interference (EMI) and reduction in the volume of DC-DC converters. Quite a number of soft switching techniques had been reported in the past four decades. This paper aims at providing a review of various soft switching techniques, based on topology, the location of the resonant network, performance characteristics, and principles of operation. In addition, converters area of application, advantages as well as limitations are also highlighted.


2021 ◽  
Author(s):  
Kyle J. Goodrick ◽  
Antuwon Butler ◽  
Thomas Byrd ◽  
Dragan Maksimovic

Sign in / Sign up

Export Citation Format

Share Document