Why Choose Polymer Electrolytic Output Capacitors for Maximum Ripple Capability and Reliability Performance within eGaN based POL Converters

2020 ◽

pp. 108-114

Author(s):

L.R. Kashapova ◽

D.L. Pankratov ◽

V.G. Shibakov

Keyword(s):

Deformation Process ◽

Automated System ◽

Tool Performance ◽

Sheet Stamping ◽

Mechanical And Physical Properties ◽

Preparation Stage ◽

Process Reliability ◽

Recurrent Defects ◽

Automated Process ◽

Reliability Performance

The procedure of automated process reliability evaluation is developed in order to prevent recurrent defects in parts manufactured by die stamping. The procedure is based on the analysis of such factors as part design, material, its mechanical and physical properties; equipment parameters, tool performance, etc. The list of reliability factors may vary according to type of operation as deformation process is different for each group of operations. The adjustment of stamping process reliability performance prevents any defects emerging during production of critical parts as early as the work preparation stage.

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A Planning Tool for Reliability Assessment of Overhead Distribution Lines in Hybrid AC/DC Grids

Sustainability ◽

10.3390/su13116099 ◽

2021 ◽

Vol 13 (11) ◽

pp. 6099

Author(s):

Giovanna Adinolfi ◽

Roberto Ciavarella ◽

Giorgio Graditi ◽

Antonio Ricca ◽

Maria Valenti

Keyword(s):

Reliability Assessment ◽

Reliability Function ◽

Climatic Conditions ◽

Planning Tool ◽

Grid Resource ◽

Distribution Lines ◽

Ac Networks ◽

Reliability Performance ◽

Power Dispatching

Integration of DC grids into AC networks will realize hybrid AC/DC grids, a new energetic paradigm which will become widespread in the future due to the increasing availability of DC-based generators, loads and storage systems. Furthermore, the huge connection of intermittent renewable sources to distribution grids could cause security and congestion issues affecting line behaviour and reliability performance. This paper aims to propose a planning tool for congestion forecasting and reliability assessment of overhead distribution lines. The tool inputs consist of a single line diagram of a real or synthetic grid and a set of 24-h forecasting time series concerning climatic conditions and grid resource operative profiles. The developed approach aims to avoid congestions criticalities, taking advantage of optimal active power dispatching among “congestion-nearby resources”. A case study is analysed to validate the implemented control strategy considering a modified IEEE 14-Bus System with introduction of renewables. The tool also implements reliability prediction formulas to calculate an overhead line reliability function in congested and congestions-avoided conditions. A quantitative evaluation underlines the reliability performance achievable after the congestion strategy action.

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Analysis and Reliability Performance Comparison of Different Facial Image Features

Research Journal of Applied Sciences Engineering and Technology ◽

10.19026/rjaset.8.1189 ◽

2014 ◽

Vol 8 (18) ◽

pp. 1973-1979

Author(s):

J. Madhavan ◽

K. Porkumaran

Keyword(s):

Performance Comparison ◽

Image Features ◽

Facial Image ◽

Reliability Performance

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Simulation and calculation of reliability performance and maintenance costs

2007 Annual Reliability and Maintainability Symposium ◽

10.1109/rams.2007.328102 ◽

2007 ◽

Cited By ~ 2

Author(s):

P.-E. Hagmark ◽

S. Virtanen

Keyword(s):

Maintenance Costs ◽

Reliability Performance

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Evaluating delivery point reliability performance for network configurations

Engineering Solutions for the Next Millennium. 1999 IEEE Canadian Conference on Electrical and Computer Engineering (Cat. No.99TH8411) ◽

10.1109/ccece.1999.804922 ◽

2003 ◽

Cited By ~ 1

Author(s):

Fenlang Dong ◽

D.O. Koval

Keyword(s):

Reliability Performance

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A new wafer level package for improved electrical and reliability performance

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225893 ◽

2004 ◽

Author(s):

S. Barrett ◽

J. Reche ◽

Deok-Hoon Kim ◽

D. Stepniak

Keyword(s):

Wafer Level ◽

Reliability Performance ◽

Wafer Level Package

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Reliability Performance of 1200 V and 1700 V 4H-SiC DMOSFETs for Next Generation Power Conversion Applications

Materials Science Forum ◽

10.4028/www.scientific.net/msf.778-780.967 ◽

2014 ◽

Vol 778-780 ◽

pp. 967-970 ◽

Cited By ~ 16

Author(s):

Donald A. Gajewski ◽

Sei Hyung Ryu ◽

Mrinal Das ◽

Brett Hull ◽

Jonathan Young ◽

...

Keyword(s):

Wide Bandgap ◽

Large Sample Size ◽

Next Generation ◽

Process Technology ◽

Power Switching ◽

Comprehensive Reliability ◽

Reliability Performance ◽

Acceptance Tests ◽

Frequency Power

We present new reliability results on the Cree, Inc., 4H-SiC, DMOSFET devices. The Cree DMOSFETs were developed to meet the demand of next-generation, high-frequency power switching applications, such as: dc-ac inversion, dc-dc conversion, and ac-dc rectification, with continually improving energy efficiency. The Cree Generation 2 DMOSFET process technology is now commercially available with 1200 V and 1700 V ratings. We have performed intrinsic reliability studies to ensure excellent wear-out performance and long field lifetime of the products. We have also performed large sample size qualification reliability acceptance tests to ensure the quality of the manufacturing and packaging processes. These comprehensive reliability studies establish new benchmarks for wide bandgap transistors and demonstrate that Crees MOSFETs meet or exceed all industrial reliability requirements. This achievement facilitates broad market adoption of this disruptive power switch technology.

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