Thermal Stress Analysis and Design Guidelines for Through Silicon Via Structure in 3D IC Integration

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480433 ◽

2018 ◽

Author(s):

Yuanxiang Zhang ◽

Jiankun Wang ◽

Sijia Yu

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Design Guidelines ◽

3D Ic ◽

Through Silicon Via ◽

Thermal Stress Analysis ◽

Analysis And Design

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Thermal stress analysis and failure mechanisms for through silicon via array

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231431 ◽

2012 ◽

Author(s):

Chi-Wei Kuo ◽

Hung-Yin Tsai

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Failure Mechanisms ◽

Through Silicon Via ◽

Thermal Stress Analysis

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Thermal stress analysis and design optimization of direct chip attach (DCA) and chip scale package (CSP) in flip chip technology

Engineering Optimization ◽

10.1080/03052150215718 ◽

2002 ◽

Vol 34 (6) ◽

pp. 591-611

Author(s):

D. S. Liu ◽

C. Y. Ni ◽

T. C. Tsay ◽

C. Y. Kao

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Design Optimization ◽

Flip Chip ◽

Thermal Stress Analysis ◽

Analysis And Design ◽

Chip Technology ◽

Chip Scale Package

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Thermal stress analysis and failure mechanisms for through silicon via array

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117254 ◽

2011 ◽

Author(s):

Chi-Wei Kuo ◽

Hung-Yin Tsai

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Failure Mechanisms ◽

Through Silicon Via ◽

Thermal Stress Analysis

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Thermal Stress Analysis of Cu/Low-k Interconnects in 3D-IC Structures

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312183 ◽

2006 ◽

Author(s):

M. C. Hsieh ◽

Yung-yu Hsu ◽

Chao-liang Chang

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

3D Ic ◽

Thermal Stress Analysis ◽

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Thermal Stress Analysis and Design of the Stator of a 300-MVA Superconducting Generator

IEEE Power Engineering Review ◽

10.1109/mper.1986.5527666 ◽

1986 ◽

Vol PER-6 (9) ◽

pp. 38-38

Author(s):

R. D. Nathenson ◽

J. Cherepko ◽

M. R. Patel

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Thermal Stress Analysis ◽

Analysis And Design

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The thermal stress analysis in 3D IC integration with TSV interposer

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474718 ◽

2012 ◽

Author(s):

Junwen Pang ◽

Jun Wang

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

3D Ic ◽

Thermal Stress Analysis

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Thermal Stress Analysis and Design of the Stator of a 300 MVA Superconducting Generator

IEEE Transactions on Energy Conversion ◽

10.1109/tec.1986.4765747 ◽

1986 ◽

Vol EC-1 (3) ◽

pp. 141-147 ◽

Author(s):

R. D. Nathenson ◽

J. Cherepko ◽

M. R. Patel

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Thermal Stress Analysis ◽

Analysis And Design

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Laser drilling and thermal stress analysis on TSV in 3D IC structure

2014 IEEE International Conference on Electron Devices and Solid-State Circuits ◽

10.1109/edssc.2014.7061250 ◽

2014 ◽

Author(s):

Hsiang-Chen Hsu ◽

Shih-Jeh Wu

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Laser Drilling ◽

3D Ic ◽

Thermal Stress Analysis

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Thermal-Stress Analysis of 3D-IC Based on Artificial Neural Network

2019 IEEE 4th International Conference on Cloud Computing and Big Data Analysis (ICCCBDA) ◽

10.1109/icccbda.2019.8725696 ◽

2019 ◽

Author(s):

Xue Yang ◽

Junyan Tan ◽

Biyan Zhou ◽

Di Hua ◽

Guangyi Tang ◽

...

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Thermal Stress ◽

Stress Analysis ◽

3D Ic ◽

Thermal Stress Analysis ◽

Artificial Neural

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Mechanical & Thermal Stress Analysis under Actual Condition and Test Design of 550kV High Coupled Split Reactor

2020 IEEE 4th Conference on Energy Internet and Energy System Integration (EI2) ◽

10.1109/ei250167.2020.9347258 ◽

2020 ◽

Author(s):

Li Zhao ◽

Yanzhe Zhang ◽

Tong Jiang ◽

Qiang Tang ◽

Haojun Liu ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Actual Condition ◽

Test Design ◽

Thermal Stress Analysis

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