Thermal stress analysis and design optimization of direct chip attach (DCA) and chip scale package (CSP) in flip chip technology

2002 ◽  
Vol 34 (6) ◽  
pp. 591-611
Author(s):  
D. S. Liu ◽  
C. Y. Ni ◽  
T. C. Tsay ◽  
C. Y. Kao
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Design Optimization ◽  
Flip Chip ◽  
Thermal Stress Analysis ◽  
Analysis And Design ◽  
Chip Technology ◽  
Chip Scale Package

Thermal stress analysis of the low-k layer in a flip-chip package

2016 ◽  
Vol 163 ◽  
pp. 78-82 ◽  
Author(s):  
L. Wang ◽  
C. Xu ◽  
L. Lin ◽  
C. Yang ◽  
J. Wang ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Flip Chip ◽  
Thermal Stress Analysis ◽  
Low K
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