$210^{\circ}\mathrm{C}$ reflow technology study in 3D Packaging

Author(s):  
Lingyao Sun ◽  
Yaru Dong ◽  
Zhuangzhuang Hou ◽  
Xiuchen Zhao ◽  
Yongjun Huo ◽  
...  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.


Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.


Author(s):  
Zhao Yongrui ◽  
Ma Hongbo ◽  
Bi Minglu ◽  
Huang Zhanwu ◽  
Jia Jun ◽  
...  

Author(s):  
Amin Rida ◽  
Li Yang ◽  
Napol Chaisilwattana ◽  
Scott Travis ◽  
Swapan Bhattacharya ◽  
...  

Author(s):  
Melaura Andree Erickson Tomaino ◽  
Alissa L. Greenberg ◽  
Sarah Ann Kagawa-Purohit ◽  
Sagui A. Doering ◽  
Edward Steven Miguel

AbstractSchools across the country closed their doors during the COVID-19 pandemic. These measures impacted all students, as schools, educators, and families grappled with the realities of transitioning to distance-learning platforms. The research on distance learning is still in its early phases. However, almost no research exists on educating students with severe disabilities and high behavioral needs using this technology. Study 1 collected survey data from students’ families and their educators on the feasibility and effectiveness of distance-learning programs when working with students with severe developmental disabilities and high behavioral needs. Results indicated that parents and educators had generally neutral attitudes toward distance learning, although educators agreed that their students were obtaining educational benefits during distance learning. Study 2 further examined the effects of a transition to distance learning on students’ Individualized Education Plan (IEP) goal progress. Analyses revealed that students maintained about half of the skills addressed in their IEPs and made progress on an additional quarter of their IEP goals. Findings contribute to a much-needed literature base on distance learning and provide additional information as to the feasibility and effectiveness of distance learning with students with severe developmental disabilities and high behavioral needs. Future work is needed to determine best practices for distance learning with this population.


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