Analysis of avionics failures, as a consequence of electrochemical migration

2021 ◽  
Author(s):  
Anton Sokolskiy
Keyword(s):  
Electrochemical Migration

PCB Related Field Failures with ImAg Surface Finishes

2007 ◽  
Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis
Keyword(s):  
Emerging Markets ◽  
Galvanic Corrosion ◽  
Electrochemical Migration ◽  
Copper Sulphide ◽  
Electronic Components ◽  
Related Field ◽  
Surface Finishes ◽  
Immersion Silver ◽  
Manufacturing Environments

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.

scholarly journals Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field

RSC Advances ◽  
2021 ◽  
Vol 11 (45) ◽  
pp. 28178-28188
Author(s):  
Xuan Liu ◽  
Ziheng Bai ◽  
Qianqian Liu ◽  
Yali Feng ◽  
Chaofang Dong ◽  
...  
Keyword(s):  
Magnetic Field ◽  
External Magnetic Field ◽  
Failure Mechanism ◽  
Printed Circuit Boards ◽  
Electrochemical Migration ◽  
Migration Behavior ◽  
Circuit Boards ◽  
Printed Circuit

Proposed failure mechanism of electrochemical migration under an external magnetic field caused by mold.

Impact of electric field at rough copper lines on failure time due to electrochemical migration in PCBs

2021 ◽  
Vol 117 ◽  
pp. 114035
Author(s):  
Georg Reiss ◽  
Barbara Kosednar-Legenstein ◽  
Johann Riedler ◽  
Werner Eßl
Keyword(s):  
Electric Field ◽  
Failure Time ◽  
Electrochemical Migration

In situ study the dependence of electrochemical migration of tin on chloride

2013 ◽  
Vol 27 ◽  
pp. 63-68 ◽  
Author(s):  
Xiankang Zhong ◽  
Guoan Zhang ◽  
Yubin Qiu ◽  
Zhenyu Chen ◽  
Wenxin Zou ◽  
...  
Keyword(s):  
Electrochemical Migration ◽  
In Situ Study

Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior

2021 ◽  
Vol 863 ◽  
pp. 158726
Author(s):  
Choong-Jae Lee ◽  
Dong-Gil Kang ◽  
Byeong-Uk Hwang ◽  
Kyung Deuk Min ◽  
Jinho Joo ◽  
...  
Keyword(s):  
Electrochemical Migration ◽  
Migration Behavior

Analysis of Dendrite Images Formed by Electrochemical Migration in a Semiconductor Sensor

2018 ◽  
Vol 916 ◽  
pp. 207-211 ◽  
Author(s):  
Manolo G. Mena
Keyword(s):  
Electrochemical Migration ◽  
Branching Pattern ◽  
Edx Analysis ◽  
Semiconductor Sensor ◽  
Grey Scale ◽  
Sensor Devices ◽  
Silver Dendrites ◽  
Branch Density ◽  
Tin Metal ◽  
Dimension Number

Dendrites were observed in the failure of semiconductor sensor devices. EDX analysis showed that the dendrites grown from bare sensor dice consisted of tin metal. The tin dendrites exhibited massive and dense branches. Dendrites grown from mechanically decapped parts consisted of silver. The silver dendrites exhibited delicate, lace-like structure. Binary and grey scale images of dendrites were analyzed for fractal dimension number and branch density. The tin dendrites had a higher, statistically significant branch density number than silver, due to tin’s more intricate branching pattern. Fractal numbers can be used to differentiate between tin and silver dendrites, even in the absence of EDX analysis equipment.

Sign in / Sign up

Export Citation Format

Share Document