The storage failure mode and failure mechanism study of high-power klystron

Author(s):  
Fangfang Song ◽  
Ruguang Li ◽  
Liyuan Liu ◽  
Yunfei En ◽  
Bin Li
2018 ◽  
Vol 39 (2) ◽  
pp. 180-187
Author(s):  
刘启坤 LIU Qi-kun ◽  
孔金霞 KONG Jin-xia ◽  
朱凌妮 ZHU Ling-ni ◽  
熊聪 XIONG Cong ◽  
刘素平 LIU Su-ping ◽  
...  

2015 ◽  
Vol 1792 ◽  
Author(s):  
Steve H. Kilgore

ABSTRACTProcess-induced defects in electroplated Au interconnect metallization on GaAs devices were detected during the course of reliability testing. Abnormally high lognormal sigma values (σ > 0.7) indicated the existence of a bi-modal failure mechanism. A distinct early lifetime failure mode was observed along with the intrinsic electromigration metallization wear-out failure mode. Physical characterization of the electroplated Au film revealed as-deposited nanoscale voids. Elimination of these voids through process improvement as well as suggested mechanisms for the early failures are discussed.


2012 ◽  
Vol 472-475 ◽  
pp. 3182-3187
Author(s):  
Jing Yang ◽  
Xiao Hui Wang ◽  
Yong Wu

High temperature, high humidity, corrosive substances in the air and a variety of fungus are devastating for the product, so how to correctly evaluate the impact of three defenses of the product is particularly important. Basing on the failure of the salt fog, humidity, and fungus, this paper will analyse the product’s failure mechanism and failure mode and then use fuzzy satisfactory optimization method to evaluate the product’s environmental adaptability in the humidity, salt fog and fungus condition.


2013 ◽  
Vol 462-463 ◽  
pp. 678-682
Author(s):  
Yue Zong Zhang ◽  
Chun Xia Li ◽  
Wen Bin Zhang

The paper is studied on the performances of low power light-emitting diode and high power LED under high-current. After observing and measuring the degeneration of them, the Analysis of the failure mechanism is given. The degenerations of the optical parameter, electronic parameter and thermal parameter of high power LED under 600mA current stress are measured and the failure mechanism is analyzed. The I-V characteristic curve proves that the degeneration is happened in active region. Under high-current stress, the active region of high power LED is ageing which leads to much more defects. The degenerations of pins on the resin package, metal wire and surface layer metal pads are found with scanning electron microscope.


2020 ◽  
Vol 88 (3) ◽  
Author(s):  
M. R. O’Masta ◽  
V. S. Deshpande

Abstract Composites comprising a high-volume fraction of stiff reinforcements within a compliant matrix are commonly found in natural materials. The disparate properties of the constituent materials endow resilience to the composite, and here we report an investigation into some of the mechanisms at play. We report experiments and simulations of a prototype laminated composite system comprising silicon layers separated by polymer interlayers, where the only failure mechanism is the tensile fracture of the brittle silicon. Two failure modes are observed for such composites loaded in three-point bending: failure under the central roller in (i) the top ply (in contact with the roller) or (ii) the bottom ply (free surface). The former mode is benign with the beam retaining load carrying capacity, whereas the latter leads to catastrophic beam failure. Finite element (FE) simulations confirm this transition in failure mode and inform the development of a reduced order model. Good agreement is shown between measurements, FE simulations, and reduced order predictions, capturing the effects of material and geometric properties on the flexural rigidity, first ply failure mode, and failure load. A failure mechanism map for this system is reported that can be used to inform the design of such laminated composites.


2002 ◽  
Author(s):  
Robert G. Ahrens ◽  
James J. Jaques ◽  
Niloy K. Dutta ◽  
Michael J. LuValle ◽  
Alfonso B. Piccirilli ◽  
...  

2015 ◽  
Vol 30 (5) ◽  
pp. 2427-2434 ◽  
Author(s):  
Wei Shi ◽  
Cheng Ma ◽  
Mengxia Li
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document