Low temperature atomic layer deposition of Ru thin films using a new carbonyl-based Ru precursor and non-oxidizing reactants; Applications to the seed layer for Cu metallization
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2015 ◽
Vol 27
(18)
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pp. 6322-6328
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2017 ◽
Vol 29
(15)
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pp. 6502-6510
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2012 ◽
Vol 4
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pp. 1008-1014
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2017 ◽
Vol 4
(18)
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pp. 1700123
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2009 ◽
Vol 12
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pp. D85
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